November 2025

• EMEA Demo Center at Distek Has Been Relocated 

• MRSI Spotlight: Gaurav Mishra, Mechanical Engineer

• MRSI Service Contracts

• Upcoming Events – SPIE Photonics West, Asia Photonics Expo 

• Blog Insights

• 5 Years Ago This Month

EMEA Demo Center at Distek Has Been Relocated 

We are pleased to announce the recent reopening of our demonstration center at the new premises of our distributor, Distek Strumenti & Misure Srl, in Naples, Italy. The upgraded facility now features an MRSI-705—a 5-micron die bonder—available for demonstrations, along with a range of complementary process equipment. To schedule a demonstration at the new location, please contact us.

MRSI Spotlight: Gaurav Mishra, Mechanical Engineer 

Gaurav Mishra is an accomplished Mechanical Engineer at MRSI Mycronic, who has been working at MRSI for more than six years and has two decades of industry experience and advanced proficiency in mechanical design to drive innovation and deliver excellence for our customers.


Gaurav’s journey from India to Boston is a testament to his determination and global perspective. Driven by a passion for cutting-edge technology and a desire to make a meaningful impact in the field of precision engineering, Gaurav chose to join MRSI because of the company’s reputation for innovation, collaborative culture, and commitment to excellence. His decision was also influenced by the opportunity to work alongside industry leaders and contribute to projects at the forefront of semiconductor manufacturing.


Since becoming part of the MRSI team, Gaurav has played a pivotal role in advancing product capabilities and streamlining design processes. His unique background brings valuable diversity to our engineering solutions, enabling MRSI to address complex challenges with fresh insights and creative problem-solving approaches. Gaurav’s contributions have not only enhanced system performance and reliability but have also helped strengthen our organization’s position as a leader in the industry.


With an extensive foundation in project management, product design, special purpose machine (SPM) development, reverse engineering, and value analysis/value engineering (VAVE), Gaurav has made significant contributions to the MRSI team. His involvement encompasses the design of high-precision SPMs, micro-robotic systems, wafer handling equipment, and sophisticated solutions for semiconductor die bonding and laser/eutectic bonding processes.


Gaurav’s practical expertise includes the construction of proof-of-concept prototypes using both conventional machine tools and state-of-the-art 3D printing technologies, facilitating quick development cycles and reliable product delivery. He is highly skilled in computer-aided engineering, applying simulation and analysis techniques across diverse platforms to optimize mechanical, fluid, and thermal performance.


Central to his professional philosophy is a strong commitment to quality and collaborative teamwork. Gaurav routinely partners with multidisciplinary groups, employs design for manufacturing (DFM) and failure mode and effects analysis (FMEA) principles, and coordinates closely with product management to ensure every solution meets client requirements. His capability in engineering documentation and mastery of product data management (PDM) systems ensures each project is managed with accuracy and transparency.


Dedicated to continuous improvement, Gaurav actively pursues advancements in design, materials research, and emerging technology trends, consistently striving to enhance system reliability and performance. With experts such as Gaurav on our team, MRSI is uniquely equipped to deliver both cutting-edge machinery and outstanding partnership and support across all stages of the customer engagement process. 

MRSI Service Contracts

MRSI has revamped its service contracts. The new offerings retain the three-tiered structure – Silver, Gold and Platinum packages, but with updated pricing and services based on customer feedback. Our service contracts ensure the timely resolution of machine stoppages and keep customers’ production lines running 24/7. They give peace of mind to every production team in today’s ever demanding business environment. For details, please contact your regional salesperson. 

Upcoming Events

SPIE Photonics West 2026

Exhibition Dates: January 20-22, 2026


Location: San Francisco, California, US


Booth: #5145


Learn more: https://spie.org/PW

Asia Photonics Expo (APE)

Exhibition Dates: February 4-6, 2026


Location: Sands Expo and Convention Centre, Singapore


Booth: #B214

 

Learn more: Asia Photonics Expo - APE 2026

Blog Insights

MRSI’s capabilities in fluxless Au/Sn soldering applications

Fluxless soldering, especially with 80/20 Au/Sn ribbon and preforms, is a critical process in advanced electronic packaging where reliability and cleanliness are paramount. While soldering without flux is widely considered difficult, MRSI has distinguished itself as a leader in enabling efficient, repeatable, and high-quality fluxless Au/Sn soldering through its innovative equipment and process control expertise.


MRSI-H1: Comprehensive High-Precision Die Bonding Solutions

In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its ultra-precision 1-micron flip-chip die bonders. These machines are not only flexible and fast, but also ideal for a wide range of applications.


What is the significance of co-planarity in die bonding?

At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking. Ensuring co-planar surfaces is crucial for the performance of vertically integrated devices, as it affects pad/pillar contact. Optimizing planarity involves specific variables, especially in die stacking and copper pillar processes where bonding surfaces must be co-planar.

5 Years Ago This Month:

Mycronic technology essential in 5G development

Die bonding systems are required for the groundbreaking digital transition. 5G is expected to fundamentally alter the way we connect and communicate, because it has the capacity to connect everyone with everything - including devices, objects and machines. A key element in realizing the full potential of 5G is the shift to a new, decentralized infrastructure that ensures ultra-low latency in the communication between all these devices, objects and machines. In this article, let us explain why this is so important and how Mycronic technology is an essential component to the global roll-out of 5G.

MRSI Mycronic logo RGB.jpg

554 Clark Road, Tewksbury, MA 01876 • +1 978 667 9449


mrsi.mycronic.com

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