Beneath the AVS Surface Member News & Updates

November 2023

Events Calendar

Workshop on Innovative Nanoscale Devices and Systems (WINDS 2023)

Kona, HI

December 3-8, 2023 | In Person | Website

49th International Conference on the Physics and Chemistry of Surfaces and Interfaces (PCSI-49 2024)

Santa Fe, New Mexico

Jan. 14-18, 2024 | In Person | Website

5th International Symposium of the Vacuum Society of the Philippines (ISVSP 2024)

Baguio City, Philippines

January 17-19, 2024 | In Person | Website

8th Area Selective Deposition Workshop (ASD 2024)

Montreal, Canada

April 14-17, 2024 | In Person | Website

Frontiers of Characterization and Metrology for Nanoelectronics (FCMN 2024)

Monterey, California

April 15-18, 2024 | In Person | Website

50th International Conference on Metallurgical Coatings & Thin Films (ICMCTF 2024)

San Diego, California

May 19-24, 2024 | In Person | Website

10th International Symposium on Functional Coatings and Surface Engineering (FCSE-2024)

Montreal, Canada

June 2-5, 2024 | In Person | Website

International Symposium on Sputtering & Plasma Processes (ISSP 2024)

Kyoto, Japan

July 2-5, 2024 | In Person | Website

38th North American Conference on Molecular Beam Epitaxy (NAMBE 2024)

Boston, Massachusetts

July 20-24, 2024 | In Person | Website

24th International Conference on Atomic Layer Deposition (ALD 2024)/ 11th International Atomic Layer Etching Workshop (ALE 2024)

Helsinki, Finland

August 4-7, 2024 | In Person | Website

AVS Pacific Northwest Chapter 35th Annual Symposium and 42nd Symposium on Surface Analysis

Richland, Washington

August 7-9, 2024 | In Person | Website

AVS 70th International Symposium & Exhibition

Tampa, Florida

November 3-8, 2024 | Website

AVS Board Meetings

Sunday, February 11, 2024

Cary, North Carolina (in conjunction with a visit with Publications Staff)

 

Sunday, May 19, 2024

San Diego, California (in conjunction with ICMCTF 50)


Sunday, August 11, 2024

(Via Zoom)                                    


Sunday, November 3, 2024

Tampa, Florida (in conjunction with the AVS 70th International Symposium & Exhibition)

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Member Reminders

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AVS Career Center

Attention Job Seekers

The AVS Career Center offers a wide range of job listings that encompass different skill levels, job sectors, and more. To learn more and browse our listings, visit the AVS Career Center.

Featured Jobs

Appalachian State University

Assistant Professor of Physics and Astronomy (two positions)


Purdue University

Assistant Professor of Quantum Information Science


Department of Radiation Oncology, University of Texas Southwestern Medical

Center

Postdoctoral Fellow in Biomedical Optics and Medical Physics


Northern Michigan University

Assistant Professor/Three Year Term


Duke University

Postdoctoral Research Associate


Massachusetts Institute of Technology

Assistant Professorship in Climate Sciences

"The AVS Career Center has consistently been a cost effective source for qualified candidates in our recruiting efforts. Our AVS postings have attracted a wide range of applicants both domestic and international." 
-Physical Electronics USA
VIEW ALL JOBS

Staff News

The AVS Staff would like to take this opportunity to thank you for your dedicated service, dedication, support, and loyalty to the Society! The AVS leadership and staff do our best to offer interesting products, services, events and activities, and we welcome your engagement and participation. We appreciate you and all you do for AVS and our scientific community and we hope you will consider getting more involved or joining one of our many committees to help ensure we can work together to keep AVS moving in a positive direction. Thank you & Happy Holidays!

Membership Highlights

AVS 2023 International Election Results

Congratulations to the following election winners:

President-Elect: Bridget Rogers, Vanderbilt University


Bridget Rogers is an Associate Professor in the Department of Chemical and Biomolecular Engineering and Director of the Undergraduate Program in Materials Science at Vanderbilt University. Her research focuses on surface/interface/film formation, characterization, and microstructure evolution. Learn More

Clerk: David Surman, Kratos Analytical Inc.


