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I invite you to join your colleagues in Dallas, Texas, USA for the 2026 EMC+SIPI Symposium.
The 2026 Symposium will offer a diverse array of opportunities to engage with and contribute to the technical program. For individual contributors, we welcome Traditional 4- to 6-Page Technical Papers, which can be presented in either a classroom session or as a poster. Submit your papers by Friday, January 16, 2026 and secure your place in this premier event!
This year, the Technical Program Committee is highlighting several new special topics that reflect current advances and emerging challenges in our field:
- Chip-level EMC
- Urban Air Mobility (UAM) and EMC requirements
- Emerging EMC challenges in Military and Space applications
- EMC and SIPI for Data Centers and High-Speed Digital applications
- AI/ML application to EMC and SIPI problems
We encourage you to consider these focus areas when preparing your technical submissions, and to review all important deadlines shown below and outlined in the Call for Submissions.
Join us to share your expertise, ask questions, learn from innovators, and explore the latest products at the 2026 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity.
Thank you in advance for your valuable contributions to the Technical Program.
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