O V E R V I E W
Over the past twenty years, the electronic manufacturing industry has seen cleaning (defluxing) become more necessary and more challenging. Never before, has the removal of contamination from circuit assemblies been so important to a product's overall reliability. Increasing component and assembly densities, decreasing standoff heights, higher reflow temperatures, and increased reliability expectations have created a "perfect storm" that is driving manufacturers to seek cleaning solutions.
Join us in Rochester New York for a free one day cleaning workshop. Four industry experts from Aqueous Technologies, Zestron, Kester, and Austin American Technology join forces to present valuable solutions to cleaning's most challenging issues.
This free workshop will be presented free of charge at Rochester Institute of Technology, Rochester, NY. Lunch will be provided.
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Where:
Rochester Institute of Technology
1 Lomb Memorial Drive
Rochester, NY 14623-5603
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Contact
For more information, please contact:
Lisa Kocks
Aqueous Technologies Corporation
workshop@aqueoustech.com
909-291-1122 |
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Aqueous Technologies
Zestron
Kester &
Austin American Technology
P R E S E N T S
PCB Cleaning:
Challenges & Solutions
Register today for a valuable free cleaning workshop!
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| Once commonplace, the cleaning of post-reflow circuit assemblies became increasingly eliminated due to the popularity of no-clean fluxes in the late 1980's and early 1990's.
Today, component and assembly miniaturization, higher temperature reflow profiles, and increased reliability expectations have combined to reduce the volume of allowable contamination acceptable on an electronic assembly. The removal of flux and other process residues and cleanliness testing are among the fastest growing yet least understood processes in electronic assembly industry today.
This one-day technical workshop will answer many common questions about cleaning and cleanliness testing. The workshop is free but seat are limited. A continental breakfast and lunch will be provided.
Agenda:
PCB Cleaning: Challenges & Solutions
Kester - Zestron - Aqueous Technologies
Austin American Technology
June 26, 2012
Time Subject
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8:45
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Welcome & Introduction:
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9:00
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Peter Biocca, Kester
"Reliability Challenges Caused by Solder Paste & Flux Residue as well as Decreasing Pitch Width."
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10:00
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Break
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10:30
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Ravi Parthasarathy, Zestron
"Why clean PCB's?"
Industry trends & product reliability
Failure mechanisms
RMA, No-clean, OA
OA flux / paste - limitations of cleaning with DI H20
How clean is clean - surface analytics
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11:30
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Lunch & RIT Lab Tour
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1:00
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Michael Konrad, Aqueous Technologies
"Defluxing Equipment Best Practices and Roadmap
(Batch Focus)"
Machine configurations
Chemical management
Effluent management
SPC Data management
Operating cost analysis
SPC Data management
Cleanliness evaluation methods
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2:00
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Steve Stach, Austin American Technology
"Defluxing Equipment Best Practices
(In-line Focus)"
Optimizing the in-line process
Benefits of wash bath chemistry dosing system
Impact of evaporative loss and techniques to minimize
Effluent streams associated with chemistry cleaning process
How to manage cost effectively
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3:00
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Panel Discussion
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3:30
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Adjourn
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