Explore the MRSI-H Augmented Reality Experience

Experience the MRSI-H through interactive augmented reality. Rotate, zoom, and explore the system from every angle while discovering how this flexible, high-speed flip-chip die bonder delivers 1.5-micron accuracy for demanding high-volume production environments.

MRSI Spotlight: Mycronic US Summer Barbeque

This month, our team enjoyed a well-deserved break at the annual summer barbeque, celebrating achievements and welcoming new colleagues. The event highlighted how teamwork drives innovation and reinforced our appreciation for moments spent together.

IFOC & CIOE | MRSI Mycronic Showcases AI Optical Module Packaging Solutions Across Two Major Events

At IFOC 2026 Conference, Dr. Limin Zhou, General Manager of MRSI Mycronic in China, delivered a keynote speech and joined a panel discussion. He noted that packaging is shifting from a follower to a leader, now defining the performance ceiling of optical modules. He highlighted the MRSI-LEAP 1μm ultra-high-speed die bonder, designed for high-speed AI optical transceivers. Its proprietary multi-die synchronous eutectic process technology enables multiple tips to pick and place dies in parallel with independent force control, completing bonding in a single heating cycle — eliminating multiple-reflow risks. Paired with the fully automatic MRSI-A-L optical coupling platform, it covers the full process from die bonding to coupling, supporting customers' high-volume production.

At CIOE 2026, the MRSI Mycronic team engaged with customers and partners on AI optical module packaging solutions. Dr. Limin Zhou gave an exclusive interview with CIOE, while Dr. Kishore Lankalapalli, MRSI’s Director of Engineering, also gave an interview with OFweek.

At both IFOC and CIOE, MRSI Mycronic showcased its advanced assembly solutions for a full range of AI optical modules and reinforced its position as an industry technology leader through its technical expertise and forward-looking vision.

Laser World of Photonics India

Laser India was collocated with Electronica India and Productronica India, both of which catered to electronics assembly. Our observation is that the electronics assembly industry is maturing in India and the photonics industry is emerging. MRSI intends to be ready when the photonics industry blossoms.

The MRSI team included: Marco D’Aquino of our distributor, Distek; Dr. Kishore Lankalapalli, Director of Engineering; Bruno Afonso, Director of EMEA and Emerging Markets; Irving Wang, Director of Marketing; and Arvind Joshi of our local distributor Accurex. Accurex has been a valued Mycronic partner for 26 years, and we are now expanding our presence in its product lineup. 

European Conference on Optical Communications


ECOC was highly successful, attracting strong booth traffic and enthusiastic interest in exploring MRSI solutions through an engaging, interactive experience. The show generated positive discussions, with AI and CPO projects driving market activity. Interest from outside Europe was also strong, potentially indicating increased R&D or manufacturing activities.

We also appreciated the support of our distributor, Distek, represented by Marco D’Aquino, along with MRSI Mycronic colleagues Francesca Navarro, Product Manager, and Bruno Afonso, Director of EMEA and Emerging Markets.

Blog Insights

Meet MRSI Around the World

From advanced packaging and semiconductor manufacturing including active alignment, dispensing to photonics and optical communications, MRSI Mycronic will be participating in industry-leading events across North America, Europe, and Asia from August through November 2026. We look forward to collaborating with customers, partners, and industry colleagues to discuss the latest manufacturing challenges and technology trends.

MRSI-H1: Comprehensive High-Precision Die Bonding Solutions

In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its ultra-precision 1-micron flip-chip die bonders. These machines are not only flexible and fast, but also ideal for a wide range of applications.

Watch MRSI’s Software Training Videos

MRSI has released a comprehensive set of software training videos that are designed to help users get the most out of their MRSI Machines. These videos cover a wide range of topics and are suitable for both beginners and advanced users.

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