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Call for Papers!

2025 IEEE International Workshop on Advanced Interconnects

Welcome to WAI 2025! This is the second IEEE International Workshop on Advanced Interconnects (WAI) to be held in Ningbo, China, Nov. 5 to 7, 2025. The workshop will specifically address the latest development and innovations in signal integrity (SI)/power integrity (PI) and electromagnetic interference (EMI) of advanced interconnects, including integrated circuits, IC packages, PCB, and cable connector etc., and will serve as a broad exchange platform for both academia and industry.

You are warmly invited to submit an abstract paper (1 page) or full paper (2–3 pages) on your latest research results. Accepted abstract papers or full papers will be published on IEEE Xplore. We also solicit proposals for special sessions, industrial forums and tutorials.

Technical Topics

The topics include but not limited to the following technical areas:

• Interconnects: High-Speed Interconnect Design and Optimization, Interconnect Modeling and Extraction
• Simulation and Modeling Techniques for SI/PI/EMI
• Multiphysics Modeling
• Power Delivery Network and Decoupling
• Radio Frequency Interference Problems
• SI/PI/EMI at Chip/Package/System Level
• SI/PI/EMI for Chiplets
• SI/PI/EMI Co-Design
• Artificial Intelligence-Assisted EMC/SI/PI Related Methodologies
• Tools and Methodologies: Jitter/Noise/Crosstalk/BER Budgeting, Analysis, and Measurement
• Others: Radio Frequency, Antenna, etc

Important Dates

➤ Full Paper Submission: Sep. 30, 2025

➤ Abstract Paper Submission: Sep. 30, 2025

➤ Notification of Full Paper Acceptance: Oct.15, 2025

➤ Notification of Abstract Paper Acceptance: Oct.15, 2025

➤ Final Paper Submission: Oct. 20, 2025

Please Note: If you need an invitation letter for a visa application, contact conference@detooltech.com

Submission Instructions:

Abstract paper is limited to 1 page, and full paper is limited to 2–3 pages. Both Abstract papers and full papers must follow IEEE conference paper templates.

Special Session or Workshop/Tutorial:

Please send your proposal directly to

conference@detooltech.com



Authors of high-quality abstract papers or full papers will be invited to submit the extended papers to the IEEE Transactions on Signal and Power Integrity!

General Chairs

Jun Fan

DeToolLIC Ltd., China

Er-Ping Li

Zhejiang University, China

Technical Program Committee

Xianong Ye

Intel USA

Bo Pu

DeToolLIC Ltd., China

Ling Zhang

Zhejiang University, China

Publication Chair

Siping Gao

Nanjing University of Aeronautics, China

Organizing Committee Chair

Hanzhi Ma

Zhejiang University, China

Contact

Qiusen He, Yidan Hu

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