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CALL FOR ABSTRACTS
The Chemical Mechanical Planarization Users Group (CMPUG) invites abstracts for the 2025 Symposium on Advances in CMP Consumables, Materials, and Tools. This annual symposium provides an international forum for academic researchers, industrial practitioners, and engineers to exchange knowledge on state-of-the-art research in CMP semiconductor technology. CMPUG fosters collaboration, networking, and discussion of opportunities, ideas, and technical advancements in the field.
Held on the campus of Lewis University in Romeoville, Illinois, this hybrid event will highlight research and innovation in CMP and post-CMP cleaning. A symposium session will be dedicated to current student researchers—emerging leaders in the CMP community—to present their work and engage with experts from academia and industry. Discussions will center on fundamental research, cutting-edge technologies, and challenges shaping the future of planarization and cleaning in semiconductor manufacturing.
The key focus areas for this year’s meeting include:
- CMP Consumables and Materials
- CMP Polishing and Metrology Tools
- CMP Process Integration
Thursday morning (April 3) will feature a short CMP and p-CMP cleaning course open to the CMPUG community.
ABSTRACT SUBMISSION INFORMATION:
Please submit an abstract (less than 200 words) of your presentation by March 7, 2025.
You may submit your abstract by filling in the form linked below. Alternatively, you may submit your abstract to the meeting Co-Chair, Jason Keleher (keleheja@lewisu.edu ). Authors will be notified of acceptance by return e-mail.
Abstract submission form: https://forms.gle/AJicLxFEJBmm24118
All accepted presenters are required to submit their presentations in pdf or pptx format, approved by their respective organizations/employers for public release, by March 28, 2025
All presentations will be posted on the CMPUG Proceedings webpage within 2 weeks following the meeting.
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