Beneath the AVS Surface Member News & Updates |
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Call for Awards Nominations |
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Recognition of outstanding scientific research and technological innovation is an important activity within AVS. Do you know people in areas of interest to AVS who should be recognized?
AVS awards have been updated to reflect the diversity of the Society, and we are looking for a diverse nomination pool from all work environments, including industry. AVS awards recognize and honor a wide range of extraordinary accomplishments vital to progress in fields of interest to AVS.
NOMINATE A PEER OR COLLEAGUE for a National Award. After all a potential nominee may not seem like a traditional AVS awardee, but innovation is a hallmark of AVS. Strong nomination packages come from thinking outside the box!
Questions? Please contact Angela Klink, AVS Member Services Administrator, [email protected]
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Etching Approach Expands Applications for High Precision Nanoscale Pattern Transfer |
Authors: Kang-Yi Lin, Christian Preischl, Christian Felix Hermanns, Daniel Rhinow, Hans-Michael Solowan, Michael Budach, Hubertus Marbach, Klaus Edinger, and G.S. Oehrlein
Journal of Vacuum Science & Technology A, Vol. 41, No. 1, Jan/Feb 2023
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Gas mixtures in remote plasma enable controlled electron beam-induced etching on silicon dioxide, silicon nitride, and poly-Si
Semiconductor chips rely on precise patterns etched onto their surface. Plasma-enhanced atomic layer etching achieves control and selectivity, both important factors in etching. However, plasma-related ion bombardment causes erosion and defects on the substrate. Electron beam-induced etching (EBIE) is an alternative to plasma dry etching that mitigates the damage through the electron-neutral synergistic effect. Yet conventional EBIE applications are limited by the few molecules available that fit precursor criteria.
Researchers from the University of Maryland and Carl Zeiss SMT GmbH investigated methods to facilitate precise and effective dry etching with increased flexibility of possible materials. Their publication in AVS’s Journal of Vacuum Science & Technology A builds upon previous work highlighted in December’s issue of Beneath the AVS Surface, which combined electron beam bombardment with remote plasma to achieve localized nanoscale etching. Their more recent publication demonstrates that gas mixtures in remote plasma-enabled silicon dioxide etching without the same limitations seen in conventional EBIE, like achieving materials selective etching.
Plasma dry etching often involves low-energy ion bombardment. When momentum transfers from ions to the surface atoms, atomic displacements cause surface defects. EBIE avoids these defects.
“Electron beam-induced etching exploits the light mass of electrons. Energy transfer to surface atoms takes place by electronic processes, which can result in desorption of functionalized surface atoms but does not cause non-specific atomic displacement,” said author Gottlieb Oehrlein.
Still, conventional EBIE is not always practical because it is limited by the demands on precursor molecules, which must be highly reactive with a high absorption rate and chemically specific. The authors circumvented this limitation to expand the range of possible surface chemical modifications.
“The new etching approach consists of an electron flood gun installed on the top of the reactor as an electron source and a remote plasma source installed at the side port of the reactor as a radical source,” said Oehrlein. “The combination allows independent control over reactive particle fluxes to the surface for surface functionalization and energy, flux, and spatial location of electrons for surface activation to enable electron beam-induced etching. The use of gas mixtures allows us to apply plasma chemical methods to flexible surface functionalization that is not possible in conventional EBIE.”
The researchers investigated the etching rates of silicon dioxide, silicon nitride, and poly-Si on the parameters of the flood gun and gas composition fed to the remote plasma source. Argon, tetrafluoromethane, and oxygen were used as the precursor molecules and the results were measured with an angle-resolved X-ray photoelectron spectroscopy analysis of the etched surfaces.
By combining different electron fluxes and precursor molecule mixtures, the authors were able to optimize the materials etching selectivity of the dry etching approach.
“This approach is a generic method that answers many important current challenges in atomic scale fabrication,” said Oehrlein.
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Low-Cost Testing Strips Achieve Ultrasensitive Oral Cancer Detections
Authors: Minghan Xian, Jenna L. Stephany, Chan-Wen Chiu, Chao-Ching Chiang, Fan Ren, Cheng-Tse Tsai, Siang-Sin Shan, Yu-Te Liao, Josephine F. Esquivel-Upshaw, and Stephen J. Pearton
Journal of Vacuum Science & Technology B, Vol. 41, No. 1, Jan/Feb 2023
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Modified glucose test strips can identify cancer biomarkers at concentrations six orders of magnitude lower than existing methods.
