Volume XLI | November 2018
This Month:
  • MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
  • Customer Support
  • Trade Show News
  • Blog Insights
MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
MRSI-HVM3 Die Bonder
MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China. MRSI will be offering local demonstrations of its market leading MRSI-HVM3 die bonder and also die bonding applications using customer's sample materials, by arrangement. 
 
This offers existing and prospective customers in China the opportunity to review the detailed performance capability of the MRSI-HVM3 in a local setting, supported by MRSI's world-class local application engineers for a quick turn-around of product demonstration and die bonding sample building. The MRSI-HVM3 product family delivers industry-leading speed, future-proof high precision (<3 micrometers), and superior flexibility for true multi-process, multi-chip, high-volume production. The superior performance is enabled by dual head, dual stage, integrated "on-the-fly" tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations.
English
MRSI Systems(Mycronic集团)宣布在其位于深圳龙华的姐妹公司,深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料,安排并提供我们市场领先的MRSI-HVM3产品的本地演示以及 芯片 贴装应用。

这为中国现有和潜在的客户提供了在中国国内直接评估MRSI-HVM3详细性能的机会,我们有世界一流的本地应用工程师提供技术支持,以实现快速的产品演示和芯片贴装的样品制造。MRSI-HVM3产品系列提供业界领先的速度,面向未来的高精度(<3微米),以及真正的多工艺,多芯片,大批量生产的卓越灵活性。其双机头、双共晶焊接台、零时间吸嘴转换系统的配置,超快速共晶焊接温度的升降以及多层次多功能并行工艺自动化处理实现了MRSI-HVM3产品系列卓越的性能。
Chinese
Customer Support, Preventative Maintenance, Service Contracts, and Training Programs
MRSI Systems offers a variety of service contract options to provide fixed cost material, labor and expenses for machine repairs. In addition, we offer preventative maintenance and calibration programs to ensure your machines are operating at top efficiency. Our comprehensive training programs offer a cost efficient solution to our customers from basic operator training to more advanced programming.

Please have your system serial number available when you call for service so that we can continue to
provide optimal customer service using our CRM system. We are dedicated to learning more about our customers and how to better serve you.

MRSI On-Site Training Programs

Based at our North Billerica, Massachusetts, US headquarters, MRSI offers a comprehensive set of
training programs covering our family of products. Led by experienced engineers, the programs are
tailored to suit each customer’s needs, including concepts of robot orientation, teaching alignments,
the die bonding process and production set up.

The sessions are run over a 3 to 5 day period depending on the specific program. These are hands-on
training programs and attendees will learn the following key features of our products:

1. How to program your die bonding and epoxy dispensing systems e.g. how to teach a waffle pack and teach a tip to perform tasks.
2. The major features of our software platform common to our systems including the intuitive Windows™ interface and how it simplifies the set-up and production process.
3. How to access the library of waffle pack and die.
4. How to set up calibration routines.
5. How to turn a simple machine into a powerful tool to allow die and placement locations to be taught for use in the future.
6. Ability to use die in multiple programs and to reteach easily.
7. Alternate die capability allowing the system to automatically switch between alternate vendors of die.
8. Our sophisticated advanced vision systems, enabling rapid detection and orientation of die over a full 360°.

These training programs can also be run at a customer’s site. Please contact our service department at service@mrsisystems.com or call 978-667-9449 for details on service contracts and these programs.
Trade Show News
MRSI Systems will be exhibiting at SPIE Photonics West , February 5-7, 2019 at The Moscone Center in San Francisco, California. SPIE Photonics West is the leading global event for the photonics and laser industries. There is expected to be 1,300 exhibitors and over 20,000 attendees. Please visit the MRSI Booth #4320. We look forward to seeing you in San Francisco. Request a meeting with MRSI Systems at SPIE Photonics West. Learn about the upcoming events MRSI Systems will be attending.

Learn more about MRSI's latest products including the MRSI-H3LD which is optimized for bonding large dies for high power diode lasers, that are used in advanced photonics such as industrial lasers, optical fiber amplifications, lighting, and sensors. The MRSI-H3LD die bonder carries key technological building blocks from our field proven flexible high speed MRSI-HVM3 platform for industry leading throughput, superior flexibility, and future-proven 3 micron placement accuracy. It enables our high power diode laser and other photonics customers to scale up their business.
Blog Insights
MRSI Blog - Weekly Insights into the Advanced Electronic Packaging Industry 
  • Case Study: The Latest Die Bonding Solutions for Photonics Manufacturing
  • Photonics Manufacturing for the Hyperscale Data Center Era
  • Featured Article Laser Focus World: Challenges for photonics manufacturing in the new center data era
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MRSI-HVM3 Die Bonder
NEW PRODUCTS
MRSI-HVM3 FAMILY
3-MICRON DIE BONDERS
NEW PRODUCTS
MRSI-H3 FAMILY
3-MICRON DIE BONDERS
MRSI-705
MRSI-705
5-MICRON DIE BONDER
MRSI-175Ag
EPOXY DISPENSER
MRSI-M3
3-MICRON DIE BONDER
MRSI-M1
1-MICRON DIE BONDER
 MRSI Systems | 978-667-9449 |  sales@mrsisystems.com  
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