David Surman has been a long-standing member of the AVS. In 2009, Dave accepted the position as the Chair of the Exhibitor & Manufacturers Committee. In 2011, he was elected to the AVS Board of Directors where he served a two-year term from 2012-2013. During his term on the AVS Board of Directors, he served as Chair of the Membership Committee, a position he held until 2019. Learn More

Treasurer: Gregory J. Exarhos, Pacific Northwest National Labs


Gregory J. Exarhos, a Laboratory Fellow emeritus within the Physical Sciences Division at Pacific Northwest National Laboratory (PNNL), graduated magna cum laude from Lawrence University and received his Ph.D. in physical chemistry from Brown University. An assistant Professor at Harvard University, his group investigated cation motion in amorphous phases, phase transformation dynamics in amorphous materials, and electron-beam surface modification. Learn More

Director 2024-2025: Robert K. Grubbs, IMEC


Robert K. Grubbs is presently the Scientific Director of Thin Films at IMEC in Leuven Belgium. This position enables him to view the broad and diverse landscape of materials and design strategies that will enable future nodes of memory and computing devices. Prior to this position, he worked for eight years at Micron Technology in process engineering, developing critical films for high density phase change memories and on interfacial engineering for high-performance CMOS. Learn More

Director 2024-2025: Caitlin Howell, University of Maine


Caitlin Howell is an Associate Professor of Bioengineering at the University of Maine and leader of the Howell Biointerface and Biomimetics lab, which focuses on the understanding and control of biological systems at interfaces with a focus on microorganisms such as bacteria and fungi. She also serves as the Associate Director for the University of Maine’s Center for Undergraduate Research. Learn More

Director 2024-2025: Virginia "Ginger" Wheeler, Naval Research Lab


Virginia "Ginger" Wheeler is a Materials Research Engineer at the Naval Research Laboratory in Washington, DC. She currently leads the Thin Film Materials section within the Electronic Science and Technology division, where her team focuses on materials development for RF electronic devices through a wide range of deposition techniques including molecular beam epitaxy (MBE), metal organic chemical vapor deposition (MOCVD) and atomic layer deposition/epitaxy (ALD/ALEp). Learn More

Trustee 2024-2026: Kateryna Artyushkova, Physical Electronics


Kateryna Artyushkova is a President of Physical Electronics. Her research focuses on developing applications and methodologies for surface analysis focusing on X-ray Photoelectron Spectroscopy. She has received an M.A. Degree with Honors in chemistry from the National Technical University of Ukraine, Kyiv in 1995. Learn More

Trustee 2024-2026: Rachael L. Myers-Ward, U.S. Naval Research Laboratory


Rachael L. Myers-Ward is an Electrical Engineer in the High Power Electronics Branch/ Wide and Ultrawide Bandgap Materials Section at the U.S. Naval Research Laboratory. She received her Ph.D. in electrical engineering in 2006 and B.S. and M.S. degrees in chemical engineering in 2001 and 2003, respectively, from the University of South Florida. Learn More

AVS Welcomes the New Great Plains (Tornado Alley) Chapter

To support interfacial, material, and quantum science research in the region encompassed by Oklahoma, Kansas, Nebraska, and Arkansas, and support efforts to recruit new members to the AVS, the AVS Board of Directors approved the formation of a new AVS regional chapter called the Great Plains Chapter (Tornado Alley) at their Sunday, 11/5/23 Meeting in Portland, OR. Prior to the formation of the Tornado Alley Chapter, Kansas and Nebraska were not a part of an AVS regional chapter despite having several faculty members with research interests in alignment with AVS. While Oklahoma and Arkansas were included in regional chapters (New Mexico and Florida, respectively), there were significant geographical constraints that inhibited attendance at annual regional events.


A goal of the Tornado Alley Chapter is to establish an annual symposium featuring oral presentations and research posters from those within the region. Additionally, plans are underway to acquire resources to sponsor Early Investigator Awards, Best Poster Awards, and Scientific Achievement Awards to be awarded at the annual symposium. In addition to an annual symposium, there are plans to establish quarterly webinars where one or two speakers would be able to share their research progress with the chapter members. The belief is that the establishment of the Tornado Alley Chapter will support research efforts in the region, facilitating the establishment of robust interfacial science programs spanning the Tornado Alley region.


If you are a current AVS member residing in one of these states you have now been shifted into the Tornado Alley Chapter.   If you wish to remain in your previous chapter you may login to MyAVS and choose to have that listed as your secondary chapter. 


If you would like more information on this chapter or wish to get involved please feel free to contact the chairs - Rachael Farber, Chair rfarber@ku.edu or Erin Iski, Vice-Chair (erin-iski@utulsa.edu.

