Volume LXIV | January 2021
Die bonding systems enable the groundbreaking digital transition.

5G is expected to fundamentally alter the way we connect and communicate, because it has the capacity to connect everyone with everything - including devices, objects and machines. A key element in realizing the full potential of 5G is the shift to a new, decentralized infrastructure that ensures ultra-low latency in the communication between all these devices, objects and machines. In this article we explain the significance of 5G and how MRSI’s technology is enabling the launch of products and services to support the adoption and global expansion of 5G. 
 
Photonics West
  • March 6-11th, 2021
  • Online Event
Laser World of Photonics China
  • March 17-19th, 2021
  • Hall W2 Booth #2587
  • Shanghai New International Expo Centre
  • Shanghai, China
MRSI Blog - Insights into the Advanced Electronic Packaging Industry 
MRSI-HVM FAMILY
1.5-MICRON DIE BONDERS
MRSI-H FAMILY
1.5-MICRON DIE BONDERS
 MRSI Systems | 978-667-9449 | sales.mrsi@mycronic.com