CELEBRATING OUR 4TH YEAR OF PUMANEWS™ |
|
As I See It!
Celebrating 50 years
OCTOBER 2022
|
|
The last week of September commemorated a milestone never before celebrated at Insulectro. 50 years ago, a would be geologist joined the Insulectro team and began cutting laminate. 50 years later, with geology far behind him, Steve Piatt celebrates an almost unimaginable accomplishment - a half a century as the most successful Insulectro Technical Account Manager we have ever had.
The electronics industry was starting to emerge with new technologies in 1972 - an era that saw the invention of the VCR (video cassette recorder), the first floppy disk (8 inches in diameter), the first arcade game Pong, and the digital watch. A few years after Steve began work for our company, the electronics revolution picked up speed with the first home computers and cellular phones.
Insulectro, with Steve's help, pioneered these new technologies which radically changed how people lived and communicated. The revolution continues.
All of us are honored to have known and worked with Steve entering the company at various points of those 50 years. Speaking for the Redfern Family, I'd like to thank Steve for not only his unbelievable skill at sales and relationship building but for his personal performance, perseverance, and personality that have taken Insulectro to where it is today.
On a personal note, I have learned so much about our business and its potential from Steve, plus a few things about Cabernet, steak, and doughnuts!
From the entire Puma Family, thank you.
|
|
PCBAA, the Printed Circuit Board Association of America, welcomes their newest members: DuPont and Nano Dimension.
Existing members include AGY, Amphenol, Bowman, Calumet, Chemcut, Denkai America, DuPont, Harbor Electronics, Insulectro, Isola, MacDermid Alpha, Nano-Dimension, Pacothane Technologies, Rogers Corporation, Sanmina, Summit Interconnect, TTM Technologies, and Uyemura USA.
The Printed Circuit Board Association of America is a consortium of companies, representatives, and enthusiasts who are advocating for U.S. manufacture of printed circuit boards.
Insulectro is proud to support PCBAA's effort as a founding member.
We encourage you to not stand on the sidelines but get involved to support PCBAA's three main objectives:
- Support the Domestic Production of PCBs
- Enhance Domestic Supply Chain Security
- Advocate for Initiatives that Create Fair Market Conditions
This organization is your voice in Washington.
Visit PCBAA.org today to learn more about membership. See below for more information and a link to inquire about membership.
|
|
PCBAA LEADERSHIP SPEAKS OUT |
|
100% Scorecard!
Artazn LLC Ranks Insulectro 100%
|
|
Insulectro Technical Account Manager Chris Robinson:
"Insulectro has once again received a 100% report card from Artazn, one of our premiere chemistry customers.
"Artazn is the largest North American producer of solid zinc strip and zinc based products and one of the largest in the world.
"They have been manufacturing zinc strip for over 130 years.
"Decades in the zinc industry have enhanced our technical capabilities of melting, casting, rolling, slitting, and plating zinc strip for a variety of applications.
"We are honored by the trust Artazn has placed in Insulectro."
|
|
Chris Robinson
Technical Account Manager
|
|
Chips Act Redux - What Happens Next!
Electronics Industry Calls for U.S. Presidential Determination on Key Components Under Defense Production Act
IPC Release reprinted from SMT007 September Issue
|
|
The electronics industry is calling on U.S. President Joe Biden to address urgent industrial base vulnerabilities and deliver on the promise of the CHIPS Act by prioritizing domestic development of printed circuit boards (PCBs) and integrated circuit (IC) substrates under Title III of the Defense Production Act.
Three industry groups – IPC, the U.S. Partnership for Assured Electronics (USPAE), and the Printed Circuit Board Association of America (PCBAA) – delivered a letter to President Biden, calling on him to issue a presidential determination on the matter.
“For more than 20 years,” the letter states, “experts in and out of government have warned that the erosion of U.S. PCB capabilities and capacity would compromise national and economic security. These warnings have proven all too accurate, as today, the U.S. share of global PCB production has fallen from 30 percent to 4 percent, making the nation precariously reliant on a global supply chain that is itself in turmoil.”
The Biden administration’s year-long assessment of the information and communications technology (ICT) supply chain highlighted the critical importance of PCB fabrication and assembly in electronics manufacturing and recommended that government programs like Title III be used to bolster the strength of U.S. PCB manufacturers.
Supporting the entire electronics ecosystem is also “critically important to the implementation of the CHIPS Act,” the letter continues. “Presently, there are no U.S. manufacturers that can produce the volume of IC substrates needed to support defense and commercial needs.”
Increasing domestic chips production without bolstering regional development and manufacture of cutting-edge PCBs and IC substrates risks lengthening and slowing the semiconductor supply chain, because many of the chips made in Arizona or Ohio will need to be sent to other countries for component packaging and assembly into finished products.
“A presidential determination on PCBs and IC substrates would be a key step toward rebuilding the U.S. electronics manufacturing industry,” Mitchell added. “The Executive Branch and Congress must continue to support – through long-term policy and funding – the entire ecosystem that drives and sustains innovative, resilient, and secure electronics manufacturing.”
|
|
Steve Piatt Hijacks PumaNews™
Renames it PiattNews™
|
|
Top Insulectro Sales Person Clocks 50 Years
Steve Piatt Achieves Half Century
of Sales Excellence
|
|
Steve Piatt is presented a special award for his 50 years of service to Insulectro by the Redferns - Don, Sean, Tim, and Patrick; and Kevin Miller.
The award, presented at a recent sales meeting, was entitled The Steve Piatt Gold Standard Award for Outstanding Performance, Perseverance, and Personality. The award will only be awarded once, to Steve, as there can never be another TAM as successful as Piatt over such a long period of time.
|
|
DON REDFERN, CHAIRMAN - INSULECTRO: "I meet Steve in 1974. He had just transferred up from the El Segundo office to the Northern California office. I was the new finance guy coming into a sales and distribution company.
"I learned more from Steve Piatt over the years
on what a unique sales and distribution organization Insulectro was than anyone else in the company or industry.
"We have been extremely fortunate to have Steve as part of our family. My brother and I have a lifetime of History and memories together."
|
|
TIM REDFERN, MANAGING PARTNER
REDFERN PARTNERS:
"I have been very fortunate to have known Steve Piatt for most of my life but it wasn't until I went to work in sales at Insulectro that I had the opportunity to really know him and what made him so special.
"Steve created his own style of sales and customer service over the years and he stuck with it. From his self-effacing humor to his genuine generosity it was hard not to love Steve. And for the few outliers you could always count on him for delivering donuts with prepreg.
