Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications. This flexible machine is equipped with a heated bond head that can apply up to 500N of force during the bonding process, while providing heating up to 400°C from the top. 

Since launching the new machine, two new enhancements have been made including the ability to integrate JEDEC and waffle pack feeders as well as auto-tool change capability. The JEDEC and waffle pack feeders allow the MRSI-705HF machine to be automatically fed JEDEC trays and waffle packs without any manual handling. Auto-tool change enables an operator to toggle between different processes as the gripper has access to four different tools in a tool bank. One of the latest MRSI-705HF machines produced was able to change from thermocompression bonding to a UV application without manual intervention. These innovations significantly enhance throughput, making MRSI-705HF ideal for high-volume applications.

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks, expanding the number of tools that are stored on the machine at one time.

These banks accommodate a variety of vacuum collets, including conical, perimeter, inverted pyramid, and custom options, as well as epoxy stamping tools. Application specific collets, such as perimeter and inverted pyramid variations, enhance the bonders’ ability to perform tasks like eutectic bonding. With robust capabilities for managing heavy parts and ensuring exceptional co-planarity, the MRSI-705 excels in handling large dies, such as optical or image sensors, with precision and safety.  

Beginning in January, emails sent to mrsisystems.com will no longer be received. Please update your records to reflect our Mycronic email addresses:

• Sales: sales.mrsi@mycronic.com
• Service: service.mrsi@mycronic.com
• Orders: orders.mrsi@mycronic.com

Francesca Navarro, Product Manager at MRSI Mycronic, will present "MRSI Mycronic Introduces Next Generation High Precision Epoxy Dispenser for Advanced Packaging" at the EPIC Members New Product Release session on Tuesday, December 10th.

Chiplet Summit

MRSI is sponsoring the Third Annual Chiplet Summit. The 2025 event focuses on a new level in chip design: system-in-package (SiP). SiPs use advanced packaging to raise performance and reduce time-to-market. Co-optimization methods allow all design stages to proceed together. The event also covers supercomputer-in-a-package, a low-cost way to support generative AI. We hope to see you there!

• January 21-23, 2025
• Santa Clara Convention Center, Santa Clara, CA, US
• Booth #314

SPIE Photonics West

It is the premier photonics and laser exhibition which hosts more than 1,400 companies. Schedule a meeting at the show to discuss your advanced packaging requirements.

• January 28-30^th, 2025
• Moscone Center, San Francisco, CA
• Booth #5407

• Meet the MRSI-705: Your Essential Tool for Precision and Reliability in Critical Applications
• Advanced Patented Tool Change Turret from MRSI: Revolutionizing Precision Technology
• Precision and Reliability in Defense Electronics: Exploring MRSI’s Industry-Leading Solutions

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