Oral squamous cell carcinoma (OSCC) is one of the most common types of oral cancer. It occurs on the outermost layer of oral tissue and affects tens of thousands of people in the United States alone. The gold standard for identifying the presence of OSCC is a histological test, which requires a biopsy. This is invasive, costly, and takes several weeks for results.
A simpler screening method involves collecting a cheek swab and testing for certain biomarkers, such as Cancerous Inhibitor of protein Phosphatase 2A (CIP2A). This protein blocks the cancer-fighting enzyme Phosphatase 2A and its presence can be used to identify several cancers, including OSCC.
In the AVS Journal of Vacuum Science & Technology B, researchers from the University of Florida and National Yang Ming Chiao Tung University developed a transistor-based biosensor module capable of rapid detection of CIP2A.
Detecting the CIP2A biomarker commonly involves an enzyme-linked immunoassay (ELISA). This test requires a central laboratory, resulting in a lengthy turnaround time for results. It is also costly and not sensitive to very low concentrations of CIP2A.
“By utilizing our transistor-based sensing technology, we have demonstrated cancer detection on the pure oral cancer protein and cell lysate containing these proteins with orders of magnitude higher sensitivity than existing methods,” said author Minghan Xian.
The authors constructed their biosensor out of commercially available glucose test strips that they modified by adhering CIP2A antibodies to their surfaces. These antibodies bind with CIP2A proteins and alter the capacitance of the resulting circuit. The team designed a printed circuit board to send a pulse voltage and amplified the resulting signal using a MOSFET. The analog signal was then converted to a digital readout for detection.
“Our methods utilized a circuit board to amplify the sensing signal by orders of magnitude before we make the detection,” said Xian.
The researchers used pure CIP2A protein and cell lysate containing CIP2A to test their method. They demonstrated a detection sensitivity as low as one femtogram of protein per milliliter of solution, a full six orders of magnitude more sensitive than an ELISA kit. They plan to further their results with more practical tests and additional applications.
“With these results currently demonstrated on oral cancer protein and cell lysate, we plan to obtain actual disease-state oral cancer patient samples to perform further analysis,” said Xian. “At the same time, we plan to expand our testing to other cancer types, such as breast and skin cancer.”
This paper is a part of the Special Topic Collection Honoring Dr. Gary McGuire’s Research and Leadership as Editor of the Journal of Vacuum Science & Technology for Three Decades. Read more articles from this collection here.
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Smart DNA Nanogel Coated Polydopamine Nanoparticle with High Drug Loading for Chemo-photothermal Therapy of Cancer
Authors: Shiyu Zang, Xunxun Deng, Jiamian Wang, Yanqiu Zhao, and Shuo Wu
Publication: Biointerphases 17, 061006 (2022)
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Newest Addition to the Special Topic Collection on Materials for Energy and the Environment in Surface Science Spectra
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Near ambient pressure–x-ray photoelectron spectroscopy (NAP-XPS) is a less traditional form of XPS that allows samples to be analyzed at relatively high pressures, i.e., at greater than 5000 Pa. NAP-XPS can probe moderately volatile liquids, biological samples, porous materials, and/or polymeric materials that outgas significantly. This submission shows the survey, Li 1s, S 2p, C 1s, N 1s, O 1s, and F 1s NAP-XPS spectra of a Li-based electrolyte solution, which is a material that would be difficult to analyze by conventional XPS. The measurements were performed at 200 Pa in ambient gas atmosphere to compensate for surface charging. Peak fits of the C 1s, O 1s, and F 1s narrow scans are also presented.
The Special Topic Collection on Materials for Energy and the Environment is open to all techniques published in SSS so consider submitting your XPS, AES, ToF-SIMS, SE, UV-vis, or LEIS data to this Special Topic Collection. Technique-specific templates and other submission information can be found here. |
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Gravitational Time Dilation in Extended Quantum Systems: The Case of Light Clocks in Schwarzschild Spacetime
Authors: Tupac Bravo, Dennis Rätzel, and Ivette Fuentes
Publication: AVS Quantum Sci. 5, 014401 (2023)
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AVS Journals Announcements and Open Topics - Calls for Papers |
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AVS Quantum Science (AQS):
JVST A:
JVST B:
Biointerphases:
Surface Science Spectra (SSS):
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2nd AVS Quantum Science (AQS) Workshop |
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By Charles R. “Chip” Eddy, Jr., Science Director - Power & Energy, Materials, Office of Naval Research Global - London
The 2nd AVS Quantum Science (AQS) Workshop was held January 19-20, 2023, in conjunction with the Physics and Chemistry of Materials and Interfaces Conference held in Redondo Beach, California, January 15-19, 2023. The AQS Workshop focused on challenges and opportunities for the science of materials, surfaces, and interfaces to advance quantum technologies and was organized by long-time AVS Quantum Information Science (QIS) Focus Topic champions Dr. Vivek Adiga (formerly with IBM) and Dr. Rachael Myers-Ward (U.S. Naval Research Laboratory). Vivek and Rachael have spearheaded the QIS Focus Topic program at AVS International Symposia since 2018 and have recently transferred that opportunity to Dr. Sebastian Engleman (IBM) and Dr. Dave Pappas (Rigetti Computing).