"Fifty years is an amazing milestone and nearly unheard of these days. Over those decades Steve has made an indelible mark on Insulectro and the culture that helps set us apart.
"Thank you for your unwavering loyalty and support through thick and thin, Steve. You are a gem."
|
|
Steve says, "Goodbye!" sort of!
"Been a wonderful 50 years, but starting to slow down, so will probably phase out sometime next year🥲
"Need to prepare the wonderful Cambodian couple that own Manley Donuts to cut some overhead as they won’t be able to count on my 8-10 dozen per week🍩
"It’s truly been an honor to work for and with Don and his three sons. It has been remarkable how they have kept Insulectro the biggest and best Distributor of PCB materials in the country through all the ups and downs in the economy and all the threats to our Industry.
"My whole life, my kids' lives, my two ex-wives' lives and pretty much all my friends lives are associated with Insulectro and this Industry, and it’s been a blessing👍
"Not gone yet, as waiting for gas to get under $3.00/gal so I can afford to travel "🤣
Well, see you around.
Steve
|
|
SALES & OPERATIONS MANAGEMENT |
|
Ken Parent Speaks Out!
Ambitious Goals?
Build a Strong Team
OCTOBER 2022
|
|
Our people are our greatest and most treasured asset to help us achieve our ambitious goals. |
|
This month we celebrate Steve Piatt’s 50th year at Insulectro. Steve has sacrificed much for Insulectro and has benefited in many ways for these sacrifices. Steve is a legend at Insulectro.
To balance Steve’s 50 years, we have also hired a few new teammates that will be focusing on our customers: RJ, Gabe and Rob.
The newest members of the team are focusing on supporting our customers and suppliers in the field.
- Rob Schulz, as Director of Sales for the Midwest Region
- Gabe Zepeda, as Engineering Specialist for the Southwest
- RJ Feliciano, as Emerging Technologies Engineer in the Southwest
With the new teammates on board it reminds us how important the training programs for these people are. We continue to work with our suppliers to bring training programs to our customers and our teammates.
We have some good training programs ready to go and continue to challenge ourselves to bring the next level of training to the business. We are seeing some great new talent being brought into the business.
We have much to do to finish 2022 strong. We are getting mixed signals about the demand for this 4Q2022 and are working hard (at the risk of sounding like a broken record) to get better visibility for our customers and our suppliers to make sure we are on top of your needs.
Please continue to help us where you can to get the right materials on the shelves. Supply channels are certainly improved; however, there are still inflationary and shortages impacting us, your visibility helps us minimize disruptions.
Our crystal ball only improves with great input.
|
|
Ken Parent
Chief Operating Officer
|
|
Livin' in a Material World!
Reflecting on the Past,
Planning for the Future
OCTOBER 2022
|
|
It’s been years since the collective Field Sales, Product Managers, Technical resources and Insulectro leadership gathered in one place, but we were all lucky mid-September to unite in Southern CA to focus on building internal relationships and collaborating on our Future direction at the Insulectro 2022 “Future Starts Now” Sales Meeting.
I always look forward to these events, not sure what I enjoy more- the fun of team competitions, spending time with remote teammates, hearing stories of the past, creating new stories, or the empowering takeaways.
Planning for our future starts with building on the strong foundation that has been established, building on Insulectro’s value to enable our customer to build better circuits faster.
Learning about the foundation came directly from Don Redfern. We spent part of an evening listening to Don’s stories, his vision, and passion supporting the growth of the Electronics Industry- truly inspiring. The speed in which we support our customers is critical, and that is where we collaborated- taking out roadblocks, leveraging the unique advantages of each of our resources, and trusting each other to deliver that value to our customers.
|
|
Our final evening together was a celebration. Not everyone is lucky enough to have a long career with the same company and continue to make an impact decade after decade, but this year’s Sales Meeting was special to be able to recognize fifty years of contributions by Steve Piatt.
Steve is a legendary Sales professional in Northern California who has been a top performer, a master at relationship building, who turned customers into lifelong friends. I count myself lucky to have learned from Steve over the years, and to have him as a friend as well.
|
|
Michelle Walsh
Vice President of Product Management
|
|
Micromax™ Inks Brand
New Packaging: Same Manufacturing Facility, Raw Materials, & Formulation
|
|
Wilmington, DE. Sept. 13, 2022 – DuPont announced today the launch of a new brand, Micromax™, that will encompass the products formerly known under Microcircuit and Component Materials. Micromax™ products are used in a wide variety of electronic applications, from automotive, passive components, and 5G communications to healthcare and consumer goods.
“Micromax™ aims to be the leading brand for electronic thick film inks, pastes, and ceramic tapes,” said Tim Chang, Micromax Global Business Leader. “The new brand name won’t impact on our offerings or how we work with customers - high-quality products, exceptional customer service, and broad-based expertise remain the same – it will simply be faster and easier to identify our offerings.”
Micromax™ serves to organize nearly 800 products under a single cohesive brand and simplify how distributors and customers identify and specify their preferred products. The change includes:
· GreenTape™, which will now be known as Micromax™ GreenTape™
· Heatel™, which becomes Micromax™ Heatel™
· Intexar™ which becomes Micromax™ Intexar™
· Fodel™ which becomes Micromax™ Fodel™
Micromax™ products enable extremely customized solutions because they are tailored in close partnership with clients to deliver the desired solution. With extensive knowledge of materials science and a breadth of electronics experience, the Micromax™ team helps customers imagine what others don’t, test what others can’t, and deliver true innovation that can positively change markets and improve our world.
About Micromax™
Micromax™ is a leading brand of printable, stretchable, and moldable functional thick film inks, pastes and ceramic tapes. Micromax™ brand products are utilized for circuitry, interconnection and packaging of electronic devices in automotive, passive components, telecom, consumer electronics, healthcare and military applications featuring properties such as enhanced circuit density, improved thermal management, higher reliability and other critical functionality. Micromax™ represents over 60 years of experience in the development, manufacture and sale of specialized electronic materials, and offers leading global customer support and product quality and consistency.
To learn more about Micromax™ please visit Micromax™ by clicking link below.
|
|
REPRINTED BY POPULAR DEMAND FROM 2018 |
|
Engineering Specialist, West
Gabriel Zepeda
|
|
Gabe joins the Insulectro as a recent cum laude grad from California State University, Los Angeles with a degree in Electrical Engineering. While at university, Gabe excelled as tutor and teaching assistant and has recently completed an internship at an area fabricator. He has completed the PCEA (Printed Circuit Engineering Association) curriculum for CPCD and is a Certified Printed Circuit Designer.
