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WEDNESDAY, JANUARY 13, 2021
1:00 PM (EST)
Automotive technology is rapidly advancing with increasingly connected vehicles. Please join us for this informative and timely LIVE webinar to hear the latest developments in vehicle cybersecurity and related standards.
Introduction to Vehicle Cybersecurity
Speakers:
Paul Wooderson, HORIBA-MIRA, Cybersecurity Principal Engineer
and
Flynn Lawrence, Supervisor, Applications Engineering, AR RF/Microwave Instrumentation

Abstract: This presentation will provide an introduction to vehicle cybersecurity, outlining some typical threats to increasingly connected vehicles and how the automotive industry is responding. We will give an overview of the emerging standards and regulations, and the importance of adopting both proactive and reactive cybersecurity engineering approaches to manage the evolving risks. A live Q&A session with the speakers will follow the presentation.
Speaker Bios:
Paul Wooderson, MEng CEng MIET, is Cybersecurity Principal Engineer and leads the cybersecurity team in HORIBA MIRA’s Vehicle Resilience department. He is a Chartered Engineer with 19 years’ experience in embedded systems security in the automotive and previously smartcard domains. Paul's responsibilities include cybersecurity engineering R&D, consultancy, testing and assessment. He is a UK Expert to the international ISO and UNECE working groups developing new standards and regulations for cybersecurity engineering and software updates for road vehicles. He has played a lead role in the recent cybersecurity-related collaborative research projects ResiCAV, 5StarS and UK CITE, and has several publications on side channel attacks and automotive cybersecurity engineering.

Flynn Lawrence is the Supervisor of Applications Engineering for AR. Flynn is actively engaged in new application and product development, worldwide sales and customer support, as well as hardware demonstrations and training. Prior to AR, Flynn was an EMC Systems and Test engineer working on military and commercial space programs.
Webinar Sponsored by
#IEEE_ESP21