The AQS Workshop featured 13 invited speakers and a number of mini-discussion sessions. The speakers were organized into three major categories: Quantum Sensing, Quantum Computing, and Quantum Materials.
In each collection of talks, leaders in the quantum S&T community from academic, national laboratories, and industry from the U.S. and Europe, shared their latest research and highlighted the materials, surfaces and interface challenges and opportunities in their quantum science sub-field. These invited talks were structured to permit an extended question, answer, and discussion period at the end. Further, mornings and afternoons held brief general rump sessions for deeper discussions among participants.
The speakers and their talk titles were as follows:
Quantum Sensing:
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Erika Janitz‚ Christian Degen (ETH Zürich‚ Switzerland): Quantum Sensing with NV Centers
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Victor Acosta‚ Yaser Silani (University of New Mexico): Diamond Quantum Sensors: Sensitivity Frontier
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Jennifer M. Schloss‚ Justin Mallek‚ Dane W. deQuilettes‚ Eden Price‚ Linh Pham‚ John F. Barry‚ Matthew Steinecker‚ David F. Phillips‚ Danielle A. Braje (Massachusetts Institute of Technology Lincoln Laboratory): Engineering Diamond for Quantum Sensing
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Ron Walsworth (University of Maryland): Quantum Diamond Sensors — Best of Both Worlds
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Hannes Kraus‚ Andreas Gottscholl‚ Corey J. Cochrane (Jet Propulsion Laboratory): Spin-Carrying Quantum Centers in Wide-Band Gap Semiconductors as Magnetometry Sensors for Space Applications
Quantum Computing:
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Jared Hertzberg (IBM Research): Laser-Annealing Josephson Junctions to Achieve Scaled-Up High-Performance Superconducting Quantum Processors
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David Pappas‚ Ella Lachman‚ Josh Mutus (Rigetti Computing); Chris Palmstrom (University of California Santa Barbara): Progress Towards Merged-Element Transmons
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Kristen Pudenz (Atom Computing): A Neutral Atom Quantum Processor Supporting Long Coherence Times
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Joel Q. Grim‚ Allan S. Bracker‚ Joseph D. Hart (Naval Research Laboratory); Samuel G. Carter (Laboratory of Physical Sciences); Chul Soo Kim (Naval Research Laboratory); Mijin Kim (Jacobs); Ian Welland‚ Kha Tran‚ Igor Vurgaftman‚ Tom L. Reinecke‚ Andrew Yeats (Naval Research Laboratory): Scalable Integrated Quantumdotnetworks and Nanophotonic Neuromorphic ‘Brain-Inspired’ Computing
Quantum Materials:
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Luis A. Jauregui (University of California Irvine): Topological Materials‚ a New Quantum State of Matter
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An-Ping Li (Center for Nanophase Materials Sciences‚ Oak Ridge National Laboratory): Probing Topologically Protected Quantum States with Scanning Tunneling Microscopy
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Nathan P. Guisinger (Argonne National Laboratory): Artificial Graphene Nanoribbons with Tailored Topological States
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Tongcang Li (Purdue University): Quantum Sensing and Nuclear Spin Control with Spin Defects in a 2D Material
The extended discussion identified key opportunities for each sub-field.
- For point defect complexes in diamond and SiC suitable for sensing, key challenges include: control of defect center location and number, tunability of diamond NV center host properties including ultra-low and uniform strain, and normalization/standardization of fabrication/processing/characterization methods.
- For Josephson Junctions suitable for computing, key challenges include: a better understanding and control of the superconductor/insulator interface, all-epitaxial growth of superconductor/insulator/superconductor junctions, reproducible and stable fabrication, qubit frequency tuning at milli-Kelvin temperatures, and improved stability of qubit properties over time.