"I am excited to join the Insulectro team and further my understanding of circuit boards and the materials and processes that compose them," commented Gabe. Gabe is the second generation in his family to pursue a career in PCB manufacturing. Welcome aboard, Gabe!
|
|
OPERATIONS & SUPPLY CHAIN
WORLD-CLASS MANUFACTURING
|
|
WCM: Engaged People, Solving Problems
The Power of “5S”
OCTOBER 2022
|
|
DATELINE: CAC INC., BLOOMINGDALE, IL |
|
At Insulectro, our most important corporate value is “Putting Safety First”, and a foundational focus to support a safe work environment is Housekeeping.
Maintaining a clean work environment can prevent many dangerous situations that can lead to injury, including slip, trip and fall hazards, fire hazards, and even health hazards.
|
|
“5S” (Sort, Set in Order, Shine, Standardize, and Sustain) is a system for organizing spaces so work can be performed efficiently, effectively, and safely.
This system focuses on putting everything where it belongs and keeping the workplace clean, which makes it easier for people to do their jobs without wasting time or risking injury. A good 5S program produces good Housekeeping, which in turns supports a safe working environment.
|
|
As a family of companies, we are re-energizing our efforts around Safety and Housekeeping in all functional areas. You’ve read in past editions of our monthly “Puma News” about our simple “3A’s” approach to each Teammate’s Obligations to Safety:
Accountable to work safe
Approach Others who are not
Accept feedback when approached
Part of the way we hold ourselves accountable to work safe is by living a 5S culture. With this mindset, areas for needed housekeeping improvements become clearly visible, and we can work as a team to develop action plans to address them.
One of the recent projects we launched to transform housekeeping results with a 5S focus was at our CAC Bloomingdale, Illinois facility.
Felix Martinez, Director of Operations, and Matt Swanson, Operations Manager, have done some incredible work over the last 90 days to make step change improvements.
|
|
On a ‘gemba’ walk during a site visit earlier this year, Matt and I agreed that the housekeeping was not up to our standard, and we needed to improve," says Martinez. “We had to get a gameplan and engage the entire team on how best to tackle this problem.
We first asked the guys who do the work (Miguel Chavez and Shawn Niyork), and live in the environment daily, ‘what are the most impactful actions we should take to get to the next level’ ."
After launching a 4-step problem solving event, the team came up with the following foundational proposed actions for improvement:
- Add racking to use vertical space since floor space is at a premium
- Organize all material on the shop floor (inbound/outbound, packaging, scrap, and other) into clearly marked bays
- Aggressively work to remove aged scrap material;develop/implement ongoing plan for routine scrap removal
- Add new toolbox and storage cabinet for supplies, with proper labeling – everything in its place and a place for everything
As a result of these actions and true engagement from the entire team, the operation is now a well-organized area that is presentable and tour ready within minutes.
“The key question I posed to the team after we’d made a marked improvement was ‘how do we keep it this way?’ ” says Martinez.
“The answer lies in establishing a new standard, making sure everyone understands the standard, and establishing daily check-ins on compliance to the standard. Also creating a safe environment where we trust each other, where everyone’s participation is required, and where we can bring up concerns (and accept feedback) regarding the gaps, so we can constantly improve."
As an Operations team, we are beginning to utilize a Kaizen “Before & After” template to tell the stories of these type of improvement events. Below is the summary of the team’s efforts on this project:
|
|
Fantastic work with amazing before and after results CAC-Bloomingdale team: Matt, Miguel, and Shawn! You have done an outstanding job making problems visible and driving action! Continue this momentum by living the fifth “S” – Sustain!
You’ve really embodied the mission statement of our Operations Team: Engaged People, Working Safely, Living Our Values, in a WCM/Lean Culture.
|
|
And thanks to everyone for another remarkable month.
Jason Shuppert
Vice President of Operations
|
|
INSULECTRO'S COPPER & COPPER FOIL OFFERINGS |
|
Not All Copper Foil is Created Equally
Copper Foil is a Technology Enabler
|
|
Copper foil is a technology enabler,With every layer having a purpose.
Copper foil producers have been continuously investing in material science to ensure fatigue, degradation and delamination failures are textbook subjects rather than production meeting topics.
The trend for thinner and smoother foils were discuss during APEX/ IPC 2022.
For this month’s PumaNews™ Magazine, we’ll dive into the treatment layer of Copper (Cu) foil.
|
|
The illustration shows Electrodeposited copper (ED) with its vertical grain structure, Matte side treated. Pure copper (Cu) dendrites or nodules from the treatment process are deposited upon the base foils surface creating mechanical anchor points for the resin system.
Metallic layers are plated over the copper dendrites to protect and promote adhesion, barrier layers to encapsulate the dendrites, anti-tarnish and stain proofing (passivation) for the foil surface. Additional chemical adhesion promoters (silane) may be applied to complete the foils treatment.
Various metals are used such as Zinc, Chrome, Arsenic, Cobalt and Nickel to protect the copper/dielectric interface when exposing the foil to aggressive environments such as high temperature lamination cycles and highly acidic plating solution used during the creation of a Printed Circuit Board (PCB).
Arsenic (As), a metalloid, is naturally occurring in the Earth’s crust and widely dispersed in the environment. The element is an essential trace mineral for proper nutrition for many birds and mammals. Trace amounts of arsenic can be found in many of the foods consumed on a regular basis, such as rice and chicken. The benefits of arsenic to increase copper alloy hardness has been in use since the Bronze Ages.
|
|
Electronics benefit from arsenic in two main forms. Semiconductors made with Gallium Arsenide (GaAs) have several benefits over traditional silicon chips including lower power consumption and faster processing speeds. Our high-speed wireless networks do not operate without GaAs semiconductors.
Printed circuit boards may use a small amount of arsenic in the copper foil. Trace amounts of the element enhance the protection of the barrier layer from processing chemical attack and provide thermal stability for high temperature lamination.
|
|
While arsenic has many benefits, it is toxic in high concentrations. In attempt to improve workforce safety, the European Union (EU) through their REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) program has placed significant restriction on local manufacturing with arsenic, in its various forms. The REACH limitation for EU imported articles containing arsenic is < 0.1% by weight.
Semiconductor packages using GaAs, and laminates or PCB containing copper foil alloyed with arsenic will fall well below the REACH threshold. For example, the typical copper foil contains < 0.05% by weight arsenic, half of the REACH threshold.
|
|
In summary, every layer of the copper foil used within the PCB industry is tailored to its function and its environment. Cobalt is added to a copper alloy to improve grain boundary structure. Zinc will alloy with the Copper to form a brass barrier layer improving shelf life and bonding performance per specific resin.
