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February 2026 Issue

Upcoming Webinars


  • March 10, 2026 | Lessons from the 3MT: Crafting and Delivering Clear, Brief, and Memorable Scientific Presentations| Erin Kiley (Massachusetts College of Liberal Arts) Register Now


  • April 11, 2026 | Quantum versus Physical Coupling of Entangled Quantum Resonators| Abbas Omar (University of Magdeburg, Germany)


See Upcoming MTT-S Webinars

Missed a webinar? Check out the IEEE Resource Center for archived webinars


Click to See Archived Webinars

Call for Papers Deadlines


  • March 15, 2026 | 2026 International Telecommunications Conference (ITC-Egypt)| Call for Papers



  • March 23, 2026 | 2026 International Topical Meeting on Microwave Photonics (MWP)| Call for Papers



  • March 23, 2026 | 2026 51st International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)| Call for Papers





  • March 31, 2026 | 2026 IEEE International Conference on Additively Manufactured Electronic Systems (AMES)| Call for Papers



  • April 9, 2026 | IMS2026 Joint RFSA/RFTT Late Breaking News Paper Submission| Call for Papers



  • April 13, 2026 | 2026 IEEE International Conference on Quantum Computing and Engineering (QCE)| Call for Papers



  • April 15, 2026 | 2026 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)| Call for Papers



  • May 1, 2026 | 2026 IEEE International Conference on RFID ­­­Technology and Applications (RFID-TA)| Call for Papers




See More MTT-S Sponsored Conferences

Call for Applications!

Be the Next

Editor-in-Chief of the

IEEE Microwave Magazine

The IEEE Microwave Magazine publishes peer-reviewed overview, tutorial and short application articles describing any aspect of radio frequency/microwave through millimeter-waves and terahertz engineering within the IEEE Microwave Theory and Technology Society’s field of interest. IEEE Microwave Magazine also includes the President's message, committee reports, book reviews, conference and meeting schedules and reports, and other articles of interest to members of the IEEE Microwave Theory and Technology Society (MTT-S).


The Editor-in-Chief (EiC) of IEEE MM is responsible for implementing the publication program. This includes overseeing the entire publication process from assignment of in-scope peer-reviewed research and overview papers submitted to the IEEE Author Portal to associate editors, to overseeing the review process and taking final decisions on papers. The EiC will also work with MTT-S Technical Committees to provide content for focus issues, as well as the Steering Committees of the International MTT Symposia and Radio and Wireless Week to provide preview content for their respective conferences in the May and December issues. The EiC will work with various MTT-S Administrative Committee (AdCom) committees to provide editorial content that is of interest to the MTT-S membership, including reports from AdCom committees as well as MTT-S affinity groups, as well as advertising representatives. Tasks of the EiC also include long-term planning for the magazine. The EiC is expected to provide a detailed report on the status of the magazine at least three times a year to the MTT-S AdCom, to attend the annual Panel of Editors meeting, and to promote MTT-S publications at select international conferences.


An ideal candidate should have past editorial experience, preferably as a Track, Associate, and/or Guest Editor of leading MTT-S journals or equivalent, and volunteer experience within the professional MTT-S technical community.


If interested, please submit the following application materials:


  • Curriculum vitae (CV) of no more than three (3) pages
  • A personal statement about the future of IEEE Microwave Magazine
  • Endorsement letters highlighting editorial and other accomplishments and potential (optional)


Applications should be emailed to:

Dr. Imran Mehdi:

Imran.mehdi@jpl.nasa.gov

Dr. Robert Caverly:

r.caverly@ieee.org


Please use the following subject line of the email: “IEEE MM Editor-in-Chief Application.”


For full consideration, the material should be received by March 15, 2026



MTT-S Volunteer Spotlight

Prof. Changzhi Li is the new EiC of IEEE TMTT!

We are pleased to announce that Prof. Changzhi Li will serve as the Editor-in-Chief of the IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES from 2026-2028.


Prof. Li is with the Department of Electrical & Computer Engineering at Texas Tech University, Lubbock, TX, USA.


The full biography of Prof. Li is available here.

Do you have a friend or colleague who is doing great things as an MTT-S Volunteer? Nominate them to be featured in the e-newsletter volunteer spotlight! Click the button below:

Featured Articles

Copyright © IEEE

Computational Optimization Techniques to Design RF Circuits

We present a comprehensive review of computational optimization techniques for the design of RF circuits. Important design techniques used to optimize RF circuits, such as genetic algorithms (GAs), particle swarm optimization (PSO), reinforcement learning (RL), Bayesian optimization (BO), and space mapping (SM), are discussed. The basics of the techniques, their merits, and their drawbacks are covered so that new researchers can understand the relevant theories of the techniques. A comparative analysis of design techniques is included. This article also provides insights into the present state and future directions of the optimization techniques.

Copyright © IEEE

3-D-Millimeter Wave Integrated Circuits (3D-mmWIC) Using GaN-on-Si Dielets With Si CMOS for 5G FR2 Power Amplifiers

This work details the development of a 3-D-millimeter wave integrated circuit (3D-mmWIC) platform for the integration of highly scaled gallium nitride (GaN) dielets with Si CMOS for the fabrication of high-frequency circuits and systems. Au-free AlGaN/GaN-on-Si high-electron mobility transistors (HEMTs) with Lg=80nm are fabricated and singulated to a size of 240×410μm2 for the fabrication of the dielet front-end-of-line (FEOL). The dielets are integrated with an Intel 16 Si CMOS back-end-of-line (BEOL) using a solder-free, direct Cu–Cu thermocompression bonding (TCB) process. The developed process is used for the demonstration of several power amplifiers (PAs) targeting the fifth-generation (5G) new radio (NR) frequency range 2 (FR2) bands. Large signal characterization is completed with testing under 64, 256, and 1024-quadrature amplitude modulation (QAM) schemes.