- For cold atom traps suitable for computing, a significantly improved vacuum level and stability was highlighted as a needed key advancement.
- For advanced topological materials for quantum applications, challenges include: improved understanding of surface states and improved surface stabilization.
- For 2D materials, challenges include: understanding/exploration of edge states in laterally confined 2D materials and exploration of hexagonal BN defects and structures to enhance their brightness.
It should be noted that the PCSI Program Committee (led by Dr. Holger Eisele from Otto-von-Guericke-Universität Magdeburg and Prof. Chris Palmstrom from UCSB) held a session entitled “Spin Dynamics for Quantum Sensing” at the end of their conference which provided an excellent lead into the opening Quantum sensing sessions of the workshop.
It is anticipated that each of the 13 workshop speakers will be invited to contribute a manuscript related to the subject of their talk to an upcoming Special Topic Collection in AVS Quantum Science journal later in 2023. Keep an eye out for this collection!
The organizers wish to extend their sincere appreciation to all of the speakers, the numerous participants who contributed to the lively discussion, the PCSI organizers, and to the AVS Staff for making such a successful workshop possible!
The 3rd AQS Workshop is currently planned to be held in conjunction with the AVS 69th International Symposium & Exhibition in Portland, Oregon this November 5-10, 2023. The topic will be announced in the near future. We hope to see you there!
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AVS National Online Short Course Program (March 2023) |
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March 13-24, 2023
Virtual Platform: Zoom
Time: 10:00 a.m.-5:00 p.m. ET
AVS developed an online training program for technicians, scientists and engineers during COVID-19 with great success and reduced fees! As our community has greatly enjoyed these online training opportunities and many are still unable to travel due to restrictions, we are continuing our online training program and are pleased to offer eight (8) AVS Short Courses and our qualified instructors to you via Zoom for our AVS National Online Short Course Program!
Cleaning and Surface Conditioning Techniques for Integrated Circuit Manufacturing
Monday-Tuesday, March 13-14, 2023
Atomic Layer Etching
Wednesday, March 15, 2023
Instructor: Steve George, Professor, Dept. of Chemistry and Biochemistry, University of Colorado at Boulder
Sputter Deposition
Thursday, March 16, 2023
Instructor: Angus Rockett, Head for Dept. of Metallurgical and Materials Engineering, Colorado School of Mines
UHV Design and Practices
Date: Friday, March 17, 2023
Instructor: Tim Gessert, M anaging Member, Gessert Consulting, LLC
Vacuum Pumps: An Introduction to their Operation and Maintenance
Monday, March 20, 2023
Instructor: Tim Gessert, Managing Member, Gessert Consulting, LLC
Plasma Etching and RIE: Fundamentals & Applications
(1 or 2 day option: Day 1-Fundamentals; Day 2-Applications)
Tuesday, March 21, 2023 (Day 1: Fundamentals) and Wednesday, March 22, 2023 (Day 2: Applications)
Instructor: Randy Shul, Technical Staff (Retired), Sandia National Laboratories
Essentials of Accurate and Reliable Surface Analysis using X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES)
Thursday, March 23, 2023
Instructor: Kateryna Artyushkova, President, Physical Electronics, Inc
Partial Pressure Analysis with Residual Gas Analyzers
Friday, March 24, 2023
Instructor: Gerardo Brucker, Chief Scientist and CTO, Granville-Phillips Division of MKS Instruments
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66th Annual SVC Technical Conference |
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May 6- 11, 2023
Washington D.C.
Technical Program May 8-11
Featuring the very latest industrial and technical advances in Thin Films, Coatings, and Surface Engineering Plus! Interactive Networking Forums, Discussion Groups, and Social Events.
Free Conference Admission on May 9 and 10.
Education Program May 6 -11
Problem solving tutorials taught by the world’s leading experts in vacuum technology, thin film science, and surface engineering.
Technology Exhibition May 9-10
Over 150 exhibiting companies dedicated to vacuum coating technologies. Plus, free Exhibition Admission, Exhibit Hall Presentations, and Social Networking Events.
