High Volume Manufacturing of Photonic Devices: Assembly Starts with Design
Volume XXX | November 2017
MRSI Systems
MRSI Newsletter
MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative
Billerica, Mass., Oct, 6, 2017 MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, has been awarded new funding by the Baker-Polito Administration as part of a recently announced commitment to invest in the Manufacturing USA program. Governor Baker recently awarded $7M in funding through the Massachusetts Manufacturing Innovation Initiative (M2I2,) which will support advanced manufacturing projects in integrated photonics, robotics, and flexible-hybrid electronics. MRSI Systems’ project affiliated with AIM Photonics was one of the 7 advanced manufacturing projects funded. The State of Massachusetts funding supports R&D projects in advanced manufacturing.

The Administration has committed more than $100 million in funding over five years to the M2I2 effort, which provides a vehicle for the Commonwealth to invest in the Manufacturing USA program and advance innovation and job growth through cross-collaboration among companies, universities, national labs, government, incubators, accelerators, and other academic/training institutions.

MRSI’s award will allow it to invest significant resources alongside its collaboration partner, the American Institute for Manufacturing Integrated Photonics (AIM) to further develop advanced manufacturing capabilities in the photonics sector.

"We are honored to be chosen as a recipient of this award," said Michael Chalsen, President of MRSI. "This is an opportunity to bring world-class manufacturing innovation to our markets. It reflects Massachusetts' commitment to fostering the long-term growth of the state's advanced manufacturing projects.”

About MRSI Systems:
MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput, and uptime by building systems that use our unique expertise. In summary, this includes our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing, and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable for R&D prototyping, pilot production and high volume manufacturing. Our solutions deliver the best financial returns in the industry while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom (Data Center), Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. We are headquartered in Billerica, MA in the greater Boston area. Our sales are supported by a global network of direct service and support professionals, located in China, Taiwan, Singapore, Korea, Thailand, Malaysia, the Philippines, Israel, Europe, United Kingdom, and the United States. 
High Volume Manufacturing of Photonic Devices:
Assembly Starts with Design
The explosive growth of internet traffic demands higher bandwidth in data communications. High volume manufacturing of photonic devices is crucial to meet this demand, particularly fueled by hyperscale data centers. Further integration of photonics and electronics will pave the way for other emerging applications such as LiDAR, sensors for VR/AR, etc.

The unprecedented need for a high volume of photonic devices presents unique challenges in manufacturing. This was one of the key topics in the 1st World Technology Mapping Forum held in s’Hertogenbosch, The Netherlands, in June this year. Over 170 experts from 17 countries/regions attended the conference. MRSI Systems’ VP of Product Management, Dr. Yi Qian, co-chaired the Assembly Technical Working Group (TWG) Meeting and then presented the team’s findings and participated in the panel discussion. Dr. Qian also presented the earlier studies on behalf of the Assembly TWG of The Integrated Photonic System Roadmap (IPSR) initiative / AIM Photonics Academy, where he is also the TWG co-chair.
Read More
MRSI Blog - Weekly Insights into the Advanced Electronic Packaging Industry 
  • Challenges and Solutions in the Photonics Packaging Industry
  • Epoxy Deposition – Requirement for High-Volume Manufacturing (HVM) of Chip-on-Submount (CoS)
  • Case Study – Leading Photonic Component Manufacturer Selects MRSI Systems to Produce Photonic Components Faster
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