AVS University of Central Florida Student Chapter Reinstated

The University of Central Florida Student Chapter was recently reinstated by the AVS Board of Directors. This student chapter will be committed to introducing undergraduate and graduate students to materials research and related opportunities and to facilitating and supporting them in their research accomplishments.


They plan to accomplish these goals by regularly attending chapter meetings, presenting research at the regional chapter symposium and/or at the AVS International Symposium, hosting guest lecturers, providing up-to-date research information through the society web site, and participating in a variety of engineering related activities throughout each semester. 


If you are student attending the University of Central Florida and wish to be an AVS member please click here to join.

Apply for the Professor Joe Greene Postdoctoral Fellowship

Application Deadline: Monday, December 18, 2023

These prestigious postdoctoral positions are designed to support outstanding early-career scientists and engineers specializing in Materials Science, Physics, Chemistry, and related fields. Successful candidates will initially be appointed as full-time Postdoctoral Research Associates for one year, with the option of a second year. This program is available thanks to an endowment created by Phyllis Greene, Joe’s wife of 55 years, to honor Professor Joe Greene (Dr. J.E. Greene), who was a distinguished faculty member in Materials Science and Engineering at the University of Illinois Urbana-Champaign and a former director of The Materials Research Laboratory. Prof. Greene was renowned for his enduring impact and dedication to fostering the careers of young scientists and emerging leaders in the fields of materials science engineering, basic science, and applied technology. Read more about Professor Joe Greene's Legacy. 


The selected fellow(s) will become part of a research group led by a current Materials Research Laboratory faculty member. The current list of MRL faculty and their research areas can be found here. While it is not necessary that an applicant identify a research group to serve as their host, applicants will be asked to indicate up to 5 preferred research group(s). If a faculty member has agreed in advance to host an applicant should they be selected, applicants should indicate this. Please note that while we expect many of the strongest applicants will have identified an MRL faculty mentor willing to serve as their host should they be selected, and potential research directions in their proposed mentor’s group, all applications will receive full consideration.


Fellows in the 2024-2025 class are expected to start in 2024. Awards are expected to be made in late January 2024. Apply Here

Smith College Earns Award From Physics and Astronomy SEA Change Program

Smith College Physics Department has earned a Bronze Award from the Physics and Astronomy SEA Change Committee (P/A SEA Change) for their work to create a more inclusive and diverse physics department. This marks not only the first P/A SEA Change award, but also the first disciplinary award in SEA Change.


P/A SEA Change is a collaboration among many physics and astronomy professional societies: American Association of Physics Teachers (AAPT), American Astronomical Society (AAS), American Institute of Physics (AIP), American Physical Society (APS), AVS (Science and Technology of Materials, Interfaces, and Processing), National Society of Black Physicists (NSBP), National Society of Hispanic Physicists (NSHP), the Physics and Astronomy Division of the Council on Undergraduate Research, and Optica. This is a disciplinary pilot program, funded by the AIP Venture Partnership Fund and based on the American Association for the Advancement of Science’s AAAS SEA Change. The program’s goal is to support continual, data-informed systemic change in postsecondary STEMM education. AAAS SEA Change focuses on institutional level change, while P/A SEA Change is tailored for physics and astronomy departments.


“In SEA Change, we understand the value of having ‘top-down’ institutional and ‘bottom-up’ disciplinary levels available to help drive transformation,” said Shirley Malcom, senior advisor to the CEO and director of SEA Change at AAAS. “We are excited that the physics/astronomy team was first to come online with its SEA Change review and awards process, especially as the historic challenges to inclusion are so large.


“While Smith College Physics is the first department to go through the process, as the value of the assessment, reflection and action planning process is revealed, we expect that their experience can help point the way for excellence through equity in physics!”

View Press Release

Remembering Gerald Lucovsky

Provided by Dave Aspnes and Gregory Parsons


February 28, 1935 – October 29, 2023


We are saddened by the loss of Gerry Lucovsky, a mentor, colleague, advisor, leader, friend, and independent thinker. After earning a PhD in Physics from Temple University in 1960, Gerry began his professional career at Philco in Rochester NY, where he fabricated the first GaAs-based photovoltaic device. In 1965 he transitioned to Xerox, then in 1970 moved to Palo Alto, California, to help establish the Xerox Palo Alto Research Center. At PARC he managed the General Sciences Laboratory and was a Senior Research Fellow. 


