BRIDG Monthly Newsletter | July 2019
Chester Kennedy Headshot
In case you missed our latest news, BRIDG is excited to partner with Tokyo Electron (TEL) to drive 200mm processing technology to the next level. As a global leader in the development and manufacturing of state-of-the-art equipment used to manufacture semiconductor devices – Technology Enabling Life – TEL is focusing on enhancing 200mm tool offerings and plans to leverage BRIDG’s facility and open environment to demonstrate the industry-leading capabilities of their latest equipment.

As described in the feature below, TEL will install several new pieces of equipment at BRIDG, and our teams will jointly develop innovative processes designed to unlock the full potential of those tools. With the emergence of 5G and IoT devices challenging the limits of current 200mm wafer manufacturing, the collaborative environment at the BRIDG facility offers the perfect opportunity for TEL to showcase their capabilities to US-based customers, while also allowing BRIDG to operate the tools and enhance our offerings to customers through the new capabilities enabled by this equipment.

Perhaps most exciting of all are the advantages this agreement brings to not only BRIDG and TEL, but also to our many respective customers who will directly benefit from our collective contributions toward solving industry’s core challenges. TEL has already established a small technical team at NeoCity, and we look forward to working hand in hand with them as the partnership grows.

Meanwhile, our business development and technical teams are busy completing proposals for multiple federal opportunities due next month, and we are all anxiously preparing for our upcoming office move. The completion of the Class A office building, located adjacent to our fab, presents a great opportunity for BRIDG. With the majority of our staff transitioning into the new building, the space currently being used for office space within the fab will be available to convert into much-needed lab space for our growing list of partners.

We will share more on the move in next month’s newsletter. Until then, please join us as we build the future here in NeoCity!

Chester Kennedy
BRIDG Announces Partnership with Tokyo Electron
In case you missed it, we announced our newest strategic partnership with Tokyo Electron (TEL) during the start of SEMICON West earlier this month. Working together at NeoCity, BRIDG and TEL will develop the tool and process technology required to further enable collaborative approaches for development-to-commercialization of technologies and applications that accelerate commercialization of emerging technologies.

With 200mm processing requirements growing fast, leading edge tools and process technologies developed for the 300mm market need to be applied to 200mm tools. This partnership will enable necessary advances in 200mm processing technology.

“With the adoption of IoT, AI, and 5G, the transition to a data society is accelerating and propelling us closer to a future beyond imagination, a future that will require customization in communications, mobility, healthcare, and robotics technology. BRIDG is building a 200mm R&D infrastructure and platforms that enable this dynamic future,” says Tony Tsutsumi, TEL Senior Vice President for Corporate Innovation. “TEL is excited to partner with BRIDG as we develop leading edge tool, process, and integration technology for our customers.”

Read the full press release here.
BRIDG exhibited alongside our partners from the Orlando Economic Partnership at SEMICON West, the largest semiconductor industry tradeshow in the United States. The conference provided the perfect opportunity to connect with high tech leaders from across the nation and share how BRIDG can connect industry challenges to innovative solutions. Thank you to all who spent time with us at the show!

NeoCity Update
We’re just weeks away from moving into the new office building! Check out the latest photos below.
IMAPS | August 21, 2019
Together with the Florida chapter of the International Microelectronics, Assembly and Packaging Society (IMAPS), BRIDG will be co-hosting the third annual Advanced Technical Workshop and Tabletops event entitled “Smart Sensors, Research, Manufacturing and IoT Applications” at BRIDG on August 21st. Co-chaired by Dr. Amit Kumar (Associate Director, Technology Development & Device Integration, BRIDG) and C. Mike Newton (Director of Electronic Packaging & Cyberfacturing Center, nScrypt Inc.), this day-long event brings together those working in the areas of smart sensors, systems and advanced packaging technology to enable discussion and presentations on the latest semiconductor-based design, process, and materials for smart sensor and photonic technologies. For more information or to register, click here.
  BRIDG is located at NeoCity in Osceola County, Florida.