Call For Nominations
2024-2026 SSCS Members-at-Large
Each year, in the Fall, five of the fifteen members of the AdCom are elected in a rotation pattern to renew one-third of our Members-at-Large.
At this time, we are accepting nominations from our general membership for the 2024 – 2026 Members-at-Large.
The role of a Member-at-Large is to work with the officers and members ex-officio of SSCS to manage the society.
If you know of an individual (must be a current SSCS Member in good standing) that you feel would be a worthy choice to serve in this representative role, please submit your nomination for consideration to [email protected] by February 28th, 2022. Please include the nominee's full name and email address. We will then reach out to the nominee to gather the required documents.
If you have any questions, please email the Society Administrative Office at
[email protected].
More information about the process can be found here: https://sscs.ieee.org/about/governance-sscs-adcom/sscs-adcom-election-and-petition-processes.
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SSCS February Technical Webinar
Presenter:
Davide Tonietto
The Race for Efficiency in Short Reach Wireline
Thursday, February 9th, 2023
11 AM EST
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ZOOM Information Session
Boris Murmann
Thursday, February 15th, 2023
11 AM EST
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IEEE SSCS Young Professionals and Students Mentoring and Networking Session
Join other Young Professionals & Students for a Micro-Mentoring Session on Tuesday February 21st from 6 to 7pm in the Sierra A/B Room.
- Get advice from leading industry experts and professors
- Open to all conference attendees where you can ask questions in a relaxed atmosphere
- Meet with fellow young professionals
SSCS Young Professionals/Students is an international community of enthusiastic, dynamic, innovative members and volunteers. SSCS is committed to helping young professionals evaluate their career goals, polish their professional image, and create the building blocks of a lifelong and diverse professional network. Here you will find benefits specifically for younger Society members, announcements, and information essential for IC professionals and students in the early phases of their careers. Click here for more information.
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ISSCC 2023 WiC Events
Special Evening Event - Monday February 20th
This panel focuses on connectivity for the next generation of communication systems and brings together expert panelists to share their perspectives on topics in IC connectivity across wireless, wireline, chip-to-chip, and optical link communications.
Speakers will present opening statements, which will be followed by a moderated panel on contentious issues being faced in the field of IC connectivity.
Networking Bingo Event - Sunday February 19th
Distinguished panelists from the “Integrated Circuits in an Interconnected World” panel, WiC members, and other participants will play getting-to-know-you bingo to promote engagement between various members of the community. This will give participants the chance to network and mingle with people across a spectrum of seniority in the field in a casual setting.
All are welcome to participate!
Click here for more information.
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2022 Phil Kaufman Award Ceremony and Banquet Honoring Dr. Giovanni De Micheli Scheduled for February 23 in San Jose
Award Ceremony and Banquet Hosted by the ESD Alliance and IEEE CEDA
MILPITAS, CALIF. –– November 15, 2022 –– The 2022 Phil Kaufman Award ceremony and banquet honoring Dr. Giovanni De Micheli will be held Thursday, February 23, 2023, from 6:30 p.m. until 9:30 p.m. at The GlassHouse, 2 South Market Street in San Jose, Calif.
The evening will be hosted by the Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation (CEDA). Early bird ticket pricing is available through Friday, January 13, 2023, at $175 per individual from member companies and $225 each for non-members. After January 13, member tickets are $225 each and $275 per non-member. Member pricing is offered for individuals or companies that are active SEMI or IEEE members.
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Upcoming Online Short-Course on “Analog & Mixed-Signal IC Design” - May 2023
Stay Tuned For Exciting Details!
Course programme and Early-Bird Registration will be available from the 8th February 2023 via this online portal.
The course is open to participants from industry and academia, based across the globe. To avoid missing out on this cutting-edge course, early booking is highly recommended. Only limited number of seats will be available.
For registration, more information, or subscription to our newsletter, please visit here.
To request access to any of our previous courses (subject to payment), please see here.
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Multiple Society Discount Program
As an SSCS member, you can take advantage of the Multiple Society Discount Program to connect across several IEEE Societies to expand your expert network and collaborate on the latest cutting-edge technical research, policy, and innovation at a discount when you become a member or renew your membership of two or more participating IEEE Societies.
If you’re already a member of two or more participating IEEE Societies, the discount will automatically be applied when you renew. If you’ve always been interested in a complementary IEEE Society, this program provides you with the opportunity to join at a discounted rate.
The IEEE Societies that complement your IEEE SSCS membership include the IEEE Electron Devices Society, the IEEE Circuits and Systems Society, and the IEEE Microwave Theory and Techniques Society.
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Have you followed our official IEEE SSCS LinkedIn page?
FOLLOW SSCS HERE!
Follow the official LinkedIn page for IEEE Solid-State Circuits Society, here you will find all the latest news, upcoming webinars, shorts courses and more!
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Become an IEEE Senior Member
Senior member is the highest grade for which IEEE members can apply. IEEE members can self-nominate, or be nominated, for Senior Member grade.
To be eligible for application or nomination, candidates must:
Be engineers, scientists, educators, technical executives, or originators in IEEE-designated fields,
Have experience reflecting professional maturity,
Have been in professional practice for at least ten years (with some credit for certain degrees),
Show significant performance over a period of at least five of their years in professional practice.
Review complete Senior member requirements
Begin Senior member application process
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SSCS Sponsored Conference Proceedings | |
2023 CONFERENCE CALL FOR PAPERS | |
ESSCIRC
Papers are solicited for the following main topics:
- Advanced Technology, Process and Materials
- Analog, Power and RF Devices
- Compact modeling and process/device simulation
- Analog
- Data Converters
- RF & mm-Wave
- Frequency Generation Circuits
- Digital Circuits & Systems
- Power Management
- Wireless & Wireline Circuits & Systems
- Emerging Computing Devices and Circuits
- Memory Devices & Circuits Towards Non-von Neumann
- Devices & Circuits for Sensors, Optoelectronics & Display
Paper Submission Deadline is April, 14, 2023
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CALL FOR PAPERS
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Special Topic on: Physics based modeling and simulation of materials, devices and circuits of beyond-CMOS logic and memory technologies for energy efficient computing
Guest Editor
Sumeet K. Gupta, Purdue University, [email protected]
Editor-in-Chief
Azad Naeemi, Georgia Institute of Technology, [email protected]
Paper Submission Deadline is April 18, 2023
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IEEE Journal of Solid-State Circuits - February 2023 Issue is Now Available
Click here to view articles from this issue
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IEEE Solid-State Circuits Letters - Volume 6 (2023) is Now Available
Click here to view the articles from this issue
Click here to view early access articles
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IEEE Journal on Exploratory Solid-State Computational Devices and Circuits - Volume 8 - December 2022 is Now Available
Click here to view the articles in this issue
Click here to view early access articles
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IEEE Open Journal of the Solid-State Circuits Society - Volume 3 (2023)
Click here to view the articles in this issue
Click here to view early access articles
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For Society news and happenings, check out the Winter 2023 issue of the IEEE Solid-State Circuits Magazine. | |
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