Volume XLIX | July 2019
MRSI Systems, a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional die bonding systems, demonstration capability was officially opened at the Mycronic Demonstration Center in the Nanshan District, Shenzhen, China. ICCSZ News visited the demonstration center and learned about the current status of MRSI Systems and the application of MRSI-HVM3 placement equipment on May 15th.

Dr. Zhou Limin, Senior Director of Strategic Marketing at MRSI Systems introduced the exhibition center which was established to provide an opportunity for the Chinese optoelectronics industry to fully understand the detailed performance of MRSI-HVM3. Through live demonstrations, users can understand the packaging process capability of MRSI's flexible, efficient and high-precision placement equipment. Interested companies are invited to visit, MRSI-HVM3 is available for on-site demonstration, and welcome companies to carry samples for proofing and testing by appointment.

This offers existing and prospective customers in China the opportunity to review the detailed performance capability of the MRSI-HVM3 in a local setting, supported by MRSI's world-class local application engineers for a quick turn-around of product demonstration and die bonding sample building.

If you need to visit the MRSI Systems die bonding solution at the MRSI Mycronic Shenzhen Demonstration Center, or if you are interested in sample proofing or testing, please contact MRSI Systems ( sales@mrsisystems.com ). MRSI has extended product configurations including HVM3e , HVM3P, H3TO, and H3LD, which are based upon the same design as HVM3, but configured specifically for local top heating, in-line conveyor CoB, AOC and gold-box packaging, WDM & EML TO-can packaging, and high power laser diode packaging.
MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 21st China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our partner CYCAD Century Science and Technology (Booth #1C86) in Shenzhen, September 4-7, 2019. MRSI will be demonstrating the MRSI-HVM3 family capabilities including high-speed, high-volume manufacturing without compromising flexibility, accuracy, or reliability.

CIOE is known as the world’s most influential optoelectronic exhibition. Over 1,650 exhibitions and 60,000 visitors from 65 countries are expected including the world leading optoelectronic manufacturers to display their latest products and technologies. The CIOE Conference is a great opportunity to learn about the latest technology innovations. Optoelectronics industry topics highlighted such as data centers, optical communications, 400G, 5G wireless, optical manufacturing, optical fiber sensing, AR/VR, LiDAR, infrared applications, laser technologies, etc.
MRSI Blog - Insights into the Advanced Electronic Packaging Industry 
NEW PRODUCTS
MRSI-HVM3 FAMILY
3-MICRON DIE BONDERS
NEW PRODUCTS
MRSI-H3 FAMILY
3-MICRON DIE BONDERS
 MRSI Systems | 978-667-9449 |  sales@mrsisystems.com