ITC Call for Posters
 
Greetings!

 

Call for Posters

ITC2012, which will be held November 4 - 9 at the Disneyland Hotel in Anaheim California, is now accepting one-page abstracts for the poster session. These abstracts are used for the selection process, and will not be published.  The poster session will be held on the Exhibits Floor at the Disneyland hotel on Wednesday November 7, from 12 noon to 2 pm. 

 

Important dates are:

  • Submission Window Open: Now
  • Submission Deadline: Monday, July 16
  • Author Notification: Friday, Aug. 3
  • Final Posters Due: Monday Sept. 17
  • Final Posters for Conference: Friday, Oct. 5

 

Posters are a useful way of presenting late-breaking results, getting feedback on an innovative method, or participating  without having to write a full paper. Each poster should describe test-related innovations. Poster contributors must be present at their poster display to engage in technical discussions with the attendees.

The Poster Session is available to conference attendees and exhibitors, and is a good opportunity for exposure. Poster sessions in the past have been well attended and highly interactive. Successful poster submissions can be the basis for a future ITC conference paper. Acceptance as a poster does not preclude submission of a more complete treatment as an ITC paper in 2013 (and beyond). 

Feel free to base your abstract/proposal on any of the suggested topics in the right-hand column. We welcome ideas that are not on this list, and will give them equal consideration.

Please visit the ITC Website to submit abstracts/proposals or to view submission instructions. If you have any questions please contact Bill Eklow.

 

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Conference Focus Topics

  • Test- and Design-for-Manufacturability
  • Yield Analysis and Optimization
  • Embedded Instruments (BIST & DFT)
  • Reliability Screening
  • Low-Cost Test
  • Diagnosis and Silicon Debug
  • High-Speed I/O and RF Test
  • Probecard Design
  • Self-Repair and Fault Tolerance
  • System Test and False Positives
  • Experiments and Case Studies
  • Component-in-System Test

Hot Topics

  • 3-D/TSV (Through-Silicon Vias)
  • Adaptive Test
  • Board Test
  • Defect-based Testing
  • Innovative Industrial Test Practices
  • Fault Modeling, Simulation and Test
  • Power Issues in Test
  • Standalone Memory Test and Repair
  • ATE Hardware and Software
  • Online Test
  • Protocol-aware Test
  • Post-Si Validation
  • Test Resource Partitioning
  • Test Flow Optimization

Regular Topics

  • Automatic Test Generation
  • Boundary-Scan 
  • On-Chip Test Compression
  • Economics of Test
  • Fault Modeling and Simulation 
  • Online Test 
  • IDDQ and Current Test
  • Interface Issues
  • Microprocessor Test
  • Mixed-Signal and Analog Test
  • Multisite Test
  • System-in-Package and KGD Test
  • Test Standards
  • Test Quality and Reliability
ITC2012 Supporters, Sponsors, and Industry Alliances

These are the logos of our supporters, sponsors, and industry alliances. Click on any of these links to visit the websites of these great organizations.

 

Diamond 

Supporter:

Optimal Test

Platinum 

Supporters:

Advantest
Mentor

Silver 

Supporters:

AssetIDI

Bronze 

Supporter:

Qualcomm

Sponsors:

IEEEIEEE Computer Society
IEEE

Industry 

Alliance:

GSA
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