Read our Latest Article in Chip Scale Review Magazine
High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions
The demand for data and bandwidth continues to expand, resulting in the requirement for high-volume manufacturing (HVM) of photonics devices at unprecedented levels. This expansion, with double-digit growth rates, is driven by data consumption from cloud computing, web and mobile-based applications and storage through hyperscale data centers (e.g., Facebook, Google, Microsoft, Amazon). The data bandwidth demand from individual consumers and enterprises creates the need to upgrade long haul networks, metropolitan communication systems, and data centers.
One key photonic device component requiring HVM is the chip-on-submount (CoS). CoS devices present some unique manufacturing challenges. Application specific die bonders have evolved over decades to address the current manufacturing demands of CoS. This article reviews the required features of a successful HVM die bonder of CoS devices.
We are exhibiting at CIOE in September. Please visit our host CYCAD Century and Science Technology's Booth #1C66. CIOE is the flagship annual event for the optoelectronic industry.
We are also exhibiting at ECOC in Gothenburg, Sweden. Stop by MRSI Booth #114 to learn more about our die bonding and dispense solutions. We look forward to seeing you at the shows!
