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Prof. Xing-Chang Wei
Professor of College of Information, Science & Electronic Engineering, Zhejiang University, China
Xing-Chang Wei received the Bachelor, Master, and PhD degrees in the electromagnetic field and microwave engineering from Xidian University, China, in 1995, 1998, and 2001 respectively. From 2001 to 2010, he was with the A*STAR Institute of High Performance Computing, Singapore, as a Research Fellow, Senior Research Engineer, and then Research Scientist. He was the visiting scholar of University of Illinois Urbana-Champaign in 2015. In 2010, he joined Zhejiang University, China, as a Full Professor.
His main research interests include near-field scanning, power integrity (PI), and electromagnetic interference (EMI) simulation and testing. He has more than 20 years research experiences of the electromagnetic compatibility (EMC) modeling and design of the high-speed printed circuit boards and packaging. He has authored one book, a book chapter, and about 200 papers published in IEEE Transactions and IEEE international conferences. He received the 2007 Singapore Institution of Engineers Prestigious Engineering Achievement Award for his contribution on the development of the reverberation chamber, and New Century Professional Award from China Ministry of Education in 2010.
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