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Design with Ultra HDI
How do you take advantage of this technology?
It can improve reliability, signal integrity, and RF performance - with dramatic reduction in size and weight.
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Design Guidelines from the experts:
https://asc-i.com/application/files/5116/8332/3030/ASC_UHDI_Brochure_April_2023.pdf
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Practical advice from Design thought leaders in our UHDI e-bulletins
https://asc-i.com/about-us/asc-newsletter
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White papers – by Eric Bogatin, Ph.D.
Ultra-Fine Line Differential Pair Design with No Return Plane
Utilizing Fine Line PCBs with High Density BGAs
Exploring Design Space for Fine Line Differential Pair Transmission Lines
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Key tips from design thought leaders
Learn from John Watson of Altium, Steph Chavez of Siemens, Dan Beeker of NXP and Eric Bogatin, Ph.D. of the University of Colorado. Their impressive credentials and are below these points …
Skillset starts with mindset: keep your mind open. Ultra HDI technology isn’t that new, we just need some new skills for it.
Before diving into techniques for Ultra HDI, be sure you understand the fundamentals of electronics and PCB design principles: circuitry, signal integrity, high-speed, and manufacturing processes.
The geometries involved in the newer devices present simple problems. The structures are reduced, so the impact on the signals is ratiometric. No advanced math is needed. With just a belief in geometry and spaces, you will be able to face any challenge, from the most advanced network server design to high-power automotive electric inverters.
Focus on the science. Energy is governed by simple rules, and the EM fields always follow those rules. If you understand that energy moves in the spaces and use your PCB design to create those spaces, you can take advantage of all the new advances in IC and PCB fabrication technology.
The first purpose of the high-density substrate: provide the connectivity required. Second purpose: to not screw up the signal or power integrity. The next issue is: how to design them to avoid cross talk, switching and reflection noise. It’s all about that space!
Understanding the difference in thermal performance poses another key issue. These structures are extremely small compared to traditional drill technologies, and creating structures that can help dissipate the heat these new ICs create may be the biggest challenge. Learn to embrace thermal modeling. Your product life will depend on it.
Using newer technology can be an energy shot for your whole team. What has developed in the chip world is moving into the PCB realm. It is easier for a PCB designer to learn the skillset of chip design than vice versa: as a chip designer, you create one building on a city block…as a PCB designer, you create the whole city.
Stay within the pocket for success: call your fabricator – they have a vested interest in your projects.
We enable new Design freedoms for your work on Defense, Medical, and Commercial applications. Talk with John Johnson at jjohnson@asc-i.com
Contributors
Eric Bogatin, Ph.D. is a professor at the University of Colorado, Boulder where he teaches undergraduate and graduate courses on signal integrity and system design. He is the Dean of the Teledyne LeCroy Signal Integrity Academy (www.beTheSignal.com) and is a Fellow with Teledyne LeCroy. He is also the technical editor of the Signal Integrity Journal. He has written eight technical books and presents classes and lectures worldwide.
Stephen “Steph” V. Chavez has 30 years of Design experience in HDI, multi-layer rigid, flex, rigid-flex and hybrid PCBs containing analog, digital, RF, mixed signal, high speed and high power technologies. As Chairman of the Printed Circuit Engineering Association (PCEA), Steph serves as head of an international industry organization. He is also a Master Instructor Trainer (MIT) for the IPC Designer Certification program (CID and CID+).
Dan Beeker has 40+ years of experience in electronic system design and EMC. He provides application support for NXP Automotive customers worldwide, and those with special function development tools and instrumentation. Dan teaches field-based design techniques at NXP and industry conferences worldwide, and is involved with IC package design and EMC test fixture design.
John Watson, CID has an electronics career spanning over 40 years. He has worked with Teledyne API, Emerson Computer Power, and Legrand Corporation, and proudly served in the US Army in the Military Intelligence field. Currently, he is an Altium Customer Success Manager, teaches advanced PCB Design at Palomar College, and is a columnist for IConnect-007 magazine. John is the author of two Library and Data Management books, and is a speaker/instructor in the USA, Europe, and Asia.
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