|
Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices at a level never seen before. This expansion with double-digit growth rates is driven by data consumption from cloud computing, web and mobile based applications and storage through hyper scale data centers. The data bandwidth demand from individual consumers and enterprises creates the need to upgrade long haul networks, data centers and metropolitan communication systems.
One key component requiring HVM is chip on submount (CoS). CoS devices present some unique manufacturing challenges. MRSI’s family of die bonders have evolved over a three decade legacy to be ideally suited to address the manufacturing demands of CoS. The unique features of the MRSI die bonders include the following:
- Eutectic stage for CoS – small form factor eutectic stage provides fast ramping heating and cooling cycles and gas flow optimized for small parts.
- Small die handling expertise – LD, PD, Caps and thermistors are easily handled from waffle pack, Gel-Pak™ and wafer.
- Eutectic preform handling – preforms are used when solder is not predeposited, preform are commonly as small as 200 microns square.
- Wafer handling – optimized for small die and handling of III-V materials. Servo motors are used for controlled motion.
- Delicate force control – programmable contact force provides flexibility to apply accurate force as low as 10 grams.
- High precision placement at high speeds – 3 microns placement accuracy at high speeds is achieved through the use of linear motors and encoders combined with a thermally and mechanically stable platform.
- Advanced vision and lighting optimized for CoS – local fiducial alignment of internal features such as facets and tri-color lighting.
- Epoxy dispensing and stamping – controlled epoxy deposition for small parts.
- TO handling experience – for subsequent process steps CoS mounting on a TO CAN requires eutectic combined with stage rotation.
In summary HVM of CoS is a challenging problem requiring unique capabilities from your die attach bonding system. By combining the above features, MRSI Systems delivers a flexible solution, which maximizes product yield, throughput, and process control, to ensure a successful solution for HVM of CoS.
|
