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‌ Custom Silicon Solutions and SoC IP Bulletin | Q4 2020 Update

Greetings! 2020 was a year we cannot forget. Will we remember 2021 as a year of revival and new beginnings? I believe we have many reasons to be optimistic. We can now begin to imagine meeting in person once again with our customers, partners, and colleagues. Semiconductor demand is strong as a new wave of AI-enabled hardware is being introduced into cloud and edge applications. The rise of custom silicon has created new opportunities for the industry and for OpenFive, as we innovate and invest in leading-edge technologies such as 5nm, 2.5D advanced packaging, die-to-die interfaces, chiplets, and AI SoC design platforms. We are pleased to share some highlights with you in our inaugural newsletter, the OpenFive Bulletin. From all of us on the OpenFive team, we wish you a happy, healthy and safe 2021! Sudhir Mallya VP Marketing, OpenFive

Highlights

Aug. 17, 2020 - SiFive announces OpenFive, an Industry-Leading Custom Silicon Business Unit...

Press Releases Dec. 7, 2020 - OpenFive Licenses Flex Logix's eFPGA to Develop a Low Power Communications SoC Requiring a Large eFPGA... Oct 5, 2020 - OpenFive and AnalogX to Provide Optimized Chip-to-Chip Interface IP Solutions... Aug. 20, 2020 - OpenFive Enhances differentiated IP portfolio with Die-to-Die interface controllers for HPC and Chiplet Markets...

Product Briefs and Datasheets Interlaken IP Subsystem Ethernet IP Subsystem USB IP Subsystem Die-to-Die IP Subsystem HBM2/2E IP Subsystem Webinars On-Demand Enabling AI Vision at the Edge Protocol Agnostic Die-to-Die Connectivity for Chipset and HPC SiFive Storage Solutions: How RISC-V and Custom Silicon Platforms Enable Smart Storage Architectures SiFive HBM2/2E IP Subsystem – Features and Implementation Guidelines

Technical Documents and Whitepapers

Signal Integrity analysis of HBM2E based Silicon Interposer using SystemSI High-Bandwidth Memory (HBM2E+) 4G I/O Design Techniques for 7nm Technology & Below High-Bandwidth Memory (HBM2E) 4G I/O Design/xACT3D RC Extraction Techniques for 7nm Technology & Below T2B IBIS Modeling for tsmc7nm HBM4Gbps I/O Design The relevance of Analog in today's SoC World PLL3GHz Characterization using Liberate AMS Power via improvement script

Blogs

Protocol and Interface Agnostic Universal D2D Controller for HPC and Chiplets WEBINAR: Differentiated Edge AI with OpenFive and CEVA OpenFive’s Customizable Silicon-Focused Solutions Webinar: Build Your Next HBM2/2E Chip with SiFive Chip-to-Chip Communication for Enterprise and Cloud

Visit www.openfive.com for more on-demand resources

... About OpenFive ... OpenFive is a solution-centric silicon company that is uniquely positioned to design processor agnostic SoC architectures. With customizable and differentiated IP for Artificial Intelligence, Edge Computing, HPC, and Networking solutions, OpenFive develops domain-specific SoC architectures based on high-performance, highly-efficient, cost-optimized IP to deliver scalable, optimized, differentiated silicon. OpenFive offers end-to-end expertise in Architecture, Design Implementation, Software, Silicon Validation and Manufacturing to deliver high-quality silicon. Visit www.openfive.com to learn more... For any questions and comments, you can email us at [email protected]

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