Arsenic is used to promote adhesion by protecting the dendrites from chemical corrosion which can occur and reduce peel strengths with brominated (Halogen) FR4 resins. You may not see it with immediate effect but during the products life cycle a failure in the field is not an option.
|
|
For further assistance, connect with me by email, phone, or in person!
Mark Satchwell
Product Manager, Foil & CAC®
|
|
Let's Play Laura Martin's
PCB Electronics Word Scramble
|
|
Just for a change of pace, I thought I'd challenge the Great Minds of Our Industry to a round of PCB Electronics Word Scramble!
See how fast you can rearrange letters to make correct spellings.
|
|
XFEL
EMIATLNA
AECIENMPD
LRICCEEDTI
ILOF
EEPGRRP
ATPCSUK
ECORPP
|
|
You can find the correct answers if you're stumped just past Geraldine's article on Kyocera. |
|
Laura Martin
Director of Technology
|
|
Tools at a Glance
End Mills and Routers and Drills, Oh My!
|
|
Insulectro is proud to be the newly signed exclusive North American distributor for Kyocera PCB products. Kyocera has a full line of products to support customer needs in both the drill and fabrication areas.
Highlighted in this newsletter are the multiple router series available to support all ranges of technology and are ideally suited to meet the quality needs and challenges seen in the fabrication room today.
Below is a list of the router series stocked and available at Insulectro to support our customers as they strive to provide outstanding quality to their customers.
Routers (click to see more)
Have a challenging process issue? Reach out to us today and we will work with your team to provide a solution!
Kyocera is unique in the North American market as they alone can design, develop, and manufacture drills, routers and endmills for specialty applications, quick turn requirements, and bring new designs faster to ever changing market needs all right here in Orange, California USA. Along with our industry leading backer and entry products Insulectro has what you need to build better boards faster.
|
|
Along with our industry leading backer and entry products from LCOA®, Insulectro has what you need to build better boards faster.
Please contact me for additional information, technical support, or process related questions. Our Insulectro team looks forward to assisting in you!
|
|
Geraldine Arseneau
Product Manager - Kyocera Precision Cutting Tools
|
|
Laura Martin's PCB Word Scramble
Answer Key
FLEX
LAMINATE
IMPEDANCE
DIELECTRIC
FOIL
PREPREG
STACKUP
COPPER
|
|
How do you “stack up” when it comes to consistency throughout your lamination process? |
|
When it comes to high technology and the importance of controlling heat and pressure through the stack for resin flow, there is none other than the InduBond® XPress induction press.
Pictured below is a test that was run with a 21x24- 40 panel high stack up using the LCOA® CSC (copper/steel/copper) instead of separator sheets and the Pacothane “Paco•Clutch” to achieve this higher panel stack. Both the registration and consistent heat transfer past the test.
|
|
Track your every move and what your press cycle is doing in real time!
Endless recipes for any material configuration including high temperature and pressure capabilities for all your hi-tech materials.
|
|
Listen to this. . .
Exciting News from Our Equipment Division
Equipment Technologies
|
|
UCE Group and Chemtron have filed a joint patent on our latest advancement in etching technology; HYPER ETCH.
UCE Group is always ahead of the game in technology. First introducing VACUUM ETCH 4 years ago, and now HYPER ETCH!
Ask one of our equipment specialists today about this new technology and find out what it can do for you! Below: ETI President Jon Pelletier
|
|
We have over 40 installations completed in the United States and Canada alone. Our service team is at your disposal, used and new equipment!
An example of equipment manufacturers we service:
WISE / CHEMCUT / SCHMID / I.S. / IPS / DYNACHEM / DUPONT Laminator Retro-fits / TMP Presses / HAKUTO / PLASMA ETCH / INDUBOND® / UCE
- Emergency Service
- Preventative Maintenance
- Installations
- Rebuilds
- Retro-fits
- Troubleshooting
- Training
- Spare parts
- Brushes
Please reach out should you like to discuss our equipment offerings further. Thank you.
|
|
Jon Pelletier
President, Equipment Technologies
|
|
Kevin Barrett,
Product Manager - Equipment
|
|
Geoff shouts: "Man, is it hot!"
Operate in Harsh Thermally Demanding Environments
|
|
Pyralux® HT a high temp flexible adhesive that enables flex designs to withstand up to 200C environments. With an IPC service temperature of 225 C the High Temp nature of this product allows your flexible designs to operate in harsh thermally demanding environments.
HT is thermally and dimensionally stable to run continuously into the rigid section of a PCB, no need to apply in coverlay areas only. This can enable many high speed applications in rigid flex designs that need to send signals from one rigid section to the other while eliminating cable loss.
This is primarily due to the ability of the Pyralux® HT material to withstand the lamination cycle of many traditional epoxy resin systems and the low loss nature of the Pyrlaux® HT.
|
|
HT adhesives may be used as a Coverlay, bond-ply or sheet adhesive. 1, 2 and 3 mil constructions in-stock!
|
|
Geoff Leeds
Product Manager, DuPont Flex Laminates
|
|
Innovative Advancements in Automotive Infotainment
Superior Electronic Devices Require
Ultra-thin DuPont™ Kapton® Polyimide Films
|
|
ARTICLE BY DUPONT - OCTOBER 5, 2022 |
|
Vehicles today are, in many ways, high-powered computers on wheels. The industry is packing more and more functionality into vehicles – from connectivity and entertainment features to comfort and advanced mobility applications to ADAS system integration and autonomous driving capabilities.
While these enhancements improve the driver and passenger experience, they also introduce increased complexity to vehicles’ electrical architectures and electronics systems and put pressure on manufacturers to continuously enhance system performance.
To illustrate the level of advancement taking place in automotive electronics, consider a vehicle’s infotainment system. Not long ago, a CD disc changer was an innovative entertainment feature.
Today, vehicles feature ever-more-robust infotainment systems that provide passengers with unique and customized experiences. These systems include touch screens, music streaming capabilities, advanced navigation, voice-command capabilities, and even 360-degree camera views.
The challenge: Increasing functionality, power and complexity (in extreme and harsh environments) while decreasing the footprint.
The increased functionality of infotainment systems is creating unique challenges for engineers who are designing systems, components, modules and PCBs. First, PCBs aren’t getting bigger, but they still must accommodate more micros, connections and circuits. The result is a more powerful PCB (in effect, a “superior” PCB). While the PCB is crowded with components – which creates design and operability challenges – it drives higher performance in next-gen electronics.
