For Dispense and Assembly
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| Die Bonding of Silicon Photonic Devices |
AOC and Silicon Photonic Require Unique Solutions
Silicon photonics is an evolving technology in which data is transferred via light. Photons can carry far more data in less time than electrons providing scalable solutions for expanding data communication needs worldwide.
These next generation of devices present unique challenges to meet the increasing demands. While the challenges are new, volume manufacturing can be achieved using established automation solution for advanced packaging.
Common requirements include ultra-high precision placement,
in-situ UV curing, advanced vision algorithms, delicate force sensing, material traceability, automated material handling, eutectic bonding, precision dispensing and stamping. MRSI Systems is a leading provider of systems for such applications. The photo below shows the MRSI-M3 Ultra-Precision Assembly Work Cell configured for the assembly of photonics devices.
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| Happy Holidays & Ringing in a New Year |
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Thanks to our loyal customers for a successful year!
MRSI Systems has just surpassed 30 years of providing some of the most advanced die bonding and dispense systems in the world. Our thanks go out to our many loyal customers, dedicated employees and vendors for making 2014 one of our most successful and enjoyable years yet.
We look forward to new challenges in 2015 providing even more new and exciting automated solution for photonics packages, microwave and RF modules and other advanced packaging solutions, including thermocompression bonding..
We have a full trade show schedule including Semicon China, OFC, IMAPS New England, IEEE/MTS, ECTC, Semicon West, Opto China, IMAPS 2015 and Productronica. You are always welcome to come visit us at our Billerica factory. Contact us with your dispensing and assembly challenges. Chances are we have already solved them!
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