Featured Product of the Month: MRSI-705HF:

Advancing Die Bonding Technology

MRSI-705HF High Force Die Bonder is designed to meet the highest standards of reliability and performance, this machine is a game-changer for advanced applications in various industries.

• High Force Capability: Capable of applying up to 500N of force, making it perfect for sintering power semiconductors and thermocompression bonding for IC packaging.
• Precision and Stability: Achieves a day-in/day-out accuracy of 5 microns with its thermally and mechanically stable platform.
• Advanced Technology: Features actively cooled linear motors, fast settling times, and advanced air-bearing technology in the Z axis for smooth and precise motion.
• Wide Range of Applications: Suitable for life sciences, aerospace, automotive, and communications sectors.

This remarkable die bonder is engineered to elevate your projects to new heights. Whether you are working with power semiconductors or IC packaging, the MRSI-705HF ensures high-quality, reliable results every time.

Don't miss the chance to revolutionize your operations with the MRSI-705HF High Force Die Bonder. Learn more about how this cutting-edge technology can benefit your business.

Customer Support - Service Contracts

We provide a range of service contract options that offer fixed costs for materials, labor, and expenses related to machine repairs. Additionally, we offer preventive maintenance and calibration programs to ensure your machines operate at peak efficiency. Our comprehensive training programs offer a cost-effective solution, ranging from basic operator training to advanced programming. Please contact us today for more information. 

MRSI Exhibited and Presented at IMAPS New England

Irving Wang, Director of Marketing at MRSI, presented "High Accuracy Die Bonding for Optical Device Packaging" at the IMAPS New England Symposium. This Photonics Packaging session also featured presentations from Bridgewater State University, AIM Photonics, and IBM.

Presentations included:

• "Advances in Low-Loss Chip-to-Chip Couplers and GRIN Technology for Next-Generation Co-Packaged Optics" by Samuel Serna, Bridgewater State University
• "Electronic-Photonic Packaging for Si Photonics" by Colin McDonough, AIM Photonics
• "High-Density Polymer Waveguide Interconnect for Data Centers" by Jean Benoit Héroux, IBM 

International Microwave Symposium

June 15-20th, 2025

San Francisco, CA, USA

Booth #1629

MRSI will exhibit at this year's International Microwave Symposium. Visit Booth #1629 to learn about our latest innovations for microwave and RF applications and speak with our experts about how we can address your application requirements.

NEPCON Thailand 

June 18-21st, 2025

BITEC, Bangkok, Thailand

Booth #9Z05

Blog Insights

• Meet the MRSI-705: Your Essential Tool for Precision and Reliability in Critical Applications
• Precision and Reliability in Defense Electronics: Exploring MRSI’s Industry-Leading Solutions
• Learn more about our active alignment solutions
• Laser Focus World Webinar – Gen AI: Catalyst for Optical Module Innovation

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