Further, the stringent electrical and manufacturability requirements of automotive customers create a second challenge for PCB engineers. While new board design processes can help accommodate the many components that support increased functionality – and these processes have been successfully used in consumer electronics for decades – PCB manufacturers in the automotive industry must account for challenging specifications and extreme environments.
|
|
PRINTED ELECTRONICS INKS & PASTES,
SUBSTRATES & FILMS
|
|
Kevin Miller Can See it!
PE Team Attends IMAPS in Boston
OCTOBER 2022
|
|
INSULECTRO PE Team recently attended the 55th International Symposium on Microelectronics that was organized by the Microelectronics Assembly and Packaging Society (IMAPs) in Boston MA this month.
This event was held at the Hynes Conference center in the back bay in the city of Boston. We supported the booth for DuPont MCM and had many discussions regarding the new branding of the Micromax™ product line and their advanced packaging offerings.
This year's Symposium was focused on PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL, and featured 5 technical tracks, plus their Interactive Poster Session. The technical program spanned three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond!
|
|
We look forward to supporting your future needs and material requirements.
All customers have access to our custom converting services plus rapid delivery and as well as our in-house technical assistance.
Please call 1-855-955-0200 with any questions regarding these product offerings or visit our E-Commerce site at https://insulectro-pe.com/.
|
|
PE Customers Interviewed for
Design007 Magazine (Part 3)
|
|
The last in a series of three articles for Design007 magazine on printed electronics and flex circuits. Kevin Miller VP of Sales was interviewed by I-CONNECT007's Andy Shaughnessy along with three Insulectro customers. |
|
Please call INSULECTRO at 1-855-955-0200 with any questions regarding these product offerings or visit our E-Commerce site at the LINK BELOW.
|
|
Kevin Miller
VP of Sales - Insulectro Printed Electronics
|
|
Chris Hunrath on Future Tech
Details in the design,
Ultra-HDI for PCB
OCTOBER 2022
|
|
As new materials and equipment enable the PCB fabricator to extend the limits of density, the signal integrity impact cannot be ignored.
This creates a need for SI testing that’s different than the tradition PCB structure. High resolution imaging combined with ultra-thin foils or additive metallization can make circuit traces taller than wide.
Laminating these types of circuits also brings another thing into play. When using prepregs, the resin will fill between the circuits without the glass as the fabric tends to “tent” the spaces. This changes the electrical properties when compared to the normal glass resin composite and likely result in a much lower Dk. This information does not show up on material technical data sheets.
|
|
As mentioned in previous articles, circuit features like this are not new. The change now is in the fact we are applying this to a much larger PCB format and thus much longer traces. Larger BGA pin counts (I/O’s) with smaller pitch are driving up density and layer count. This is in addition for the need for speed and SI performance.
Bottom line, we will have to calculate and with measurements, validate the impact Ultra-HDI has on performance of the PCB.
We will actively pursue information in this area, but we need input from designers, OEM’s and fabricators. Help us help you so we can provide the best information possible.
Let’s take PCBs to the next level.
|
|
Chris Hunrath
Vice President of Technology & Vice President of Sales - Western Region
|
|
Same Formulation, New Packaging
Insulectro Sponsors Taco Truck for Micromax™ Ink Training Session
|
|
The Insulectro Technical Sales team of Jeff Crawford and Bob Lee attended the Micromax™ high temperature ink seminar in Wilmington DE on September 13th & 14th.
This was an information packed session over 2 days that was very well attended by customers and OEMs looking to renew and enhance their knowledge of topics such as Printing Technologies for RFID, InMold Electronics, Wearables and Stretchable inks, Bio, and Health applications as well Heaters.
Presentations included conductor technology, carbon conductors and dielectric and encapsulants and not to be overlooked High Temperature applications for Ink Technology.
Seminar participants shared the opportunity to tour the labs and see Ink Printing demos, functional testing, and learn a bit more about the process and procedures surrounding Ink manufacturing and technology.
To cap off each day, both DuPont and Insulectro sponsored a post seminar gathering to collaborate with Customers, Business associates, and OEMs to share in the discussion.
Wednesday's final day closing event was capped by a Taco Truck sponsored by Insulectro and supported by the Micromax™ team. An opportunity to close out a comprehensive 2 day session with GREAT Tacos and refreshments that were outstanding!!!!
Thanks go out to all that attended the seminar and we hope it was an informative venue to share with your team and we look forward to the next one!
|
|
Please contact me or your local Insulectro TAM. |
|
Bob Lee
Technical Account Manager - Printed Electronics
|
|
@Mike Creeden
How OEMs Accomplish Layout
|
|
Each OEM has a staff or an outsource to accomplish their layout needs. This profession is often misunderstood by most, with the exception of those who perform this vital effort that creates the tooling that builds our circuit boards. To those who perform this effort at your companies, my esteemed gratitude for your efforts!
This profession has relied for years on seasoned designers who came from the ranks of draftsmen, technicians, and from all walks. There existed very little formal training for this profession and most learned it similar to a tradesman being apprenticed or mentored under a senior designer. The unfortunate occurrence in the electronics industry is that our industry stopped recruiting new designers and allowed the ranks to deplete as many are now reaching retirement age.
The industry, in its efforts to satisfy this vital need, has conscripted new EEs entering the work force, graduating from college with no formal training to accomplish layouts. I have never met an engineer who will say, “No, I can’t figure it out.”
But I have met many engineers who have tried it once, failed and often do not want that experience again. However, many engineers are applying due diligence to learn by the school of hard knocks and are slowly becoming masters of their own layouts. Historically, one designer served 4-10 engineers per year and stayed current with tool mastery, performing layouts day-in and day-out, with continual technical growth.
In today’s new paradigm, few engineers support other engineers and as a result each engineer performs their own layouts 1-3 times per year. With that perspective, you can see it is challenging to stay proficient at circuit layout, CAD tool usage, and manufacturing requirements.
|
|
Available training – Historically, in 1993 the IPC Designers Council created the CID/CID+ program for the purpose of teaching an experienced designer understanding of standards and manufacturing technology. The CID program still accomplishes these tasks, although it is not that current with today’s engineering and manufacturing trends.
Please understand that IPC is a standards body that is unrivaled in guiding our industry to design and manufacture with excellence as governed by standards. But it never strived to create layout design engineering professionals, although it guides them with standards.
