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April 2023 Issue
Featured Articles
Copyright © IEEE
A Machine Learning Integrated 5.8 GHz CW Radar for Honeybee Monitoring and Behavior Classification
A 5.8-GHz continuous-wave (CW) radar was developed and integrated on a compact printed circuit board for near-hive monitoring of honeybees. It supported noninvasive detection of free-flying honeybees at 2 m and micro-Doppler extraction of bee wingbeat signatures at a closer range using both a double-balanced mixer and an in-phase/quadrature (IQ) mixer. The CW radar was integrated with machine learning to allow automated classification of incoming, outgoing, and hovering honeybees.
Copyright © IEEE
Recent Advancements in Reconfigurable mmWave Devices Based on Phase-Change and MIT Materials
This MTT-S 70th anniversary article presents an in-depth overview of the Phase Change Materials (PCM) and metal insulator transition (MIT) materials for various RF circuits. The PCM and MIT-based RF devices are expected to bridge the gap between semiconductor and MEMS switches as they combine the low insertion loss performance of MEMS technology and the small size and reliability performance of semiconductor technology. 
Copyright © IEEE
Design, Simulation, and Characterization of MEMS-Based Slot Waveguides
This paper presents a design approach for dielectric slot waveguides fabricated in highly resistive silicon (HR-Si) designed for operation in the terahertz (THz) frequency range.
Copyright © IEEE
Vertically Integrated Coaxial Resonator-Based Multiband Bandpass Filters
This letter shows a multiband RF filtering concept and a compact low-loss integration scheme for coaxial resonator-based multiband bandpass filters (BPFs). Size compactness is achieved by vertical stacking, subwavelength capacitively loaded coaxial resonators, and 3) monolithic integration enabled by additive manufacturing. Dual-band and triple-band BPFs operating at sub-6 GHz were designed, manufactured, and tested.
Copyright © IEEE
On-Chip Integration of Orthogonal Subsystems Enabled by Broad Twist
This article shows a low-loss compact platform that enables the integration of H-and E-plane rectangular waveguide subsystems enabled by 90° polarization rotation of rectangular waveguide sections on a silicon-micromachined chip. Prototypes are demonstrated in the 220-335 GHz frequency range.
MTT-S News
Upcoming Events/Calls
WAMICON 2023, Melbourne, Florida | April 17-18, 2023

WAMICON will address up-to-date multidisciplinary research needs and interdisciplinary aspects of wireless and RF technology. The theme of WAMICON 2023 is "Microwave and RF Innovations connecting Government, University and Business communities.” We welcome submissions on all aspects of related technologies, including antennas, passive and active circuits, communications and system.
IEEE Texas Symposium, Waco, TX | April 19-20, 2023

The Texas Symposium on Wireless and Microwave Circuits and Systems conference will be held in-person on April 19-20, 2023, at the Baylor Research and Innovation Collaborative (BRIC) building on the campus of Baylor University in Waco, TX. The symposium will include a Plenary talk, several invited talks and tutorials, an exhibition, and a student poster competition and various paper presentations.
IEEE SPI 2023, Aveiro, Portugal | May 7-10, 2023

The IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation.
IMBioC 2023, Leuven, Belgium | Submit by May 1

The 2023 IEEE International Microwave Biomedical Conference (IMBioC) will be held on September 11-13, 2023, in Leuven, Belgium in a physical mode. IMBioC is an international forum to exchange ideas on state-of-the-art research in RF/microwave, antennas, EM theory, and related technologies that bridge the science and engineering gaps applied biomedical systems. Submission deadline is May 1, 2023.
Editorial Board
Editor-in-Chief
Dr. Hjalti Sigmarsson
University of Oklahoma, USA
Managing Editor
Dr. Tejinder Singh
Dell Technologies, Canada
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