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The 2017 Symposium on EMC+SIPI is the leading event to provide education of Electromagnetic Magnetic Compatibility and Signal/Power Integrity techniques. This year, we are featuring topics covering the Internet of Things (IoT). The distributed nature of IoT affects everything EMC, from spectrum issues to facilities to standards to advanced digital design, sensing and communications. IoT connections are estimated to be 50 billion. This is a critical area for EMC practitioners.

The Symposium features five full days of innovative sessions, interactive workshops/tutorials, experiments and demonstrations, and social networking events.
Students have the opportunity to submit technical papers in all facets of EMC and SIPI and are eligible for the Best Student Paper Awards.

Join the most distinguished engineers from around the globe on August 7 – 11, 2017 at the EMC+SIPI Symposium in National Harbor, Maryland just outside of Washington D.C.

  •  Theme Topic I – EMC for Emerging Technologies
      - Wireless EMC
      - Radio-Frequency Interference
      - Smart Grid EMC
      - Nano-Materials and Silicon Photonics
      - Unmanned Aircraft Systems EMC
  •  Theme Topic II – Signal & Power Integrity
      - High-speed channel characterization and modeling
      - Signal/power integrity co-design and co-simulation
      - 3D IC and 3D packaging
      - Measurement techniques
      - Jitter, equalization, BER
  •  Theme Topic III – EMC and the Internet of Things
      - Power Integrity
      - Wireless & RF Spectrum Challenges/Solutions
      - Medical Devices
      - Smart Cities and Energy
      - Tactics and topics for the next generation of device and system requirements
Call for Student Papers
The IEEE EMC Society is seeking original, unpublished papers covering all aspects of electromagnetic compatibility, including EMC design, modeling, measurements and education. Graduate and undergraduate authors are eligible for the Best Student Paper contest. The student must be the primary author and should indicate that they wish to be considered for the contest when submitting the preliminary manuscript. Each student’s professor will be asked to certify that the paper is primarily the work of the student. Students submitting EMC and SIPI Technical Papers must plan to attend.
Authors of accepted papers will be invited to submit an extended version of their symposium paper for possible publication in a special issue of the IEEE Transactions on Electromagnetic Compatibility.

  Preliminary Full Paper Manuscript:
    Nov 1, 2016 - Jan 16, 2017
  Notification of Acceptance:
    Feb 21, 2017
  Final Paper Due: May 3, 2017

Winning Team: University of Zagreb, Croatia
Back Row, left to right: Raul Blecic and Professor Adrijan Baric
Front Row, left to right: Mislav Mikic and Rebecca Grancaric
A student team representing the University of Zagreb, Faculty of Electrical Engineering and Computing in Croatia took the prize for the 2015 Student EMC Hardware Design Competition during the EMC 2015 Symposium in Dresden, Germany. The team’s winning project exemplified their insight, creative solutions and provided a detailed explanation of their entry.

Abstract —A step-down switched-mode power converter based on the regulator MC34063A is designed. Special attention is given to the minimization of its conducted emissions and output voltage ripple. The selection of the components and the design of the printed circuit board (PCB) layout are discussed in detail. The operation of the designed converter is simulated by SPICE simulations. The efficiency, output voltage ripple and conducted emissions of the designed converter are measured. A line impedance stabilization network (LISN) designed on a separate PCB is used for the conducted emission measurements.

Details and contest rules will be coming soon for the 2017 Student EMC Hardware Design Competition at .

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