Overview
The 2023 SVC TechCon in Washington, D.C. focuses on the essential role that Thin Films, Coatings, and Surface Engineering play in the products and services that drive our daily lives. The SVC represents the latest technologies, manufacturing methodologies, and business insights, supporting a global group of stakeholders. Highlighted by prominent Keynote presentations and invited speakers, the TechCon offers an engaging podium for contributed talks & posters as well as roundtable discussions and other interactive features addressing the following themes:
- Atomic Layer Processing
- Coatings and Processes for Biomedical Applications
- Coatings for Energy Conversion and Related Processes
- Digitalization/Simulation
- Emerging and Translational Technologies for Automotive Applications
- High-Powered Electron Beam Technology
- High-Powered Impulse Magnetron Sputtering (HiPIMS)
- Large-Area Coatings
- Optical Coatings
- Plasma Processing and Diagnostics
- Process Monitoring, Control, and Automation
- Protective, Tribological and Decorative Coatings
- Thin Film Sensors
- Thin Film Superconductors
- Exhibitor Showcase
- WebTech Roll-to-Roll Coatings
The SVC TechCon provides the forum where researchers, technologists, innovators, business leaders, decision makers and newcomers to the field can connect, exchange ideas and gain knowledge. An industry-leading Exhibit, Technical Program, and Education Program complement each other for exceptional attendee value. The Washington, D.C. venue is an industry favorite, offering both professional networking as well as recreational value in a relaxed atmosphere. We are looking forward to seeing you in Washington, D.C. in 2023!
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49th International Conference on Metallurgical Coatings & Thin Films (ICMCTF 2023)
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May 21-26, 2023
Town and Country Resort and Conference Center
San Diego, California
The 49th International Conference on Metallurgical Coatings and Thin Films (ICMCTF 2023) is the premier international conference in the field of thin film deposition, characterization, and advanced surface engineering promoting global exchange of ideas and information among scientists, technologists, and manufacturers. Attendees from all over the world come to present their findings, exchange ideas, share insights, make new friends, and renew old acquaintances.
ICMCTF 2023 will include more than 90 high-profile invited speakers, in over 50 sessions, across fourteen technical and topical symposia. There will be several special interest talks and featured lectures, as well as focused topic sessions, short courses, an equipment exhibition, an awards program, and daily social networking events.
Short Courses:
Eight half-day short courses covering topics related to thin film deposition, characterization, and advanced surface engineering will be held during ICMCTF 2023 from Sunday-Thursday, May 21-25, 2023. All short courses will include detailed course notes and will run from 8:30 a.m.-12:30 p.m. or 1:30-5:30 p.m. Cost: $250 Regular and Student Attendees.
Sunday, May 21, 2023
Monday, May 22, 2023
Tuesday, May 23, 2023
Wednesday, May 24, 2023
Thursday, May 25, 2023
The equipment exhibition is a great place to network and learn about new products, services, and application techniques that will help improve all facets of R&D, Engineering, Manufacturing, Quality Control, and general laboratory operations. Visit the exhibit hall for FREE (by registering as Exhibits Only) on Tuesday, May 23, from 12:00-7:00 p.m. and Wednesday, May 24, from 10:00 a.m.- 2:00 p.m. There are also discounted conference registration rates for those in the San Diego area.
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ALD/ALE 2023 Call for Abstracts |
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July 23-26, 2023
Bellevue, Washington
The AVS 23rd International Conference on Atomic Layer Deposition (ALD 2023) featuring the 10th International Atomic Layer Etching Workshop (ALE 2023) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe and Asia, allowing fruitful exchange of ideas, know-how and practices between scientists.
The conference will take place Sunday, July 23-Wednesday, July 26, 2023, at the Hyatt Regency Bellevue in Bellevue, Washington (East Seattle). As in past conferences, the meeting will be preceded (Sunday, July 23) by one day of tutorials and a welcome reception. Sessions will take place (Monday-Wednesday, July 24-26) along with an industry tradeshow.
All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 800+.
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AVS 69th International Symposium & Exhibition |
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November 9-10, 2023
Portland, Oregon
“Two is Better than One: Breaking Barriers with Coupled Phenomena” - Featuring Presentations on Emerging Topics Related to Materials, Processing & Interfaces
The AVS International Symposium and Exhibition addresses cutting edge issues associated with materials, processing and interfaces in both the research and manufacturing communities.
The weeklong Symposium fosters a multidisciplinary environment that cuts across traditional boundaries between disciplines, featuring papers from AVS Technical Division, Groups, Focus Topics on emerging technologies and more.
An extensive Exhibition of related equipment, tools, materials, supplies, chemicals, services, consulting, technical literature, and new technologies are showcased during the week.
Call for Abstracts Deadline: May 10, 2023
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Upcoming AVS Sponsored Events |
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May 21-26, 2023
San Diego, California
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July 23-26, 2023
Bellevue, Washington
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August 13-16, 2023
Buffalo, New York
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