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The MRSI-705HF 5-Micron High Force Die Bonder stands at the forefront of advanced assembly solutions for high-frequency and optoelectronic packaging, setting new benchmarks for precision, speed, and application versatility.
A distinguishing feature of the MRSI-705HF is its heated bond head, which delivers up to 500N of programmable force during the bonding process, while supplying top-side heating up to 400°C. This high-force, high-temperature capability makes the MRSI-705HF an exceptional tool for demanding processes such as sintering for power semiconductors and thermocompression bonding for IC packaging.
Sintering, a sophisticated heat-treatment process, is used to enhance the strength, integrity, and conductivity of the connection—making it the preferred solution for robust interconnects in power electronics. The MRSI-705HF is fully capable of silver sintering, which is vital for applications requiring high thermal and electrical performance, including the assembly of CZT X-ray sensors.
Thermocompression bonding, which leverages both elevated pressure and temperature, enables the creation of strong, reliable bonds between dies and substrates, further expanding the reach of the MRSI-705HF into the most challenging packaging environments.
Designed for manufacturing robustness and flexibility, the MRSI-705HF features a configurable platform with the largest installed base in the industry for advanced packaging. It integrates advanced vision alignment and motion control technologies, providing 5 micron placement accuracy essential for frequency-sensitive and high-performance devices. The system’s process flexibility—supporting a broad range of package types, die sizes, and bonding materials—means manufacturers can adapt quickly to evolving product requirements without significant downtime. Contact us today!
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