High-Frequency EMC Design Verification through EM Simulations and Measurements in a Reverberation Chamber
Speaker: Alpesh Bhobe, Cisco Systems, Inc, San Jose, CA, USA
Abstract: This presentation will cover three-dimensional (3D) EM simulation techniques to analyze radiation characteristics of various electrical and mechanical components used on printed circuit board (PCB) and electronic chassis. The talk will cover several examples such as optical connectors (SFP+, QSFP, etc.), “special” EMI features on a chassis, heat sinks, air-vent structure as well as gasket and absorbing materials that are verified in simulation and measurements from 1-40 GHz.