E-NEWSLETTER l RF/Microwave
January 2023
A MESSAGE FROM OUR CEO

First, Happy New Year! We are looking forward with great optimism to bringing you the very best PCB solutions in 2023.

Second, if you haven’t heard yet we have launched a completely new division called ASC Global Sourcing headed by global supply chain management guru Bob Duke. We have expanded our global sourcing offerings to include wire harness and cable assembly, molded plastics and metals, batteries, as well as numerous other products and services that we anticipate our customers needing. We will be telling you more about this in future newsletters so stay tuned!

We have further expanded our RF and thermal capabilities to include Copper Coin technology for increased thermal management. This technology is recommended for PCBs where increased interconnection density is required for more stable electrical performance and reliability when performing in high power environments. ASC is one of the few North American PCB suppliers now providing this technology of the future. Read more on Copper Coin technology in this newsletter and do not hesitate to contact one of our in house experts if you feel this might be the right technology for your PCB needs. Once again this was a case of not only listening but more importantly hearing when our customers expressed a need for this technology.

Thank you again for reading our newsletter and most importantly, thank you for your business.

Sincerely,

Anaya Vardya
President and CEO
American Standard Circuits

Embedded Coin Technology

Embedded coin technology is quickly becoming a preferred alternative to internal heatsinks to draw heat directly down and away from the heat generating device to the backside of the PCB. There are three basic types (shapes) of embedded coins in common use today; U-Coin, T-Coin and I-Coin. When designing, it is always preferred that the top and bottom of the coin be in a positive or near neutral position relative to the top and bottom of the PCB. On the bottom, this ensures that intimate contact can be made with any external heat sinking or thermal dissipation device.
Most practical applications where coins are employed use a coin which is bonded into the structure during the multilayer lamination process. In this case, the coin is bonded into place and sealed by the flow of the prepreg resin which is adjacent to the coin at the time of lamination. The result is a securely mounted, but electrically isolated coin. Ground connections can be accomplished with vias through a flange in the coin or the cap plating on the top and bottom of the coin. 
 
When designing, it is always preferred that the top and bottom of the coin be in a positive or near neutral position relative to the top and bottom of the PCB. 

Upcoming Webinars

Flex/Rigid Flex 101

Wednesday February 15th at 11am Central Time

Flex and rigid flex are a significantly growing portion of the global PCB market. Presented by Geoffrey Leeds, Insulectro Flex Product manager, we will cover the basics of Flex / Rigid Flex circuits.
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Flex and Rigid-Flex Fundamentals

Fundamentals of RF/Microwave PCBs

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Thermal Management: A Fabricators Perspective                 
Our Experts are one reason why American Standard Circuits is North America's leading independent PCB fabricator. Our entire experienced and professional staff is ready and able to make your next PCB project easy!
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