The latest version of the J-STD-001, revision “H”, features several significant changes. One of the most significant changes rolled into this version of the electronic assembly standard for printed wiring boards is the newest cleaning standard. This revision changed the cleaning and residue requirements eliminating ROSE testing for qualification of new processes and assemblies.
Another significant change is the addition of a solder joint x-ray inspection standard found in the appendix. Wrapped terminal standards have also been modified in the “H” version. These changes are some of the most noteworthy but are by no means exhaustive when it comes to the standard changes.
The companion document to the J-STD-001, the IPC-A-610 Acceptability of Electronic assemblies also has seen some major changes. This QC inspection standard has the target conditions removed in the document. This changes coincides with the elimination of the same condition which was taken out of the IPC-A-620 wire and cable harness standard in order to eliminate user confusion. Another large change is the moving of the ESD section to the appendix from the body of the standard. Like the J-STD-001 wrapped terminal criteria changes were also made. The jumper wire section was consolidated into a single section making it more useable. Finally, the wire harness and cable portions were moved out of the standard as they were seen as not being pertinent to electronic assembly criteria. Thee above changes were made along with several other updates in the new revision of the IPC-A-610. Watch for our webinar explaining the changes.