Jaro Thermal provides cutting-edge, thermal-cooling technologies that extend the life of electronic components and circuits - across many different industries and applications

Ultra Thin IC Coolers

As power-dense electronics continue to shrink in form factor, the need for high-efficiency, ultra-low-profile thermal solutions has never been more urgent. Rising to meet this demand, JARO Thermal proudly announces the launch of its new Cold-Forged Pin-Fin IC Coolers. Our latest IC coolers feature a cold-forged pin-fin heatsink core paired with a high-performance fan for enhanced thermal management. Built using next-generation cold-forging metallurgy and fine-pitch pin-fin design, the result is uncompromised thermal performance in a compact 13mm profile. The ultra-thin IC coolers are available with aluminum and copper options, maximizing surface area for efficient heat dissipation.

Aluminum vs. Copper: Tuned for Your Needs

JARO’s Cold-Forged IC Coolers are offered in copper for maximum thermal performance (~400 W/m·K) and superior vibration resistance—ideal for high-power, high-density systems. The aluminum version, while offering lower conductivity (~205 W/m·K), is lighter, more cost-effective, and naturally corrosion-resistant, making it well-suited for weight-sensitive and budget-conscious applications.

Offered with Embedded or Mounted Fans for Versatile System Compatibility

JARO’s Ultra-Thin Cold-Forged IC Coolers are Designed for Today's Demanding Applications

Available Now

JARO’s new Cold-Forged Pin-Fin IC Coolers redefine what’s possible in ultra-thin thermal management. Combining low thermal resistance, high durability, whisper-quiet operation, and two powerful material options—these coolers are engineered to keep your most compact and mission-critical systems running cool.

For more information, technical specifications, or to request samples, please visit www.jarothermal.com

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