Custom Silicon Solutions and SoC IP Bulletin | Q2 2021 Update
Greetings!

As we’ve crossed the halfway mark in 2021, it is nice to start meeting in person once again with our friends, colleagues, and customers. The pandemic is by no means over, and we do need to stay vigilant, but there are reasons to be optimistic.

Semiconductor demand remains exceptionally strong in 2021 and annual sales will cross $500B for the first time. New custom SoC design starts continue to be fueled by AI-enabled hardware for cloud and edge applications. At OpenFive, we have been busy innovating and investing in leading-edge IP and subsystems such as 5nm, 2.5D advanced packaging, HBM3, die-to-die interfaces, chiplets, CXL subsystems, and AI Vision SoC platforms. OpenFive sponsored our first in-person events since the pandemic — the RISC-V summit in China, and the Semi Expo in Israel. The booth traffic and interest in OpenFive’s sessions from our customers, partners, and colleagues surpassed all our expectations. We are pleased to share some highlights with you in our newsletter, the OpenFive Bulletin. From all of us on the OpenFive team, we wish you a happy, healthy and safe 2021!
 
Sudhir Mallya
VP Product Marketing & Business Development, OpenFive 
 
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OpenFive AI Vision Platform

OpenFive’s Edge AI Vision platform enables you to build your own Edge AI SoC. Pre-configured subsystems allow you to focus on your key differentiators. Add your own custom accelerators, customize the subsystems, and mix and match different interfaces to meet your application’s unique requirements...Learn more...
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On-demand Resource
OpenFive Edge AI Vision Platform

AI is pervasive in all applications, and the processing is moving from the cloud to the edge. Deployment of AI on the edge require custom accelerators and custom SoCs to meet the target latency, power, and performance of the end application. OpenFive’s Edge AI Vision Platform is an SoC chassis that you can quickly configure, build, and deploy a custom Edge AI SoC. With configurable subsystems, the Edge AI Vision Platform enables you to focus your key differentiators. Download the product brief..
OpenFive LPDDR5/4X PHY

LPDDR5/4X are the next generation low-power memory which boosts 2X faster data transfers than its predecessor. LPDDR devices can transfer data at higher rates with remarkable power efficiency. It also supports unique low power feature, deep sleep mode (DSM), to reduce standby power even further.
LPDDR memory are used where area and power savings are key requirements. LPDDR also offers higher bandwidth compared to DDR counterparts. LPDDR5/4X is ideally suited for next-generation computing for AI Inference, Edge, IoT, Automotive, and Mobile applications. Download the product brief.
OpenFive Die-to-Die PHY IP 

D2D PHY IP (Die-to-Die Interface)
 
Die-to-Die (D2D) PHY IP is based on HBM electrical specification and will also be compatible to upcoming interface standards. It is used specifically for heterogenous chiplet solutions in wired communications, AI, and HPC applications. With recent advances in package technologies, it is possible to route high-speed signals within a package connecting multiple die either on Interposer or on Organic Substrate. Die-to-Die PHY IP offers a unique value proposition in terms of low power, high throughput, and low latency links enabling faster time to integration. Download the product brief.
OpenFive Die-to-Die Controller IP 

D2D Controller IP (Die-to-Die Interface)
 
Die-to-Die (D2D) Controller IP is targeted for heterogenous chiplet solutions in wired communications, AI, and HPC applications. With recent advances in package technologies, it is possible to route high-speed signals within a package connecting multiple die either on Interposer or on Organic Substrate. Die-to-Die Controller IP offers a unique value proposition in terms of low power, high throughput, and low latency links enabling faster time to integration. Download the product brief.
On-demand Webinars
Industry and Partner Events
June 22 - 24, 2021
RISC-V World Conference China 2021
Shanghai, China - In-person Event
OpenFive demonstrated its AI Vision Platform at its exhibit booth and also delivered a talk on "OpenFive's Platform for HPC and AI SoCs in Data Center Applications".
 
June 21 - 22, 2021
OpenFive exhibited at ChipEx 2021
Tel Aviv, Israel - In-person Event
OpenFive demonstrated its AI Vision Platform and a host of Custom SoC and IP solutions.
 
June 2, 2021
TSMC 2021 Technology Symposium
Japan - Virtual Event
 
June 2, 2021
TSMC 2021 Technology Symposium
Europe - Virtual Event

June 1, 2021
TSMC 2021 Technology Symposium
NA, USA - Virtual Event
 
May 25 - 28, 2021
Design and Reuse IP SoC Silicon
Valley 2021 - Virtual Event
 
April 6, 2021
Embedded Vision Summit 2021
Virtual Event
OpenFive demonstrated its AI Vision Platform at its booth and also delivered a presentation about custom SoC development for edge AI and vision applications.
Visit https://openfive.com/resources/ for more on-demand resources
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About OpenFive
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OpenFive — your proven path from custom SoC architecture to volume silicon. OpenFive offers end-to-end expertise in Architecture, IP Integration, Design Implementation, Software, Silicon Validation, and Manufacturing to deliver high-quality silicon in advanced nodes down to 5nm.

With spec-to-silicon design capabilities and customizable platforms and differentiated IP for Artificial Intelligence, Datacenter/High-Performance Computing, Networking, and Storage applications, OpenFive is uniquely positioned to deliver highly competitive domain-specific SoCs customized for your application. Visit www.openfive.com to learn more...

For any questions and comments, you can email us at info@openfive.com
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