Ultra HDI e-bulletin -- June 2023

ASC now has the capability to fabricate ultra HDI technology, providing feature sizes well below what is achievable with traditional subtractive etch processing. We are reaching out to industry experts to ask for their opinions and advice on how to best take advantage of these new capabilities.

Ultra HDI Design Capabilities
May 2023 Ultra HDI e-bulletin
Featured Interview

John Watson, CID has had a career spanning over 44 years in electronics, with 24 of them working in the PCB design/engineering field. John has worked with several companies including Teledyne API, Emerson Computer Power, and Legrand Corporation, and proudly served in the US Army in the Military Intelligence field. Presently, he works as a Customer Success Manager with Altium. He trains and mentors new customers on the company tools and the PCB process, working alongside companies to improve their proficiency with the company’s electronics product design platform and the overall quality PCB design process. John is a College Professor at Palomar College in San Marcos, CA teaching basic and advanced PCB design in the 32-week program. He is an author and writer for various Blogs, White Papers, and is a Monthly columnist for IConnect-007 magazine. John is the author of two Library and Data Management books and a Speaker/ Lecturer in the USA, Europe, and Asia. This includes being a guest speaker at University of the Philippines- College of Engineering. John is on the PCEA (Printed Circuit Engineering Association) Committee- Next-Gen Core Team- developing ways to mentor future PCB designers. 

Industry awareness of ultra HDI is growing, and a significant share of the market is looking into designing with these ultra-fine features. Why do you feel that this new technology is important to the industry?


In electronics, change is inevitable, but Ultra HDI takes it to a new level.

 

Smaller Devices:

Ultra HDI allows electronic devices to become smaller and more compact. This means we can have sleeker smartphones, wearables, and other gadgets that fit comfortably in our hands or pockets. But with smaller devices come other issues, such as heat dissipation and power consumption that need to be considered.


Better Performance:

Ultra HDI improves the performance of electronic devices. It enables faster data transfer, reduces delays, and allows for high-quality multimedia content. This means we can enjoy smoother gaming experiences, faster internet browsing, and better video and audio quality.


More Features:

With Ultra HDI, devices can have more advanced features and capabilities. Manufacturers can include powerful processors, memory chips, sensors, and communication modules in smaller devices. This means we can have devices that do more, like smartphones with better cameras and augmented reality capabilities.


Reliable Connections:

Ultra HDI helps maintain a strong and reliable connection between different parts of electronic devices. It minimizes signal problems, noise, and disruptions, ensuring that our devices work consistently and without interruptions.

 

Advancements in Manufacturing:

Ultra HDI technology pushes the boundaries of manufacturing processes. It drives innovation and improves how electronic components are built, leading to more efficient and precise manufacturing techniques.


What key information points are critical to shortening the cycle for adoption - to more quickly begin taking advantage of the benefits of ultra HDI?


A couple of the major areas that must be considered are the Design and Manufacturing Considerations and that pesky thing called Cost.


Design and Manufacturing Considerations:

Understand the design and manufacturing considerations specific to Ultra HDI technology. This includes layer count, micro vias, fine trace widths, and specialized materials. Gain insights into design software, simulation tools, and fabrication techniques that support Ultra HDI implementation. This knowledge will help optimize the design process and streamline manufacturing.


Cost-Benefit Analysis:  

Conduct a thorough cost-benefit analysis to understand the financial implications of adopting Ultra HDI. Consider factors such as initial investment, design complexity, manufacturing costs, and potential returns on investment. Highlight the long-term benefits, such as improved product performance, reduced size, and enhanced market competitiveness.  

 

Risk Mitigation:

Address potential risks and challenges associated with Ultra HDI adoption upfront. This may involve considering supply chain stability, availability of qualified manufacturing partners, potential learning curve for design and manufacturing, and potential impact on time-to-market. Develop strategies to mitigate risks and ensure a smooth transition.  


As a Design expert that has navigated through multiple waves of technology advancements, what advice to you have for those who are looking at learning new techniques?


Build a Solid Foundation

Begin with a thorough understanding of basic electronics and PCB design principles: concepts such as circuitry, signal integrity, high-speed design, and manufacturing processes. This will give you a solid understanding of the fundamentals before diving into Ultra HDI-specific techniques.

 

Research and Study

Stay updated with the latest industry trends, advancements, and resources related to Ultra HDI technology. Read technical articles, research papers, and industry publications to learn about the latest techniques, design considerations, and manufacturing processes. Online forums and communities can also be valuable sources of information and discussion.

 

Training and Courses

Look for training programs, workshops, or courses focused on Ultra HDI. Industry associations, educational institutions, or technology companies may offer these. Such programs can provide hands-on experience, expert guidance, and a structured learning environment. One of the best organizations for that is SMTA.

 

Collaborate and Network

Engage with professionals in the field of Ultra HDI technology. Attend industry conferences, workshops, or webinars to network with experts and fellow enthusiasts. Engaging in discussions, asking questions, and seeking guidance from experienced individuals can broaden your knowledge and provide valuable insights.

 

Continuous Learning 

Ultra HDI technology is constantly evolving. Stay curious and keep learning. Follow industry blogs, forums, and newsletters to stay updated on the latest advancements, emerging techniques, and best practices. Embrace a continuous improvement mindset and be open to adapting to new developments.


What are your outside interests - the hobbies that help you reboot?


I enjoy camping and outdoor activities, including hiking and cycling. I am constantly either reading or writing. 

ASC Capabilities
Technology Highlight

The future is here, today!


ASC is enhancing our Ultra HDI capabilities:


  • Installation of Excellon Cobra-II laser drill
  • Ultra HDI laser via capabilities
  • Ability to plate ultra HDI vias closed
  • ENEPIG process in house

Ask how we can enable new Design freedoms for your work on Defense, Medical, and Commercial applications:


Contact John Johnson at jjohnson@asc-i.com

Frequently Asked Questions

Q: Cost: how does A-SAP™ compare to subtractive etch?


A: A-SAP™ has potential to lower costs. One primary benefit of ultra HDI is the ability to reduce layer count, reduce lamination cycles and reduce the complexity of the PCB design. While A-SAP™ processing costs can be higher than subtractive etch, the overall simplification of the design may reduce total costs or provide added functionality within a similar cost structure.



Our Experts are one reason why American Standard Circuits is North America's leading independent PCB fabricator. Our entire experienced and professional team is ready and able to make your next PCB project a reality!
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