In 1980 he joined the Department of Physics at North Carolina State University to begin a program in plasma-based deposition of amorphous thin-film materials, pioneering the field of remote-plasma deposition of silicon dioxide, hydrogenated amorphous silicon, and other semiconducting and dielectric materials for solar photovoltaics and advanced semiconductor electronic applications. At NC State he recruited many highly regarded faculty colleagues, and supervised numerous PhDs and postdocs who are now leaders in industry and academia. He also taught at Case Western Reserve University and was an Adjunct Professor of Physics at Vanderbilt University.


Gerry is widely recognized as an expert in optical, vibrational, and electronic properties of amorphous solids and gasses, including establishing the role of near-neighbor electronegativity on the vibrational frequencies of bonds in amorphous solids. He viewed himself (accurately) as much as a chemist as a physicist. 


Gerry was particularly active in the American Vacuum Society. For 30 years, from 1980 to 2010, he was Editor in Chief of the Journal of Vacuum Science & Technology. He was a Fellow of the American Physical Society and a Fellow of the American Vacuum Society, and in 2005 he was named AVS Honorary Member, the highest honor that the AVS bestows upon its members. At NC State he was named a Distinguished University Professor for his many contributions, and an Alumni Distinguished Graduate Professor for his classroom-teaching excellence.


Gerry encouraged those around him to always think independently, find your own path, and be self-sufficient, often quoting Ralph Waldo Emerson’s Self-Reliance: “A foolish consistency is the hobgoblin of little minds…”. He will be remembered for his ability to encourage and support others and, particularly in his later years, for his independence and commitment to his ideals. 

Publications Highlights

Isotropic Atomic Layer Etching of TiN Maintains Superconducting Properties and Achieves Angstrom-Scale Precision

Authors: Azmain A. Hossain, Haozhe Wang, David S. Catherall, Martin Leung, Harm C. M. Knoops, James R. Renzas, and Austin J. Minnich

 

Publication: Isotropic plasma-thermal atomic layer etching of superconducting titanium nitride films using sequential exposures of molecular oxygen and SF6/H2 plasma

Journal of Vacuum Science & Technology A, Vol. 41, No. 6, November/December 2023

READ ARTICLE

ALE attains better control, smoother surfaces, and less microwave loss than conventional etching methods to build better quantum circuits and microelectronics.

 

Superconducting titanium nitride (TiN) is an ideal material for quantum circuits and in microelectronics because of its low microwave loss, high photon absorption coefficient, kinetic inductance, high electrical conductivity, and adhesion to copper. However, standard etching methods cause surface imperfections that lead to microwave dissipation or electrical leakage currents.

 

A collaboration of researchers from the California Institute of Technology, Pasadena City College, Oxford Instruments Plasma Technology, and the Eindhoven University of Technology proposed isotropic plasma-thermal atomic layer etching (ALE) as an alternative tool to mitigate the undesired effects of conventional etching methods. They published their results in the AVS Journal of Vacuum Science & Technology A.

 

“Standard etching methods for TiN are wet etching or reactive ion etching (RIE),” said author Austin Minnich. “Wet etching has poor thickness control and uniformity arising from variation in acid concentration and imprecise etching times. RIE can cause surface damage due to the high energy bombardment of the plasma species.”


Instead, the researchers’ isotropic method exposes the TiN to oxygen gas, turning it into titanium oxide (TiO2). When etching with sulfur hexafluoride or hydrogen plasma, they found selective etching of the TiO2 over TiN, which limited how much material can be etched in a cycle, increasing etch depth control and reducing the negative effects incurred by other etching methods.


“We show that the ALE process etches TiN without affecting the sensitive superconducting properties, demonstrating the ultralow damage properties of the recipe,” said Minnich. “We also observe that ALE reduces surface oxygen concentration, which may be useful for minimizing surface imperfections associated with the native oxide.”


The ability to achieve angstrom-scale thickness control and decreased surface roughness makes this method highly promising for fabricating quantum circuits.



“ALE has been long studied in the semiconductor industry for microelectronics, and we think it can be a useful tool for fabricating quantum devices,” Minnich said. “This work is one of the early steps towards the application of ALE for quantum device nanofabrication. We are presently preparing to test its effect on quantum devices by studying the single-photon-power cryogenic loss in ALE-treated superconducting microresonators.”

Revealing Scalloping Effects of Plasma Etching on 3D Stacked Films


Authors: Sang-Jin Chung, Pingshan Luan, Minjoon Park, Andrew Metz, and Gottlieb S. Oehrlein


Publication: Exploring oxide-nitride-oxide scalloping behavior with small gap structure and chemical analysis after fluorocarbon or hydrofluorocarbon plasma processing

Journal of Vacuum Science & Technology B,

Vol. 41, No. 6, November/December 2023

READ ARTICLE

Detailed analysis of etching rates could improve performance of 3D memory devices.


