Please join us on May 4th, 2022 at 10:00 am PST
Solving the Interconnect Density Bottleneck
in 51.2T Switches
With the first generation of 51.2T switches running at 100 Gbps per lane on the horizon, the market will soon be considering the pros and cons of different board design choices for managing so many high capacity channels. Will co-packaged optics (CPO) or near-packaged optics (NPO) scale to meet the bandwidth density challenge?
On May 4th, we feature Dr. Rebecca K. Schaevitz, COBO Board Member and Principal Engineer/Product Line Manager at Broadcom. She will discuss the potential for SiPh Chiplets In Package (SCIP) optical engines for driving next-generation data center connectivity.
We will also hear from Tom Mitcheltree, Advanced Technology Manager at US Conec, a supplier of connector embodiment packages based on standardized and custom optical interconnect ferrules.
