5G infrastructure will require ultra-high bandwidth, latency up to 1 ms, and highly reliable connectivity. In addition, RF architectures need to be scalable, efficient, and extremely compact. This requires densification not only at the macro level with the installation of more base stations but also high-power density at the device level.
5G macro stations will be dominated by a large-scale array antenna with 64 channels, and the power amplifier demand for a single base station will be as high as 192 channels (196 units power amplifier devices). The demand for the RF PA devices in 5G networks is a few times higher in unit volume compared to that in 4G networks.
The 5G devices are more cost sensitive than ever, which needs higher speed manufacturing equipment to reduce cost. Die bonding is an essential element in the manufacturing of these devices. MRSI-705 flexible die bonder high-volume configuration was recently introduced to target RF power amplifiers and microwave applications, as well as some photonics device applications.
