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July 2026 Issue

Call for Papers Deadlines




  • August 3, 2026 | 2026 IEEE MTT-S Latin America Microwave Conference (LAMC)| Call for Papers


  • August 3, 2026 |2026 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON)| Call for Papers


  • September 14, 2026 | International Conference on Future Telecommunications and Artificial Intelligence (IC-FTAI) | Call for Papers


  • September 20, 2026 | September 14, 2026 | International Conference on Future Telecommunications and Artificial Intelligence (IC-FTAI) | Call for Papers


See More MTT-S Sponsored Conferences

Upcoming Webinars


  • August 11, 2026 |AI-based Topology Discovery for RF and millimeter-wave Integrated Circuits | Harish Krishnaswamy, Columbia University


See Upcoming MTT-S Webinars

Missed a webinar? Check out the IEEE Resource Center for archived webinars


Click to See Archived Webinars

 

REMINDER:

IMS2031 General Chair:

Call for Applications

Deadline: August 31, 2026 

The IEEE MTT-S International MTT Symposia (IMS) is the flagship symposium for the IEEE Microwave Theory and Technology Society. The IMS General Chair provides the leadership, management, drive, enthusiasm, support, and coordination that is necessary for executing a successful symposium. The General Chair should be a skilled manager that is familiar with management tools commonly used in business such as basic accounting, databases, and project management. The General Chair should also be skilled at managing people and keeping them motivated. The General Chair should suggest new initiatives representing innovation from prior years, while also leveraging the experience of the seasoned team of professional conference and exhibition managers and previous IMS steering committees.


The IMS Leadership Search Committee is currently soliciting General Chair applications for IMS2031, to be held June 1-6, 2031 in Boston, MA. The deadline for applications is August 31, 2026.

Forward your queries to the IMS Leadership Search Committee Chair Wayne Shiroma at ims.leadership.search@gmail.com


The application form can be found here: Application Form


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Technical Articles

 
Copyright © IEEE

Forging the Future of Sustainable Connectivity: Hyperflexible and Multifunctional RF Filtering Technologies

This article presents a comprehensive overview of the state-of-the-art, design trends, and challenges in the field of highly reconfigurable and co-designed RF/microwave filtering devices. Starting with BPFs with tune-all capabilities in terms of center frequency, BW, TZs, out-of-band rejection profile, and even type of filtering function, their co-integration with other RF functionalities in highly adaptive co-designed circuits are also addressed: e.g., low-noise amplification, phase shifting, attenuation, isolation, and nonmagnetic nonreciprocity by means of STM and transistor-based configurations. Subsequently, the topic of highly adaptive multiband BPF and BSF components for multi-RF-signal-acquisition and multi-RF-interference-suppression tasks is covered. Furthermore, other design trends and challenges in this exciting field are briefly discussed.

 
Copyright © IEEE

Fully Tunable Dual-Band Filter Based on λ/4 Resonator With Independently Controlled Fundamental and Harmonic Modes

This article presents higher-order independently tunable dual-band bandpass filters (BPFs) with constant absolute bandwidth (CABW) based on odd-modes-only quarterwavelength (λ/4) resonators. The main contribution is breaking the intrinsic tuning interdependence between the fundamental (f1) and third-harmonic (f3) modes, enabling compact λ/4 structures to realize higher-order BPFs. This is attributed to the first-time creation of an internal artificial voltage null point of f1 (A-VNP1) by series varactor-loading. By series-loading a varactor at the current null point of f3 (CNP3) and parallel-loading another at the A-VNP1, a dual-mode dual-null-point loading scheme is established, achieving independent tuning of f1 and f3. Based on this mechanism, third- and fourth-order prototypes are designed and measured.

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MTT-S News and Announcements

The IEEE Microwave Theory and Technology (MTT) Society annually recognizes distinguished individuals or teams for their meritorious achievements and/or outstanding technical contributions in the field of microwave theory and technology.


The deadline for nominations for the 2027 MTT-Society Awards is July 31, 2026.


Nomination forms can be downloaded from the individual awards‘ descriptions presented at https://mtt.org/2027-mtts-awards-nominations/, where further general and specific information is given, and shall be submitted to mttawardschair@ieee.org.