The continuing advancement of computing and information technologies has driven an increasing demand for information storage, resulting in higher-density memory devices. Traditional two-dimensional memory has inherent density limitations, leading many researchers to explore three-dimensional structures like 3D-DRAM and 3D-NAND memory.


In 3D-NAND, memory cells are made of interchanging layers of silicon dioxide (SiO2) and silicon nitride (Si3N4) films commonly known as oxide-nitride-oxide (ONO) stacks. These layers are plasma etched to create a high aspect ratio (HAR) device architecture. However, structural defects such as ONO scalloping can form when horizontal etching occurs in these layers at different rates.


In the AVS Journal of Vacuum Science & Technology B, researchers from the University of Maryland and TEL Technology Center America used a unique experimental method to investigate the origin of ONO scalloping during this complex plasma etching process. Their approach can provide valuable insight into an issue that can be otherwise challenging to study.


“This characterization of the actual structure is very difficult because of the small opening size of features and high aspect ratio,” said author Gottlieb Oehrlein. “In our work, we utilize a special structure that simulates the interaction of plasma with actual trench structures, and our structure can be characterized easily.”


The team employed a horizontal trench structure oriented perpendicular to the flux of ions. This design allowed them to isolate the effects of neutral radicals on the etching process and observe their effect on surfaces using ellipsometry and X-ray photoelectron spectroscopy.


“The key advantage is its simplicity, compatibility with the plasma etching equipment, and the speed with which important conclusions can be obtained,” said Oehrlein. “Most importantly, our study provides real-time measurements of the wafer surface during the etch and deposition processes. No industrial tools can offer these abilities.”


Using this approach, the authors explored the interaction of plasma with SiO2 and Si3N4 surfaces using both hydrofluorocarbons and fluorocarbons as precursor gases. They found that a hydrofluorocarbon precursor induces strong isotropic etching for Si3N4 but not SiO2, and that this etching is highly dependent on the aspect ratio. On the other hand, a fluorocarbon precursor exhibited much less pronounced differences. These experimental observations clearly point out the origin of ONO scalloping in industrial plasma etch processes and the potential mitigations in reducing such defects.


“The most surprising finding is the dramatic importance of precursor gas, material dependence, and strong AR dependence on the sidewall chemistry results,” said Luan. “This indicates the potential to rationally tailor HAR plasma etching chemistries for particular sidewall processes.”


The team plans to use their platform to examine additional aspects of the etching process, exploring additional precursors and substrates, along with varying the plasma and substrate temperatures.

Biointerphases Special Topic Collection: The Future of Biointerface Science 2024

Submission Deadline: April 15, 2024


This Biointerphases Special Topic Collection will feature the perspective early-career scientists have on the future of biointerface science. Postdocs or senior PhD students on the verge of applying for faculty positions are particularly encouraged to share their views on the field. Select contributing authors will be invited to present their work and compete for the Biointerphases Ascending Researcher Award at the AVS 70th International Symposium and Exhibition in Tampa, Florida, November 3-8, 2024. All invited speakers will be supported by a travel award and the winner of the Ascending Researcher Award and associated article will be widely promoted via email and on social and professional networks.


Topics covered include, but are not limited to:

  • bio-surface modification
  • nano-bio interface
  • protein-surface interactions
  • cell-surface interactions
  • in vivo and in vitro systems
  • biofilms / biofouling
  • biosensors / biodiagnostics
  • bio on a chip
  • coatings
  • interface spectroscopy
  • biotribology / biorheology
  • molecular recognition
  • ambient diagnostic methods
  • interface modelling
  • adhesion phenomena

Submission Instructions:

Authors are encouraged to follow the Information for Contributors provided online and use the Biointerphases article templates available. All early-career authors on a paper are invited to include a photo and a biography of up to 250 words with their article submission. The photos and bios of all early-career authors will be printed at the end of each article.


