The patented LCS2™ is designed to prevent thin semiconductor components from migrating out of the pockets of waffle pack chip trays during shipping and handling. The LCS2™, designed to work with industry standard waffle pack trays, consists of pad and interleaf materials integrated into a static dissipative gold lid along with a highly engineered single piece gold clip that uniformly compresses the tray and lid together to seal each waffle pack pocket. This Lid/lip system is proven to eliminate thin die migration issues
The bioinspired Textured Film Carrier products mimic the adhesive forces of biometric structures found in nature to hold components in place using a unique micro-texture. The film is ideal for in-process handling and shipping of packaged components and can be laminated to a JEDEC standard or customer-supplied carrier.