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Tuesday, November 17, 2020
6:00 - 7:30 PM, China Standard Time
5:00 - 6:30 AM, EST
The EMC Society's Distinguished Lecturer (DL) Program provides speakers on various aspects of electromagnetic compatibility for EMC Society chapter meetings and similar functions. Since we have been unable to schedule lectures at in-person chapter meetings, we are providing an opportunity to learn virtually from our experts on their respective topics of interest.
Heterogeneous 3-D Integration of a Millimeter-wave Transceiver Module and EMC Applications
Presentation Title: 
Heterogeneous 3-D Integration of a Millimeter-wave Transceiver Module and EMC Applications

Speaker: Prof. Liang Zhou

Abstract: Three-dimensional integrated design technology can provide a single standard electronic system with multiple functions and is the most important method to enhance the technical performance of modern ICs and expand their capabilities. 3-D ICs based on system in package will significantly improve the RF performance of a transceiver by integrating the system-on-chip made by different materials, such as GaAs, silicon, or even GaN semiconductors. A transceiver can accommodate digital, analog, millimeter-wave, and other circuits, as well as a large number of miniaturization of passive components embedded in a multilayer substrate. Thus, the integration can be achieved through a 3-D multifunctional circuit. Vertical through-hole array can improve the bandwidth of interconnections, reduce interconnection losses, shorten signal delay, and improve transmission rate and signal integrity. In this talk, ultra-wideband signal transmission attenuation, delay, waveform distortion, high frequency crosstalk, and self-excited oscillation signal integrity problems will be discussed. The model of the multi-input/multiple-output high-density interconnect vias and multichip array superimposed signal flow distribution network with hybrid integrated 3-D structure are investigated. Signal integrity, such as suppression of electromagnetic leakage, substrate coupling noise, and interchip ultra-wideband noise coupling is studied.
Prof. Liang Zhou is a full professor with the School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University. His main research interests include system on packaging (SoP) design and modeling, EMC and High Power Microwave (HPM) protection of communication platforms, and multi-physics and its application.

He received the Ph.D. degree in electrical engineering from the University of York, UK, in 2005. From 2005 to 2006, he was a Senior RF Engineer with Motorola INC, Shanghai, China, where he was involved in power amplifier design for the next generation of base station transceivers. Since May 2006, he joined the Key Laboratory of the Ministry of Education of Design and Electromagnetic Compatibility of High-Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai, China, as an assistant professor and then an associate professor. He has been a visiting scholar with the Massachusetts Institute of Technology, Cambridge, USA since 2007. From January 2017, he became a full professor in electromagnetic fields and microwave techniques with the School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China. From February 2017, he is a Research Fellow with the Institute for Electronics Engineering (LTE) of the Friedrich-Alexander-University Erlangen-Nurnberg, Germany, granted by the Alexander von Humboldt-Stiftung, Germany. He is the IEEE EMC Society Shanghai Chapter Chair since 2015, and an IEEE senior member.

Dr. Zhou was the recipient of Alexander von Humboldt (AvH) research fellowship in 2016, APEMC Young Scientist Award in 2016, the Research Grant of the Okawa Foundation (Japan) in 2016, the International Union of Radio Science (URSI) Young Scientist Award in 2014, the best paper awards of Cross Strait Quad-Regional Radio Wireless Conference (CSQRWC) in 2014, and the National Science and Technology Advancement Award of China in 2012.
All lectures are presented live and the DLs will be available for live Q&A.
Alpesh Bhobe
November 19
6-7:30 PM EST
High-Frequency EMC Design Verification through EM Simulations and Measurements in a Reverberation Chamber
Michael McInerney
November 24
6-7:30 PM EST
Facility/Building EM Shielding and Grounding
Seungyoung Ahn
November 24
6-7:30 PM
China Standard Time
Semiconductor Electromagnetic Compatibility Modeling for Power Devices and Packages
DV Giri
December 3
11AM-12:30 PM EST
Therapeutic and Diagnostic Uses of EM Energy in Emerging Medical Technologies
Marcos Rubinstein
December 8
6-7:30 PM Central European Time
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