Visit us 13-16 November
 Optimize your profit with
Quality Assurance, Test & Dispensing!
Dear Customers and Business Relations,

With the right machines and tools, you will optimize processes, assure quality and avoid expensive pit-falls – and increase your profit!

Let us help you get there! We have the machines and tools - and the knowledge!

Consider a visit in Munich and give us a call or an email with your interest and planned attendance, in order for us to book time slots for demos/meetings at the specific suppliers’ booths.
Lars Kongsted-Jensen - Director
Henrik Rud - Executive Assistant
Michael Vester  - Account Manager  +45 20983730 +45 20983735 +45 20983733
Please see below for NEWS & HIGHLIGHTS of our machines and tools presented at the exhibition, including supplier booth numbers.

Click on the product headlines for more information. For all our other products, see
DfT, Test Coverage & Documentation - Aster Technologies - A3.352
More than 25 years with Early Design for Test, coverage analysis, coverage measurement/QA, smart Viewing, ECO handling.
Now also system level analysis/viewing and even integration with TestStand/LabView for diagnostics.
Embedded JTAG Solutions - GÖPEL electronic - A3.351
ScanFLEX II: The new JTAG/Boundary Scan Controller : Now also with 19-inch housing for up to 3 independent controllers with separate connectors in 1 HE.
ChipVORX-SI : Future-oriented cloud service-based platform using powerful FPGA-IP for embedded test & in-system programming.
New JULIET Series 3 : Compact electrical test system utilizing embedded board test, functional test, programming and the UUT adaptor/fixture in one box.
TAKAYA APT-1400F (single-sided) and now also APT-1600F (dual-sided)
The world’s most popular, flexible, cost-effective and longest term reliable fixture-less in-circuit test systems in more than 30 years! 
Solder Paste Inspection Systems (SPI) - GÖPEL electronic -   A3.351
SPI Line · 3D
Very fast, world leading, in novative Dual 3D image capturing technology
Also for testing of sinter pastes & Direct Copper Bonded (DCB) substrates
THT Line
 New camera module now enabling 3D inspection of THT solder joints: Inspection of solder flow and solder volume as well as the height determination of THT pins
Automatic X-ray Inspection (in-line AXI) - GÖPEL electronic  A3.351
X Line · 3D
Combined Dual side 3D x-ray and 2D AOI system inspection in one go.
StingRay Detector for maximum PCB layer separation.
Probes - Everett Charles Technologies (ECT) -  A3.149
Probes for in-circuit test - function test - OEM - industrial :
POGO Spring Probes; loaded & bare board probes;  battery p robes;  RF high frequency & high current  probes; semiconductor  test products.
Adhesive Bonding, Dispensing & Potting - Scheugenpflug - A5.525
Dispensing systems
Very accurate, highly material efficient and most easy to maintain dispensing systems for 1 and 2 component materials – bubble-free/vacuum.
Scheugenpflug will present its new “plug-and-produce” processing module.
We look forward to seeing you in Munich - hopefully also at our Nordic/Baltic networking dinner Wednesday evening! 

Best regards,

The EP-TeQ team