Ultra HDI e-bulletin -- May 2023
ASC now has the capability to fabricate ultra HDI technology, providing feature sizes well below what is achievable with traditional subtractive etch processing. We are reaching out to industry experts to ask for their opinions and advice on how to best take advantage of these new capabilities.
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Featured Interview
Stephen V. Chavez, Senior Product Marketing Manager - Siemens


Stephen V. Chavez (Steph) has 30 years of Design experience that includes multi-layer rigid, flex, rigid-flex and hybrid PCBs containing analog, digital, RF, mixed signal, high speed, high power and HDI technologies.  

As Chairman of the Printed Circuit Engineering Association (PCEA), Steph serves as head of an international member-driven industry organization. He is also a Master Instructor Trainer (MIT) for the IPC Designer Certification program (CID and CID+) and for the PCEA Education program. 
Industry awareness of ultra HDI is growing, and a significant share of the market is looking into designing with these ultra-fine features. Why do you feel that this new technology is important to the industry?

Of course it is important! As packages get smaller and smaller, the only way to design is with something that allows you to enable that reduction in size. As technology advances, we must adapt to that evolution. Once a new technology has proven that it can function and can be produced in quantity, we need to acquire the skills to design for it. 

Skillset starts with mindset: we must keep our minds open to new techniques. We are always looking to design better – for improved performance, lowered costs, increased durability. This is not done blindly in one leap: tap into existing expertise. The CHIPS Act funding will start coming to fruition over the next three years, and designers should take this time to get ready for the new opportunities that new technologies will open up.

Ultra HDI isn’t that new: we are taking what has developed in the chip world and moving it into the PCB realm. I have found that it is easier for a PCB designer to learn the skillset of chip design than vice versa. The best analogy: as a chip designer, you create one building on a city block…as a PCB designer, you create the whole city. 

What key information points are critical to shortening the cycle for adoption - to more quickly begin taking advantage of the benefits of ultra HDI?

Using newer technology can be an energy shot for your whole team. 
If you want to fly, you have to step off the ledge.  The first step is the most critical, and the hardest route to trace is the first one. You must try new technology like Ultra HDI, but don’t do it blindly or go off half-cocked. Avoid going off in the wrong direction. Don’t just read a white paper and run with it, or you will get repeated mistakes. This will generate negative impressions of the new technology. 
 
When you first use a new technology like UHDI, stay within the pocket for success.
Newer isn’t always better for a particular project. The Marines say, “don’t run, but walk expeditiously”. Designers must move with purpose in a controlled fashion, remaining adaptable despite being at the pressure point.

Communicate with your customer: work out an agreement for use of newer technology that spells out the incentives for them – the real value in getting to market faster, enhanced performance, competitive advantage, etc. Be smart in your approach. 

As a Design expert that has navigated through multiple waves of technology advancements, what advice to you have for those who are looking at learning new techniques?

Remember that customers - and many employers - are not inclined to pay for education about technologies for the future; they don’t want to incur expense unless a project is at hand. There are rarely budgets for experimentation. However, when they want the advantages of new technologies, they expect you to be ready. As a professional, you need to make the investment in learning – for yourself and your career.
Here is how I become conversant in new techniques:
 
·        Stay in sync with the industry.
Read the publications, subscribe to company newsletters, monitor LinkedIn, and follow individuals – to see the topics they are addressing, and where they are speaking. Maintain an awareness of what is coming, and know who to contact for information.
 
·        Call your fabricator.
They have a direct vested interest in your success, for the projects you are working on today, and in the future. 
 
·        Tap into your network. Building connections isn’t just for job-hunting: it is for learning. 
Talking with people about their experience with a technology helps you avoid mistakes. That is worth a conversation!

·        Participate in free educational activities like webinars, and onsite events like Chapter expos. Then you will know which fee-based events will hold the most value for you.

What are your outside interests - the hobbies that help you reboot?

I volunteer for the Marine Corps League - fundraising for fellow armed forces members, as well as for the community. I also coach the Robotics team for a local school (grades 7-12).

Early in my career, my focus was on my job. Now I really value my free time, and my focus is on family.
My favorite activity is spending time with my daughter and my wife, and our hobby is home improvement.

A personal epiphany led to my belief that everyone should ask themselves these questions about any activity – inside and outside work: What am I doing here? How does it relate to what I ultimately want in life? What is it costing you? Make sure that whatever you are doing makes sense for you. Don’t let life happen to you - make things happen for you.
Technology Highlight
Are you questioning how to take advantage of the benefits of ultra HDI feature sizes when routing BGA escape areas and still maintain target impedance? Eric Bogatin has put together a white paper addressing this topic and we are always available to answer any questions!

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Utilizing Fine Line PCBs with High Density BGAs

The future is here, today! Ask how we can enable new Design freedoms for your work on Defense, Medical, and Commercial applications: contact our Director of Quality John Johnson at jjohnson@asc-i.com
Frequently Asked Questions
Q: Can outer layers and plated through holes be created with A-SAP™?
A: Yes. You can confidently design a PCB with ultra-HDI features on outer layers and connect with reliable plated through holes, using the A-SAP™ process.

Q: Reliability: are PCBs made with A-SAP™ as reliable as those fabricated with traditional processes?
A: Yes. The Averatek Semi-Additive Process (A-SAP™) is a proven and tested additive fabrication method to achieve next-generation advancements. Contact us for more information.
Our Experts are one reason why American Standard Circuits is North America's leading independent PCB fabricator. Our entire experienced and professional team is ready and able to make your next PCB project a reality!