CHIPS and Science Act: Update
Details of Phase II of the CHIPS Act were released on June 23rd. Phase II focuses on specialized equipment integral to the manufacturing of semiconductors and subsystems that enable or are incorporated into the manufacturing equipment. Specific examples of semiconductor manufacturing equipment include but are not limited to: (1) deposition equipment, including Chemical Vapor Deposition, Physical Vapor Deposition, and Atomic Layer Deposition; (2) etching equipment (wet etch, dry etch); (3) lithography equipment (steppers, scanners, extreme ultraviolet); (4) wafer slicing equipment, wafer dicing equipment, and wire bonders; (5) inspection and measuring equipment, including scanning electron microscopes, atomic force microscopes, optical inspection systems, and wafer probes; (6) certain metrology and inspection systems; and (7) ion implantation and diffusion/oxidation furnaces.
There are three types of CHIPS Incentives:
• Direct Funding: which provides funding to the applicant for eligible costs and can take the form of grants, cooperative agreements, or other transactions;
• Loans: which are direct loans from the Federal government to the applicant for eligible costs;
• Loan Guarantees: which are Federal guarantees of third-party loans to the applicant for eligible costs.
To learn more visit: NIST CHIPS Notice
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