  • Associate Editor: Caitlin Howell, University of Maine, USA
  • Editor-in-Chief: Tobias Weidner, Aarhus University, Denmark
SUBMISSION INFORMATION

Accelerating Quantum Optimal Control of Multi-qubit Systems with Symmetry-based Hamiltonian Transformations


Authors: Xian Wang, Mahmut Sait Okyay, Anshuman Kumar, and Bryan M. Wong


Publication: AVS Quantum Sci., 5, 043801 (2023)

READ ARTICLE

We present a novel, computationally efficient approach to accelerate quantum optimal control calculations of large multi-qubit systems used in a variety of quantum computing applications. By leveraging the intrinsic symmetry of finite groups, the Hilbert space can be decomposed and the Hamiltonians block diagonalized to enable extremely fast quantum optimal control calculations. Our approach reduces the Hamiltonian size of an n-qubit system from 2n ×2n to O(n×n) or O((2n/n)×(2n/n)) under Sn or Dn symmetry, respectively. Most importantly, this approach reduces the computational runtime of qubit optimal control calculations by orders of magnitude while maintaining the same accuracy as the conventional method. As prospective applications, we show that (1) symmetry-protected subspaces can be potential platforms for quantum error suppression and simulation of other quantum Hamiltonians and (2) Lie–Trotter–Suzuki decomposition approaches can generalize our method to a general variety of multi-qubit systems.

Fe2O3-graphitic Carbon Nitride Nanocomposites Analyzed by XPS


Authors: Mattia Benedet, Davide Barreca, Gian Andrea Rizzi, Chiara Maccato, Jan-Lucas Wree, Anjana Devi, Alberto Gasparotto


Publication: Surf. Sci. Spectra 30 (2), 024021 (2023)


As shown in this latest addition to the Materials for Energy and the Environment Collection, the nanocomposite systems based on iron(III) oxide (Fe2O3) and graphitic carbon nitride (gCN) possess a great potential as photo(electro)catalysts for environmental remediation and energy generation. In this field, a key issue is the fabrication of supported materials directly grown onto suitable substrates and possessing tailored features. In this present study, Fe2O3–gCN nanomaterials are prepared by an innovative two-step strategy, consisting of initial plasma assisted-chemical vapor deposition of iron(III) oxide on conducting glass substrates and subsequent functionalization with low amounts of gCN by a facile electrophoretic deposition process.


Attention is dedicated to the use of two different forms of carbon nitride, obtained from melamine or melamine + cyanuric acid, to finely tune the resulting material composition. X-ray photoelectron spectroscopy was used to characterize the pristine Fe2O3 deposit as well as two Fe2O3–gCN composite materials prepared starting from different gCN powders.

READ ARTICLE

A detailed analysis of the obtained spectroscopic data reveals the occurrence of a direct electronic interplay between single constituents, dependent on material characteristics. The related results may act as useful guidelines for the design of photo(electro)catalysts endowed with specific properties, of importance for sustainable applications.


Check out other articles and their accompanying data in the Materials for Energy and the Environment Collection. We also invite you to submit your data article to the newest collection featuring materials being studied for energy conversion and storage, along with those which are used to aid in energy saving and the overall reduction of carbon emissions. This collection is open to all techniques published in SSS and should be submitted on the appropriate technique-specific template.

AVS Journals Announcements and Open Topics - Calls for Papers

AVS Quantum Science (AQS):


JVST A:


JVST B:


Biointerphases:


Surface Science Spectra (SSS):

Event Reports

AVS 69th International Symposium & Exhibition

The AVS 69th International Symposium and Exhibition was held November 5-10, 2023, at the Oregon Convention Center in Portland, Oregon amidst the vibrant fall foliage and, of course, a little bit of rain. The Symposium program consisted of 100+ exciting oral and poster sessions, a vibrant exhibition with ~150 participating exhibitors, as well as many opportunities for professional development, networking, collaborations, and socializing!


The theme for this year’s Symposium was “Two is Better than One: Breaking Barriers with Coupled Phenomena.” The theme highlighted the recent and emerging interest throughout AVS in engineering materials and devices with novel, multifaceted functionality in small or complex form factors. Often times these properties are not naturally occurring within a single material or traditional device structure and require novel approaches to develop either new engineered materials or ways to combine different materials into a single structure. In a historical sense, this would be like optoelectronic, thermoelectric, or electromechanical materials and devices. More recently, this includes unique materials integration schemes that can apply to coupled non-linear effects, quantum acoustic devices, flexoelectric materials, and many more. It also can apply to multifunctional devices where the multiple aspects of physics and/or hybridization expand the application space, for instance with hyperbolic metamaterials, single-photon detectors, and quantum sensors. To fully realize the potential of these engineered multifunctional materials and devices, new models and characterization techniques need to be developed that can probe and explain multiple effects on different time and spatial scales, simultaneously. Specifically, here are some of the symposium sessions that highlighted the theme:


