Join MRSI Mycronic at CIOE 2026

MRSI Mycronic will exhibit at CIOE 2026, September 9-11 in Shenzhen, China, at Booth #10B79. As one of Asia’s leading optoelectronics events, CIOE offers a valuable opportunity to connect with customers and partners advancing optical communications, photonics, and next-generation manufacturing.

At the booth, visitors can learn more about MRSI’s precision die bonding and active alignment platforms, including the MRSI-LEAP Ultra-High-Speed Die Bonder and MRSI-A-L Active Aligner. Interactive AR experiences for the MRSI-705 and MRSI-H will also showcase how MRSI technologies support optical transceivers, silicon photonics, co-packaged optics, and other advanced photonic devices.

Register today to plan your visit.

Infostone Optical Communications Conference (IFOC 2026)


During the same week as CIOE 2026, MRSI Mycronic will also participate in the 24th Infostone Optical Communications Conference (IFOC 2026), held September 6–8, 2026, in Shenzhen, China. Dr. Limin Zhou will present “Packaging Leaps – Driving the AI Optical Modules Revolution” highlighting the packaging defines the optical module performance ceiling, and the process automation determines how fast we reach it; together, they will define leadership in the AI optical interconnect era.

New Feature of the Month: MRSI introduces 300mm wafer capability on its MRSI-705

As advanced packaging evolves toward chiplets, heterogeneous integration, and increasingly complex multi-die architectures, 300mm wafer processing becomes an increasingly important manufacturing platform.


Artificial Intelligence and High-Performance Computing are accelerating the move toward larger packages and heterogeneous integration. Adding 300mm capability to the MRSI-705 gives customers the flexibility to address these emerging applications today while positioning their equipment investment for future growth.


Whether expanding existing capabilities or preparing for next-generation applications, customers can leverage the proven MRSI-705 platform while adding support for larger wafers. Ultimately, this option helps customers maximize equipment utilization, simplify their manufacturing environment, and adapt more efficiently to changing market demands.

Five Years Ago This Month: MRSI Shenzhen Demo Center grand opening ceremony

On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China.

The opening ceremony was accompanied with a speech by local management, a ribbon cutting event, and an auspicious lion dance show. The MRSI Product Demonstration Center is located at Room 101, Block A, Huahan Innovation Park, Langshan Road, Nanshan District, Shenzhen. It is equipped with MRSI’s latest equipment and staffed by experienced application engineers, the demo center also provides process development and prototyping services.

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Meet MRSI Around the World

From advanced packaging and semiconductor manufacturing including active alignment, dispensing to photonics and optical communications, MRSI Mycronic will be participating in industry-leading events across North America, Europe, and Asia from August through November 2026. We look forward to collaborating with customers, partners, and industry colleagues to discuss the latest manufacturing challenges and technology trends.


MRSI-LEAP Wins CFCF2026 “Most Influential Product Award”

The 11th CFCF Optical Connectivity Conference was held in Suzhou from June 25–27, 2026. During the event’s annual awards ceremony, MRSI Automation (Shenzhen) Co., Ltd. received the Most Influential Product Award for MRSI-LEAP Ultra-High-Speed Die Bonder. MRSI-LEAP was recognized for its technology leadership, value in high-volume production, and proven capabilities for the optical communications applications.

AI's Unstoppable Momentum: Why the Artificial Intelligence Boom Is Here to Stay—Insights from the Optica Executive Forum & OFC

Why the Artificial Intelligence Boom Is Here to Stay—Insights from the Optica Executive Forum & OFC

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