A panel of renowned experts will discuss the state of art in plasma processing including high and low pressure processing limitations, advanced plasma excitation and reactor control, and tools and requirements for the fabrication of leading edge devices. Further topics include plasma-assisted deposition and etching of advanced films and new materials, plasmas for atomic layer deposition and etching, very fine line plasma etching and deposition, fundamental limits of plasma processing, and new and evolving applications.

Panelists:

Richard A. Gottscho, Executive Vice President, Lam Research Corporation, USA

Vincent M. Donnelly, Professor, Dept. of Chemical and Biomolecular Engineering, University of Houston, USA

W.M.M. (Erwin) Kessels, Professor, Dept. of Applied Physics, Eindhoven University of Technology, The Netherlands

Jianping Zhao, Technical Director, Tokyo Electron, USA