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In advanced electronics assembly and packaging, precision and process control are very important. Whether manufacturing microwave modules, optical devices, hybrid circuits or semiconductor packages, having a dispensing system that can handle even the most demanding applications with accuracy and flexibility is critical.
The MRSI-175Ag Epoxy Dispenser is a high-performance pneumatic dispenser for demanding electronics packaging applications. This powerful system features dual dispensing heads for comprehensive process control and tandem material dispensing.
Engineered for conductive silver-filled epoxies, the MRSI-175Ag provides exceptional repeatability, speed, and precision. Its servo-controlled axes can routinely dispense 250µm dots with 100% area coverage and tight bond line tolerances.
From die attach and underfill to encapsulation and multi-pin stamping, this flexible platform adapts to any application need. The intuitive software offers extensive process controls and programming capabilities.
Designed to maximize throughput, the MRSI-175Ag integrates seamlessly with other MRSI bonders and placers. This system delivers unmatched dispensing performance for high-density electronics manufacturing.
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