Eutectic bonding is an area of particular interest in photonics, microwave and RF electronics, due to the need for a clean, highly thermally efficient process and for long-term reliability. Increasing demand for data and bandwidth requires high-volume manufacturing of these electronic packages at a level never seen before. This article presents the most recent advances in the area of automated eutectic bonding for volume production. These advances result in higher precision, throughput, and yield for existing and new products assembled by component and module manufacturers.

Photonics and RF electronics have always been on the frontier of network infrastructure expansion. The on-going the transition from 10Gps to 40Gps followed by  100Gps/200Gps/400Gps optical network systems has enabled an array of new generations of photonic components, such as laser chip-on-submount (COS), micro-iTLAs, 100G/200G/400G modulators, intradyne coherent receiver (ICR), 100G CFP2-ACO, and QSFP28+ transceivers. In addition, wireless base station build-out requires  critical components, such as RF power amplifiers, made with GaAs or GaN. Most of these products have multiple die bonded on a common platform or base plate inside a metallic package.

(read article here)