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November 2018 
As the Thanksgiving season is upon us, we find ourselves reflecting on the past year and those who have helped to shape our business.  It's been quite a year for us all and we would like to express our sincerest appreciation for the trust you have placed in us. We hope that 2018 has been just as memorable for you, your colleagues and your loved ones. We look forward to working with you in the years to come.

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Best Regards,
 
Dan Patten 
GM, BEST Inc.

Webinar on Practices for
Low Volume, High Mix Assemblies
Please join us for 2 webinars focused on practices for EMS providers who provide "low volume, high mix" electronic assemblies. Modeled after the wildly popular Best Practices seminars presented internationally, these webinars are geared towards EMS companies who go through multiple set-ups during each and every shift.

Date: 
Session #1: December 4, 2018
                  12:00pm - 1:30pm CST

Session #2: December 11, 2018
                  12:00pm - 1:30pm CST

Price:  $150 for both sessions

Overview:
Phil Zarrow, industry consultant, will be sharing his tips and tricks for low volume, high mix EMS providers based on his experience starting, observing, and troubleshooting assemblies, in addition to his experience picking equipment for providers. Phil will cover topics from when a bare board arrives at the shop until it is fully populated, tested, and conformally coated.

Note: After you have attended Session #1,  you will be sent a link for Session #2.

Seating is limited to 100 individuals, 
so sign up fast!

Please contact Alex Conley ( aconley@solder.net ) at 224-387-3256 with any questions.
New IPC Training Schedule
The 2019 Training Schedule for January - June  has recently been released. You can find the schedule here .

If you have any questions about a particular course or would like to receive pricing, please contact Alex Conley ( aconley@solder.net) at 224-287-3256.
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Mirco BGA Rework
BEST recently performed a process development for one of the smallest electronic component footprints we have yet to see. As seen below, the package size was 3000 x 3000 µ m (118 x 118 mils) with a 165 µ m (6mil) pitch using a 75 µ m (3 mil) solder ball diameter. One of the challenges was making sure that the re-flowed air did not "blow away" the device and disturb the solder joints. Another big challenge was the placement accuracy,  given the dimensions and not having any solder mask on the development board.


One of the challenges was making sure that the re-flowed air did not "blow away" the device and disturb the solder joints. Another big challenge was the placement accuracy,  given the dimensions and not having any solder mask on the development board.

Let us know how we can help you in your challenging rework or assembly projects! Contact Laura Ripoli ( lripoli@solder.net ) at 224-387-3255 for any of your rework needs.
BEST Inc.   847-797-9250  |  www.solder.net 
3603 Edison Place, Rolling Meadows, IL 60008