Copyright © IEEE

An 8.3–43 GHz CMOS Low-Noise Amplifier With Wideband Input Matching

An 8.3-43GHz CMOS low-noise amplifier (LNA) with wideband input matching is presented. A gate–drain transformer feedback combined with a series–shunt resonance network is employed in a complementary common-source (CCS) input stage to achieve a broadband, impedance-stable input, and noise matching. A transformer-loaded cascode output stage is implemented to enhance gain, while a pole-tuning technique is adopted to achieve a broadband gain response. Fabricated in 65nm CMOS, the LNA achieves a peak gain of 14.7dB and a 3dB bandwidth from 8.3 to 43GHz with a fractional bandwidth of 135.3%. Good input matching is maintained across 8-55GHz. The input 1dB compression point (IP1dB) ranges from -14.3 to -9.3dBm. A minimum noise figure (NF) of 3.47dB is measured, and the power consumption is 25.9mW under a 1.2V supply.

Copyright © IEEE

Design of a Wideband and High Isolation Millimeter-Wave GaN Monolithic Integrated Switch Using Bandpass Matching Network

This work presents a novel bandpass matching network (BMN) based switch design methodology. Theoretical analysis shows that, compared to conventional low-pass matching network (LMN) based designs, the proposed approach enables the upward shift of the operating band while maintaining impedance matching and enhancing isolation. This makes the method particularly suitable for realizing wideband, high-frequency switches with high isolation in semiconductor technologies with limited transition frequency (fT). To validate the concept, a seventh-order single-pole single-throw (SPST) switch was designed and fabricated using a 0.15μm GaN-on-SiC process with a nominal fT of 35GHz. Measurement results show that the proposed switch achieves an insertion loss below 2dB and isolation greater than 33dB across the 15-40GHz band. Moreover, the design demonstrates excellent linearity, with a measured third-order input intercept power of 49-52dBm.

MTT-S News and Announcements

IMS2026 is excited to announce a joint RFSA/RFTT Late Breaking News paper submission for 2026!  


Showcase your latest groundbreaking research and results at the most prestigious symposium in the field of RF and microwave engineering!  


View the Call for Papers


Key Dates:

  • Submission Site Opens: 2 April 2026 
  • Submission Deadline: 9 April 2026, 23:59 Hawaii Time 
  • Notification of Acceptance: 20 April 2026 
  • Copyright Form and Slide Submission Deadline: 1 May 2026 


Due to the tight timeline and turnaround times required, the papers must be submitted camera ready, unblinded, and changes to the manuscript after review will not be accepted

The IEEE Microwave Theory and Technology (MTT) Society annually recognizes distinguished individuals or teams for their meritorious achievements and/or outstanding technical contributions in the field of microwave theory and technology.


The deadline for nominations for the 2026 MTT-Society Awards is July 31, 2026.


Nomination forms can be downloaded from the individual awards‘ descriptions presented at https://mtt.org/award-nominations/, where further general and specific information is given, and shall be submitted to mttawardschair@ieee.org.



Robert Weigel (r.weigel@ieee.org) is the MTT-S Awards Committee Chair and is with the Friedrich-Alexander-Universität Erlangen-Nürnberg, Germany.

The 2026 IEEE International MTT Symposia (IMS2026) is the most prestigious symposium in the field of RF and microwave engineering. 


Don’t miss your chance to take advantage of the numerous opportunities available for students including Student Ambassadors, Student Design Competitions, PhD Student Sponsorship Initiative and Project Connect!


Visit https://ims-ieee.org/students to learn more and apply!


Upcoming Events


The annual IEEE Wireless and Microwave Technology Conference (WAMICON 2026) plans an engaging program in Clearwater, Florida in April 2026. 2026 marks the 27th year anniversary of WAMICON which addresses multidisciplinary research and technology trends in RF, Microwaves, and Wireless Communications. The program includes both oral and poster presentations as well as workshops, tutorials and special sessions. WAMICON 2026 will be highlighting “Intelligent Heterogeneous Radio Hardware and Emerging Devices for Next-G Wireless and Beyond”. WAMICON will also host a generous number of sponsors and exhibitors bringing the latest state-of-the-art products and capabilities to display.

The International Conference on Microwave Acoustics & Mechanics (IC-MAM) represents a unique and unprecedented opportunity to bring together researchers and practitioners of different background (materials scientists, physicists, microwave engineers and process technologists), to share the most recent advances in new materials and manufacturing processes as well as components and devices, which represent the key for the development of future RF, microwave, mm-wave and THz devices, circuits and systems based on RF-MEMS and Acoustics. IC-MAM is organized by the IEEE Microwave Theory and Technoloy Society (MTT-S). The conference features an exciting technical program and invited talks by worldwide recognized experts of RF-MEMS and BAW/SAW technologies.


Editorial Board

Editor-in-Chief

Joel Arzola

Raytheon


Managing Editor

Amanda Scacchitti

The Albero Agency, Inc

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