E-NEWSLETTER l Flex and Rigid-Flex

August 2023

President's Message, August 2023

One of the best things about working in this industry is the new trend towards information sharing. Now more than ever companies, or “friendly competitors”, are opening up to each other and sharing information that will be beneficial for the entire industry. Over the past few years American Standard Circuits has had the privilege of being part of that information network by sharing everything from webinars, columns, 77 second videos and most importantly, and perhaps most impactful, a series of eBooks.

This month we are pleased to highlight the newest edition to our book series The Companion Guide to…Flex and Rigid-Flex Fundamentals. With the launch of this guide, we have contributed even more information to help designers produce the most effective and manufacturable flex and rigid-flex designs.

Make sure you also check out our short article included in this edition of our monthly newsletter.

As always, we appreciate and thank you for your business.

Sincerely,

Anaya Vardya

President and CEO

American Standard Circuits

Our Latest 77 Second Webinars

View our latest 77 second videos. This month we continue our focus on Flex!

Separation Distance Between Flex Circuit Cores

When a product requires two or more cores, there is a need to define in the specification what the spacing requirements are between cores. The spacing can impact product performance (physical and electrical) and, most obviously, thickness. In some designs, the spacing between flex circuit cores may be filled with dielectric material, but with other designs the dielectric between flex cores in the flex area may be omitted in order to assure maximum flexibility.



If the core layers must be unbonded, this should be noted in the documentation. Those areas where bonding is to be avoided should be identified in the design artwork package. The unbonded areas must have a coverlayer applied to each exposed side. In laminated areas, it is not required, and arguably a liability, when considering reliability for plated through-holes in the assembly process. Obviously, in areas where interconnection is required between multiple layers of internal circuits, the dielectric properties and thickness is critical.



Come visit us at the following events!

Our on demand webinars are accessible at any time, any where!

With topics including Materials, RF/Microwave, IMPCB/MCPCB, Flex/Rigid Flex, Thermal Management, Fundamentals, Specialty, and Embedded Passives, there is something for everyone! Check them out here.

Download a copy of The Printed Circuit Designer's Guide to Flex and Rigid Flex Fundamentals