Robert Weigel (r.weigel@ieee.org) is the MTT-S Awards Committee Chair and is with the Friedrich-Alexander-Universität Erlangen-Nürnberg, Germany.

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MTT-S Volunteer Spotlight

Building the Next Generation: A Global Online 1:1 Mentoring Pilot Initiative Within the IEEE Microwave Theory and Technology Society

In a rapidly evolving engineering landscape where technology cycles are accelerating and interdisciplinary skills are becoming essential, the need for structured, meaningful mentorship has never been greater. Recognizing this, the IEEE Microwave Theory and Technology Society (MTT-S) is launching a globally accessible, structured 1:1 mentoring pilot program, aimed at strengthening professional development, fostering leadership, and building a more connected global community. This initiative is coordinated under the MTT-S Broadening Participation Committee (BPC) and the Young Professionals Committee, reflecting a joint commitment to expanding access, fostering inclusion, and supporting early-career and midcareer professional development across the global MTT-S community.


This program builds upon the broader IEEE mentoring framework and leverages modern collaboration platforms to create scalable, high-quality mentor–mentee relationships across geographies, career stages, and technical domains.

Read the the full article

Do you have a friend or colleague who is doing great things as an MTT-S Volunteer? Nominate them to be featured in the e-newsletter volunteer spotlight! Click the button below:

 

Technical Articles

 
Copyright © IEEE

Reconfigurable Dual-Band Millimeter-Wave Filter Based on GaAs Technology

An on-chip reconfigurable dual-band millimeterwave (mmWave) bandpass filter (BPF) is presented in a GaAs integrated-varactor platform. Independently tunable passbands with asymmetric reconfigurability are realized using a parallelcoupled topology comprising a varactor-loaded half-wavelength resonator and a dual-mode capacitor-loaded resonator, which effectively decouples the two bands, a functionality seldom demonstrated in reported on-chip mmWave filters. The lower band tunes from 25 to 26.5 GHz with 10.2% FBW and 3.48–4.16 dB insertion loss, whereas the upper band tunes from 35.25 to 37.25 GHz with a reconfigurable 4.4–9.2 GHz bandwidth and 3.7–5.15 dB insertion loss. Good linearity is achieved, with a maximum IIP3 of 30 dBm.

 
Copyright © IEEE

Flexible Loop Tunable Antenna for Optimized LC Sensor Integration in Salivary Analyte Applications

This paper presents the design, fabrication, and performance evaluation of a flexible loop antenna integrated with LC sensors for wireless dielectric sensing in oral care applications. The antenna, implemented on a flexible substrate, enables conformal placement and reliable inductive coupling with passive LC sensors, facilitating non-invasive detection of dielectric property changes in biofluids. The flexible antenna was also tested at various bending angles. Two sensor types—big and small spiral laminated LC structures (BSL and SSL) were characterized under various test media, including deionized water, artificial saliva, and multiple concentrations of rosemary essential oil emulsions. Experimental results demonstrate stable resonance behavior under mechanical deformation and effective frequency shifts corresponding to liquid permittivity changes.

 

Upcoming Events

 

The 2026 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT 2026) is the premier forum bringing together leading researchers and industry practitioners in RF, mm-wave, and system-level integration. Hosted in the scenic coastal town of Yehliu, New Taipei City, Taiwan, from August 24-26, 2026, the conference offers cutting-edge sessions on device technologies, packaging, mm-wave and THz systems, and emerging applications from 5G/6G to IoT and automotive radar.


RFIT 2026 welcomes researchers, circuit and system designers, packaging specialists, industry engineers, and junior scholars who are working on RF/microwave/mm-wave front-ends, integration, and systems. Participants will gain insights on state-of-the-art device technologies, packaging strategies, system integration for 5G/6G/IoT, and network with global experts.


The 2026 IEEE International Conference on Additively Manufactured Electronic Systems addresses research, development, and applications of additive and advanced manufacturing for electronic systems.


Topics include printed and hybrid electronics, flexible and stretchable circuits, 3D printed RF/microwave components, antennas and sensors, electronic packaging, and integration for IoT, automotive, aerospace, and wearable systems. The conference aims to foster collaboration among academia, industry, and standards bodies.


Editorial Board

Editor-in-Chief

Joel Arzola

Raytheon


Managing Editor

Amanda Scacchitti

The Albero Agency, Inc

 
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