We have recently added the new TS8100 Series Positive Displacement Progressive Cavity (PC) Pump to our product range.
Designed to dispense a diverse range of fluids, this pump is manufactured by Techcon, and uses a unique method, with a special stator and rotor design to create an accurate and consistent dispensing output.
The high precision TS8100 system is ideal for use with a variety of applications and industries including: optical bonding, conformal coating, potting applications and encapsulation.
Our Product of the Month is the brand new epoxy resin PX901C from Robnor ResinLab which offers end users high electrical insulation, low shrinkage and has an exceptionally good operating temperature of up to 200°C.
This rigid, two component thermally conductive resin has excellent heat resistance, processability and dimensional stability.
Available in beige or black, the PX901C can be purchased in bulk, as a twin pack or as a kit.
The PX901C from Robnor ResinLab is WEEE / RoHS / REACH Compliant whilst remaining very easy to work with.
Flip Chips provide a way to miniaturise and speed production of electronic devices, as well as increase performance.
Since Epoxies are used almost universally with flip chips to improve reliability of construction, we have an extensive range of epoxies available to suit varying needs.
Depending on the application, different epoxies and methods of application can be used to maximise efficiency and quality including underfill epoxies, edge bonding, UV curing adhesives and no-flow epoxies.