The new Printed Circuit Engineering Association (PCEA) strives to support IPC in its mission and encourages IPC involvement at all levels. The new PCEA has become the certifying body to a new curriculum created for the creation and empowerment of those seeking to become the next generation of Printed Circuit Engineering Layout Professionals.
The new curriculum with optional certification, is recommended for both an engineering/layout beginner and a great refresher for the seasoned professional. This curriculum covers the profession from A to Z. Starting withthe fundamentals of schematic capture, signal constraints, component placement, routing, flex, HDI, documentation, signal integrity application, and post processing.
This curriculum continues beyond these core principles to encompass a balanced understanding of all the elements that go into the fabrication, assembly, and test of a printed circuit board. We encourage you to investigate how to improve your company’s layout professionals at: Printed Circuit Engineering Designer – Online Program | EPTAC
At Insulectro, with our Design Education Program we are eager to freely support signal-integrity reviews of design circuits prior to fabrication. Also, we are ready and eager to create one or several training sessions for the OEM or your fabrication team. These will be tailored to meet the exact needs of the audience, brought by a technically appropriate presenter, with specific content to further your team’s success and provide that edge to meet the needs of advancing technology trends.
|
|
Contact any of our Technical Account Managers or call any of our branch offices to schedule your Virtual Training Session soon.
Stay safe, happy, and healthy!
Mike Creeden CID+ MIT
Technical Director, Insulectro Design & Education
|
|
PCBAA LEADERSHIP SPEAKS OUT |
|
Welcome to the September Edition of
Insulectro PumaNews™ Magazine - East Coast Edition
Are you Lucky?
As I return from the West Coast after attending an albeit short sales meeting a couple weeks ago, there is one thing that still resonates with me and I wanted to share with you.
Insulectro invited moderator and longtime Insulectro collaborator, Steve Mulvany to facilitate some sessions at our sales meeting. Steve is President and Founder of Management Tools Inc. Steve moderated a group session on “empowering your team.”
|
|
Steve asked us, "Are you Lucky?"
It’s something that we often don’t think about every day or ask ourselves but to me it is the foundation of a successful and fulfilling life and work.
Your attitude towards life and work is what makes you lucky and unlucky.
If you are the person who gets up every day and counts your blessings and all the good things you have in your life then, yes, you are lucky, because many people don't have this attitude. Hence, be lucky to have such a great attitude.
Our Insulectro team is lucky. It is one of our team's many common denominators, but being lucky really comes through, in each of us.
Even in the most challenging and unprecedented times of Covid, our team and our suppliers work through each opportunity and challenge to make sure we get our customers materials and technical support to build better circuits faster!
I feel lucky!
|
|
Ron Murdock
Director of Sales - Eastern Region/ Canada
|
|
PCBAA LEADERSHIP SPEAKS OUT |
|
Isola Group Displays Materials at Record Attended PCB West Trade Show |
|
Smaller circuits with greater functionality are possible with the advanced circuit materials developed by Isola Group (www.isola-group.com) and were shown at the PCB West 2022 Exhibition on Wednesday, October 5, 2022 at the Santa Clara Convention Center in Santa Clara, CA.
Combining laminate and prepreg materials optimized for power, RF/microwave, and high-speed-digital (HSD) circuits results in miniaturized and efficient multilayer mixed-signal assemblies that can fit the tightest places and provide the high performance and diverse functionality needed for modern electronic products. Isola’s represents will offer guidance on the most effective use of their materials, whether for high-volume commercial applications or aerospace and defense (A&D) systems chasing reduce size, weight, and power (SWaP) requirements.
For more than 30 years, the PCB West Conference & Exhibition has linked suppliers and users of printed-circuit-board (PCB) materials. The 2022 edition (www.pcbwest2022.com) featured a one-day exhibition as well as a highly educational conference scheduled from October 4-7, 2022 aimed at both designers and manufacturers of analog, digital, and hybrid mixed-signal PCBs.
PCB West enjoyed record attendance at their one-day exhibition after pandemic-related slumps in previous years.
|
|
About Isola
Isola is a leading global material sciences company that designs, develops, manufactures and markets laminate materials used to fabricate advanced multilayer printed circuit boards, which provide the physical platforms for the semiconductors, passive components, and connection circuitry that power and control virtually all modern electronic products. Isola operates a network of factories worldwide.
|
|
Norm Berry
Director, Laminates & OEM Marketing
|
|
New High Speed Matte Tin Plating Process
DuPont Introduces SOLDERON™ ST-400
|
|
DuPont has introduced a new high speed matte tin plating process to the North American market: SOLDERON™ ST-400
The Solderon™ Matte Tin product family has held leading positions in the electronic component markets since the restrictions on use of tin-lead alloy were introduced. Several factors combined to create the demand for a new tin product including whisker performance, operational efficiencies, simpler control and sustainable chemistry.
Solderon™ ST-400 High Speed Matte Tin offers these and other benefits:
- Increased plating speed = improved production capacity
- Very low sludge = reduced downtime & maintenance
- One additive for Makeup & Replenishment = ease of use
- Simple analysis = time savings in the lab
- Very wide operating window = process latitude
The drivers for this innovation address many of the challenges that platers experience with high-speed tin plating operations:
- Reduce the foam
- Minimize sludge formation
- Reduce tin whiskers
- Stable performance across range of current density and bath age
- No expensive advanced lab equipment required to maintain the bath components
- Consistent deposit appearance and excellent solderability
The Solderon™ ST-400 High Speed Matte Tin process is another example of DuPont’s technology innovations that are formulated to address the challenges that manufacturers face with existing chemistries. As metallization challenges continue to evolve with the requirements of plating faster, better and in an environmentally friendly and sustainable model, DuPont™ is committed to providing these solutions.
If you would like to have a conversation or presentation to discuss how Insulectro can introduce you to DuPont’s latest metallization technologies, please reach out to me.
|
|
Paul Welter
Product Manager - Chemistry
|
|
At-A-Glance
The DuPont Chemistry Line
|
|
With the acquisition of East Coast Electronic Material Supply (ECEMS) in late March, Insulectro has brought another best-in-class product line to our customers. The addition of the DuPont Electronics Imaging & Interconnect Solutions (ICS) chemistry line, which was legacy Dow Chemicals before the Dow-DuPont merger, adds a complimentary piece to an already robust Insulectro product offering.