  • Advanced Surface Engineering: Advanced Multi-functional Thin Film Materials
  • Applied Surface Science: Multi-Modal & Multi-Dimensional Analysis
  • Biomaterials Plenary Session: Coupled Phenomena in Biomaterial Systems
  • Electronic Materials and Photonics: CMOS+X: Piezoelectrics, Ferroelectrics and Multiferroics, and Memory
  • Magnetic Interfaces and Nanostructures: Special Symposium on Coupling Phenomena in Magnetism
  • Atomic Scale Processing: Integration of Deposition and Etching


Monday Plenary Lecturer:

Joshua D. Caldwell

Professor Mechanical Engineering and Director of Interdisciplinary Materials Science Graduate Program, Vanderbilt University

 

"Exploiting and Controlling Lattice Symmetry and Strong Coupling for Infrared Nanophotonics and Ultrafast Thermal Transport"

In addition, there were sessions in several innovative topical areas. Focus Topics at this meeting included: Actinides and Rare Earths; Fundamental Discoveries in Heterogeneous Catalysis; Advanced Ion Microscopy and Ion Beam Nano-Engineering; Chemical Analysis and Imaging at Interfaces; and for the first time, Theory for Surface Processes and Spectroscopies and Lab-based Ambient Pressure XPS. In addition, there were several mini-symposia highlighting the crosscutting nature and emerging interests of several divisions and groups in AVS. Mini-symposiums at this meeting included: Quantum Science and Technology (the AVS 3rd Quantum Science Workshop on Sunday); Atomic Scale Processing; Light Sources Science; and CHIPS Act.


There were also sessions spread throughout the week based on machine learning, big data, and emerging artificial intelligence for different topical areas of AVS. These focus topics complemented our traditional strong core of fundamental surface science and interfacial phenomena, applied surface science, surface engineering, micro- and nano-electronics, nanoscale science and technology, manufacturing science and technology, thin films, plasma science and technology, micro- and nano-electromechanical systems, electronic and photonic materials, biomaterials, and vacuum science and technology.


Throughout the week, many AVS awardees presented invited talks in the division or group sessions where the award was given. Our National awardees also gave talks throughout the week.


In addition to the Technical Program, there was an extensive equipment and vendor exhibition, a 5K Run, several special workshops and professional development events, an AVS Member Center, an AVS Career Center, a number of social events, and many networking and career advancement and recruitment events for those launching their careers as well as for established researchers.


More than 150+ played in the AVS 69 Scavenger where attendees participated in numerous AVS activities, visited exhibitors, solved riddles, and found Easter eggs to earn points for special prizes. Here are our 5 winners with their prizes and our Scavenger Hunt Champion, Teddy.

Thank you to the international scientific community for submitting and presenting their excellent research. Special thanks and appreciation for the hard and selfless work of our Program and Program Vice-Chair and Program Committee over the last year, for developing an exciting and vibrant program.

Program Chair:

Virginia Wheeler

U.S. Naval Research Laboratory

Program Vice Chair

Mark Engelhard

Pacific Northwest National Laboratory


All Topics:


Other Special Sessions and Events:

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Event Announcements

49th Conference on the Physics and Chemistry of Surfaces and Interfaces (PCSI-49)

January 14-18, 2024

Santa Fe, New Mexico

Website


The 49th Conference on the Physics and Chemistry of Surfaces and Interfaces (PCSI-49) will be held at La Fonda Hotel in Santa Fe, New Mexico, USA, from Sunday afternoon, January 14, through Thursday noon, January 18, 2024.


The annual PCSI conference is devoted to achieving a fundamental understanding of the physical, chemical, biological, structural, optical, magnetic, and electrical properties of surfaces and interfaces. These studies include novel growth processes and interfacial phenomena, new characterization tools, transport, and functionality of the structures for future devices.


Generous amounts of discussion time will be included in the program in order to emphasize the workshop character and to stimulate the exchange of new ideas.

International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN 2024) 

April 15-18, 2024

Monterey, California

Website


Call for Abstracts Deadline: December 1, 2023

The 2024 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN 2024) will be held at the Monterey Marriott in Monterey, CA from April 15-18, 2024.


The FCMN will bring together scientists and engineers interested in all aspects of the characterization technology needed for nanoelectronic materials and device research, development, integration, and manufacturing. All approaches are welcome: chemical, physical, electrical, magnetic, optical, in situ, and real-time control and monitoring. The semiconductor industry is evolving rapidly: the conference will highlight major issues and provide critical reviews of important materials and structure characterization and nearline/inline metrology methods, including hardware, data analysis, and AI and machine learning, as the industry both extends the technology deep into the nanoscale and increases the diversity of devices and systems.