DuPont ICS is innovating new metallization technologies across many platforms:
Electroplating Applications
HDI
-
Microfill™ EVF-III for advanced via filling and through-hole plating
-
Microfill™ LVF-IV for next generation SLP applications
MLB
-
Copper Gleam™ PPR-II for high aspect ratio pulse plating
-
Electroposit™ EP-1600 for high aspect ratio DC plating
-
Copper Gleam™ HS-200 for horizontal DC plating in FPC applications
-
Copper Gleam™ ST-920 for DC vertical continuous plating (VCP)
IC Package Substrate
-
Microfill™ SFP-II & Microfill™ LVF-IV for advanced SAP applications
Making Holes Conductive
Electroless Copper Solutions:
-
Circuposit™ 3350-1 Vertical Electroless Copper
-
Circuposit™ 4000 Horizontal electroless copper for FPC/RFPC
-
Circuposit™ 6700 Horizontal Ionic Catalyst for Advanced HDI applications
Direct Metallization Solutions:
-
Next Generation Crimson™ & Conductron™ palladium-based systems
-
Next Generation Graphite 2000™ carbon-based system
ENIG:
Duraposit™ SMT-88 & Aurolectroless™ SMT 520
Process Chemistries:
DuPont offers a full line of cleaners, developers, strippers and other ancillary products to support printed circuit applications.
General Metal Finishing:
Full line engineering, decorative and precious metal offerings
As you can see, through this addition of the DuPont ICS chemistry line, Insulectro is now providing chemistry and technical support to the general metal finishing, plating-on-plastics, and wire plating industries, which we see as an area of growth.
|
|
Ormet® PCB-710
Eliminate Lamination and Plating Steps
|
|
Ormet® PCB-710 is a lead-free, copper-based, paste formulated for creating microvias in printed circuit boards. This can be done to replace stacked via designs with multiple lamination steps, or to bond subs together without requiring a through-hole drill to electrically connect the subs.
|
|
The Ormet® paste is processed at normal PCB lamination temperatures. The final product offers superior thermal and electrical performance.
|
|
For more information on Ormet®, please contact me. |
|
Jeff Johnson
Product Manager - Dryfilm/Chemistry/Paste & FAE
|
|
Coming in October!
PCB West: mSAP and HDI
|
|
PCB West was back in full force with the largest number of suppliers, fabricators, and OEMs attending in its history.
We had some great collaboration on technology at our booth. It’s always great to see folks in-person, after working with them in the virtual world. There is not substitute for being there.
Along with Isola and DuPont, our team was quite busy with folks looking for solutions for their endeavors.
My colleague Mike Trammel of Summit Interconnect and I presented HDI and mSAP at PCB West to a well-attended audience. We covered the process steps at the PCB fabricator, then went into more detail on the materials and structure of sub 50 micron features.
There was great audience participation which makes for an excellent event. If you would like more information on this topic, please let us know.
|
|
To sign-up for the Insulectro Customer Portal, send an email with your Company name and Contact information to: [email protected] with the subject “Sign me up.”
|
|
Chris Hunrath
Vice President of Technology &
Vice President of Sales - Western Region
|
|
A Super Matchup!
Make Your InduBond® Press
Sit Up & Take Notice
|
|
Bacon and eggs. Black and tan. Mac and cheese. Bert and Ernie. InduBond® and Copper-Steel-Copper!
Bonded Copper foil including VLP profiles onto a Steel carrier ensures that not only the low-profile topography is protected but the surface is clean, free from causing signal integrity defects as all FOUR edges are sealed. It's a star performer in an InduBond® press!
Carrier foil is available from 1µm up to 5µm, now CSC bridges that gap offering foils from 6µm to 140µm.
CSC is available in 8 mil which has twice the image transfer resistance as 15 mil aluminum AND can replace up to SEVEN standard 62 mil steel separators. Those separators not only cause circuit surface imperfections impacting trace lines but reduce stack height allowing more panels per lamination cycle.
|
|
I've got a lot to tell you about this matchup!
Mark Satchwell
Product Manager, Foil & CAC®
|
|
Contact your Insulectro or Isola sales representative for more information.
Norm Berry
Director of Laminates & OEM Marketing
|
|
Join our
Puma Team!
Help us define the future of Printed Circuit Boards and Printed Electronics!
Join our Puma team and be a part of our growth.
Business Development
Operations
Pricing
Production
Warehouse
Others
Click on the ad (left) to see various positions we are recruiting.
As advertised in i-connect007's PCB Magazine
|
|
Click-Out our
Pyralux® Flexible Laminates Selector Guide. . .
(click on product name)
The standard copper clad laminate systems for any flex or rigid flex designs.
The standard copper clad laminate systems for any flex or rigid flex designs.
Single sided flex copper clad substrate
Standard acrylic adhesives for building multi-layer flex designs. Offered as coverlay, sheet adhesives and bondplys.
Standard acrylic adhesives for building multi-layer flex designs. Offered as coverlay, sheet adhesives and bondplys.
An epoxy-based adhesive system demonstrating both low loss and high reliability, specifically designed for OEMs and PCB design manufacturers. Offered as coverlay and sheet adhesive.
High temperature flexible adhesive system with an MOT of 225C.
Teflon®/Laminate system offered as a clad laminate or bondply. Ideal for RF designs.
Embedded resistance double sided laminate
|
|
Geoffrey Leeds
Flex Product Manager
|
|
It's Not Too Late!
Past OEM FORUMS Available for Viewing
|
|
MOST OF OUR OEM FORUMS available for viewing
|
|
|
|
QUALITY CONCERNS
JUNE 24, 2021
|
|
The Undisputed "Made-in-America" Leader
Lamination Assist Products For PCB Production
|
|
PACOTHANE TECHNOLOGIES® is the world's leading manufacturer of products to enhance and assist the production and quality assurance process for the lamination and manufacture of printed circuit boards.
Pacothane services the worldwide PCB and Smart Card markets, which includes Rigid Multilayer, Rigid/Flex, Cover-layer Flex, Flexible Multilayer, Copper and Un-Clad Laminates. These circuit boards are integrated into a wide variety of applications and markets that include telecom, data communications, high speed computing, mobile devices, military, smart cards, medical and effectively all electronic products.
WE ARE COMMITTED TO INNOVATION AND EXCELLENCE
-
We develop and produce consistent, dependable, functional products that help to eliminate the hidden variables in PCB manufacture, reducing scrap rates and reworks
- We provide uncompromising support to our distributors and their customers, through training, sales and technical support
WE PROVIDE THE MOST COST-EFFECTIVE SOLUTIONS
-
We help customers select the correct product for their specific application
- We continuously improve functionality to reduce customers' finished product costs
PACOTHANE TECHNOLOGIES®
Proudly Produced in the USA
with American Labor and American Materials!