The conference consists of formal invited presentation sessions and poster sessions for contributed papers. The poster papers cover new developments in materials and structure characterization/metrology down to the nanoscale. The conference began in 1995, and this meeting is the 14th in the series.

50th International Conference on Metallurgical Coatings and Thin Films (ICMCTF 2024)

May 19-24, 2024

San Diego, California

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“Surface Engineering for Sustainable Development”

The 50th International Conference on Metallurgical Coatings and Thin Films (ICMCTF 2024) will be held at the Town & Country Resort, San Diego, California, USA, from May 19-24, 2024. ICMCTF is the premier international conference in the field of thin film deposition, characterization, and advanced surface engineering, promoting a global exchange of ideas and information among scientists, technologists, and manufacturers. ICMCTF 2024 technical sessions will have an overarching theme that emphasizes materials, processes, and applications relevant for sustainable development and will include a related Topical Symposium. We also hope to see many of the major leaders of the conference to mark the 50th anniversary. The Conference includes more than 90 high-profile invited speakers, in over 40 sessions, across technical symposia, plenary and keynote lectures, short courses, an awards program, and daily social networking events.


A major exhibition of equipment, materials, technical literature, and new technologies is a key part of the conference. Attendees from all over the world come to present their findings, exchange ideas, share insights, make new friends, and often establish collaborations. The Conference typically draws 700 attendees.


Technical Symposia


Processes:


Materials:


Characterization & Computation:


Industry & Applications:


Topical Symposium - Sustainable Surface Engineering:

Atomic Layer Deposition (ALD 2024) Featuring the 11th International Atomic Layer Etching Workshop (ALE 2024)

August 4-7, 2024

Helsinki, Finland

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Call for Abstracts Deadline: February 15, 2024

The AVS 24th International Conference on Atomic Layer Deposition (ALD 2024) featuring the 11th International Atomic Layer Etching Workshop (ALE 2024) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe and Asia, allowing fruitful exchange of ideas, know-how and practices between scientists. The conference will take place Sunday, August 4-Wednesday, August 7, 2024, at the Messukeskus in Helsinki, Finland.

 

As in past conferences, the meeting will be preceded (Sunday, August 4) by one day of tutorials and perspectives and a welcome reception. Sessions will take place (Monday-Wednesday, August 5-7) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 700+.

 

50 Years of ALD Since the Pioneering Work of Dr. Tuomo Suntola

During ALD 2024 we will be celebrating the 50 year anniversary of the groundbreaking work on ALD by Dr. Tuomo Suntola and his coworkers who filed the first patent on Atomic Layer Epitaxy in 1974. Dr. Tuomo Suntola will present the opening words of the ALD 2024 conference.

Upcoming AVS Sponsored Events

January 14-18, 2024

Santa Fe, New Mexico

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April 15-18, 2024

Monterey, California

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May 19-24, 2024

San Diego, California

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AVS Corporate Members

Agilent Technologies

AJA International, Inc.

American Institute of Physics

Anderson Dahlen - Applied Vacuum Division

ATLANT 3D Nanosystems

Challentech International,Corp.

Duniway Stockroom, Corp.

FMG Enterprises, Inc.

Gamma Vacuum

Hiden Analytical, Inc.

Horiba Instruments

HVA, LLC

Integrated Engineering Software

ION-TOF USA, Inc.

Korvus Technology Ltd

Kratos Analytical

Kurt J. Lesker Company

Mack Vacuum Technologies, Inc.

MW Industries, Inc.

Oregon Physics LLC

Oxford Instruments

Pfeiffer Vacuum Valves & Engineer (Nor-Cal Products)

Pfeiffer Vacuum Technology

Physical Electronics

Reynard Corporation

R. D. Mathis Company

RF VII, Inc.

SPECS Surface Nano Analysis GmbH

Staib Instruments, Inc.

Sumitomo (SHI) Cryogenics of America, Inc.

Super Conductor Materials, Inc

Thermo Fisher Scientific, Inc.

UC Components, Inc.

VACOM USA LP

Vacuum Research Corp.

WITTENSTEIN North America

To learn more, please visit the AVS Corporate Membership Website or contact Angela Klink, 212-248-0200, ext. 221.
AVS | www.avs.org
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