For all your needs and challenges in lamination, give us a call! With our broad product offering we have the solutions you need. We like to make your life easier! Training and on-site assistance is available through your Insulectro representative.
|
|
Geraldine Arseneau
Product Manager - Pacothane® Products
|
|
And, don't forget, recently published Pacothane® Product Sample Guide available. Contact me for details. |
|
Geraldine Arseneau
Product Manager - LCOA®
|
|
CAC, Inc.
Superior Surface Quality,
Supporting Thinner Foils
|
|
Remove those hard to clean, defect causing and throughput limiting separator plates.
-
Reduce stack height - More panels per book per opening, CSC 7.5x thinner than separators
-
Eliminate surface defects as the factory finish copper surface and profile is protected
-
Production Efficiency gains by reducing the overall mass to heat AND cool in a cycle
-
Layup Efficiency – No separators to clean, resurface or polish - labor intensive & costly
-
Consistency in press stack mass CTE to copper & prepreg with CSC
-
Increase quality assurance as image impressions and FOD concerns are minimized
|
|
For additional information, samples, or data sheet, please contact me.
Mark Satchwell
Product Manager, Foil & CAC®
|
|
Design Education - An Insulectro Priority
Insulectro Sponsors New Design Trade Association
|
|
Printed Circuit Engineering Association™ (PCEA) is an international network of engineers, designers, fabricators, assemblers, and anyone related to printed circuit development.
Our mission is to promote printed circuit engineering as a profession by encouraging and facilitating the exchange of information and the integration of new design concepts through communications, seminars, and workshops.
|
|
If you are a professional serving in the printed circuit industry from any associated discipline, you are encouraged to join. Membership is free and you’re encouraged to be involved as we all seek to collaborate, educate and inspire one another. Visit the web-site at: www.pce-a.org
|
|
As advertised in i-Connect 007's PCB Magazine.
|
|
Shur-loc, IBC Brush and Equipment Service are being recognized by customers as key contributing factors in Insulectro helping them to increase their departments efficiencies in areas of their facility.
|
|
“Being consistent on your mesh tension, throughout its life in the frame, helps keep ink coverage consistent ensuring process performance and repeatability.”
- Each mesh panel has a color-coded edge as well as the information stamped in one corner
- Available in the common 22.5 degree angle needed for LPI or 90 degree for photo imagable legend ink
Call myself or your local account manager for a system quote to see how quickly your return on investment will be!
|
|
Contact your Insulectro Account Manager to see how the Shurloc frame system can better assist at your facility!
Shurloc can custom fit almost any size frame to your application.
- Ease of use, “anyone” can learn to stretch a frame.
- Continuous consistent tension throughout the frame
- Frames can be stretched in a matter of minutes
- Ready for use immediately (no more leaving frames/mesh settle out for hours and then having to re-tension before use.)
|
|
Going Beyond
the Tool Case
|
|
Working with IBC for over the past 15 years, we’ve worked together in making sure that their brushes are manufactured with the best possible specifications to give optimal performance to the printed circuit industry.
We can also perform regularly scheduled brush changes in your machine. We don’t just change your brushes and walk away. This piece of equipment will go thru a specific number of tests along with a review of other areas of the machine before we leave it to production. What we like to call as…….
Going Beyond the Tool Case!
|
|
“Customers are beginning to see the difference in having us assist their maintenance staff in the ever-important preventative maintenance programs needed to uphold an equipment’s performance.” |
|
- Are you getting the best performance out of your equipment?
- Is your equipment DOWN more than it is UP?
- Let us lend a hand by assisting your maintenance team.
|
|
Remember that we can assist in your equipment needs through the following:
- Equipment Reviews and Audits
- Service and support
- Preventative Maintenance Programs
The calls for Preventative Maintenance Programs are increasing as customers understand the benefits this brings to their equipment’s overall performance and up time.
|
|
Also, do you have a used piece of equipment you’re looking to get installed? We may be able to assist here as well!
Ruben Zambrano
Field Application Engineer
Cell: 847-345-3759
Mike Engle
Field Application Engineer
Cell: 360-749-1756
|
|
Please reach out should you like to discuss any of these topics further.
Thank you.
Kevin Barrett,
Product Manager - Equipment
|
|
Today's Copper Foils
for Tomorrow’s Applications!
|
|
Tailored to meet market trends such as compartment miniaturization, vehicle electrification and increased connectivity demands require improved characteristics of both wrought and ED foils.
Focus on wrought solutions such as:
- Low profile height (Rz) for signal integrity, as low as 0.4µm
- Consistent profile height across the web which does not change when ordering thicker foils
- Alloy foil with Increased tensile strengths which can exceed 700Mpa
- Grain structure in terms of large crystals and uniform orientation improves fatigue resistance and provides excellent vibration resistance.
- Thermal resistance to withstand hostile environments for automotive applications.
Wrought foils released to IPC 4562A in grade 5, grade 7 and grade 8.
Call us to find out more – we love to talk about this stuff!
|
|
Give us a call to discuss how CAC can help you
make better circuits faster.
Mark Satchwell
Product Manager, Copper Foils
|
|
Everyday Materials You Need, On Our Shelves Every Day
Insulectro recognizes the importance of maintaining adequate inventory to begin work. Designers know when you need it, you need it. Using the link getpumafast.com, you can see what PumaFast™ and standard materials we stock to get you up and running.
|
|
|
|
Covid-19 has not stopped our ACT! initiatives!
We have successfully collaborated on many ACT! opportunities.
We are delivering on Technology, Design and Education while you can bank on the sales results!
We are virtually taking our ACT!
to another level!
Insulectro and our partners are moving the chains to help our customers exceed performance goals. Our team of professional and technical resources are now offering our customers access to design and education services.
This is a Game Changer!
Our ACT! Initiatives combined with our design and education services provide our customers a total solutions package with a one-stop-shop option.
Our customers now have total access to not only our Insulectro foot print, best in class products, materials on the shelf when you need them; but also the expertise to deliver solutions from design to delivery…FAST!
Call me and to set up a VIRTUAL ACT! with your customer.
There's a reason I'm smiling.
Ron Murdock
ACT! Manager & Technical Account Manager
|
|
To be the easiest company to do business with. . .
Insulectro has a program for continual improvement, all designed to make ourselves as user-friendly as possible to our customers, their customers, and our suppliers. Speed Matters, so we focus a lot of attention on getting you the materials you need as quickly as possible.
Our PumaFast™ Program lists current inventory of everyday materials you need every day.
|
|
Best-in-Class Materials
from our Premier Suppliers
|
|
|
|
|
|
|
